Dry film for optical waveguides, optical waveguide using same, photoelectric composite wiring board using same, and method for producing photoelectric composite wiring board
The present invention relates to a dry film for optical waveguides, obtained through sequential stacking of a carrier film, a plating adhesion layer, an uncured cladding layer and a cover film. Solid microparticles are dispersed in a resin composition that constitutes the plating adhesion layer.
1. A dry film for optical waveguides, which is obtained through sequential stacking of a carrier film, a plating adhesion layer, an uncured cladding layer and a cover film,
wherein solid microparticles are dispersed in a resin composition that constitutes the plating adhesion layer, and
an average particle size of the solid microparticles ranges from 0.4 to 5 μm.
2. The dry film for optical waveguides according to claim 1 , wherein the resin composition that constitutes the cladding layer is a photocurable resin composition.
3. The dry film for optical waveguides according to claim 1 , wherein the resin composition that constitutes the plating adhesion layer is a resin composition that is photocurable and has ultraviolet ray transmissivity.
4. The dry film for optical waveguides according to claim 1 , wherein the thickness of the plating adhesion layer ranges from 1 to 10 μm.
5. The dry film for optical waveguides according to claim 1 , wherein the plating adhesion layer and the cladding layer are constituted of resin compositions having resins of identical composition.
6. The dry film for optical waveguides according to claim 1 , wherein the carrier film has releasability.
7. The dry film for optical waveguides according to claim 1 , wherein the solid microparticles are silica particles.
8. An optical waveguide, which is obtained using the dry film according to claim 1 .
9. A photoelectric composite wiring board which comprises the optical waveguide according to claim 8 .
10. A method for producing a photoelectric composite wiring board, which comprises at least:
stacking the dry film according to claim 1 on a substrate on which a cladding and a core of an optical waveguide are formed;
curing the plating adhesion layer and the uncured cladding layer;
developing simultaneously the plating adhesion layer and the cladding layer;
roughening the surface of the plating adhesion layer; and
forming an electrical circuit.
11. A method for producing a photoelectric composite wiring board, which comprises at least:
stacking a dry film on a substrate on which a cladding and a core of an optical waveguide are formed,
the dry film being obtained through sequential stacking of a carrier film, a plating adhesion layer, an uncured cladding layer and a cover film,
wherein solid microparticles are dispersed in a resin composition that constitutes the plating adhesion layer;
curing the plating adhesion layer and the uncured cladding layer;
developing simultaneously the plating adhesion layer and the cladding layer;
roughening the surface of the plating adhesion layer; and
forming an electrical circuit.