IP Library › Granted Patent US 9,567,669
Granted Patent B2
US 9,567,669 · App. 14/957,548 · Granted Feb 14, 2017

Chemical vapor deposition apparatus and method of manufacturing light-emitting diode device using the same

Inventors: Seong-Joon Cho (Osan-si, KR); Hyun-Su Cho (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
C23C16/4412H01L21/68764H01L21/68771H01L33/005
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Quick Facts
Patent No.
US 9,567,669
App. No.
14/957,548
Granted
Feb 14, 2017
Kind
B2
Abstract

An embodiment includes an apparatus, comprising: a chamber; a main disk that is rotatably disposed in a chamber and configured to receive a substrate; a gas supply unit configured to supply a process gas to the chamber; a gas collector unit including a gas exhaust channel separate from the main disk and vertically lower than the main disk; and a skirt unit disposed on a peripheral portion of the main disk and configured to reduce turbulence of the process gas flowing to the gas collector unit.

Claims (25)

1. An apparatus, comprising:

a chamber;

a main disk that is rotatably disposed in a chamber and configured to receive a substrate;

a gas supply unit configured to supply a process gas to the chamber;

a gas collector unit including a gas exhaust channel separate from the main disk and vertically lower than the main disk; and

a skirt unit disposed on a peripheral portion of the main disk and configured to reduce turbulence of the process gas flowing to the gas collector unit.

2. The apparatus of claim 1 , wherein:

the skirt unit comprises a flat surface substantially parallel to a surface of the main disk, and a curved surface connected to the flat surface and curved towards the gas exhaust channel; and

the flat surface of the skirt unit is substantially parallel to the flow of the process gas flowing from the gas supply unit to the gas collector unit.

3. The apparatus of claim 1 , wherein the skirt unit is configured to reduce turbulence of the process gas flowing from the gas supply unit to the gas collector unit.

4. The apparatus of claim 1 , wherein the skirt unit is configured to remove parasitic deposition materials between the main disk and the gas collector unit when the skirt unit rotates.

5. The apparatus of claim 1 , wherein:

the skirt unit has an annular shape; and

the gas exhaust channel of the gas collector unit has an annular shape and is disposed in a peripheral portion of the skirt unit.

6. The apparatus of claim 1 , wherein the gas collector unit comprises a lower collector disposed under a peripheral portion of the skirt unit, an upper collector separate from the skirt unit and corresponding to a sidewall of the chamber, wherein the gas exhaust channel is disposed on the lower collector between the skirt unit and the upper collector.

7. The apparatus of claim 6 , wherein an inner wall of the upper collector includes a sidewall of the chamber and the sidewall is curved towards the gas collector unit.

8. The apparatus of claim 6 , further comprising a protrusion member disposed on the skirt unit, the lower collector, or the upper collector adjacent to the gas exhaust channel.

9. An apparatus, comprising:

a chamber;

a main disk disposed in the chamber;

a gas supply unit configured to supply a process gas to the chamber;

a gas collector unit disposed along a periphery of the main disk and configured to receive the process gas; and

a skirt unit disposed between the main disk and the gas collector unit, and curved towards the gas collector unit.

10. The apparatus of claim 9 , wherein the gas collector unit comprises a gas exhaust channel disposed substantially continuously around the skirt unit.

11. The apparatus of claim 10 , further comprising a protrusion disposed adjacent the gas exhaust channel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2016
From: CHO, SEONG-JOON; CHO, HYUN-SU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 040124/0381 →
Priority Claims (1)
KR 10-2014-0173232 · Dec 4, 2014 · national
Continuity (1)
Related Publication 20160160349A1 · Jun 9, 2016