Semiconductor device for emitting frequency-adjusted infrared light

1. A semiconductor device for emitting frequency-adjusted infrared light comprising:

a lateral emitter structure of the semiconductor device configured to emit infrared light with an emitter frequency distribution;

a lateral filter structure of the semiconductor device configured to filter the infrared light emitted by the lateral emitter structure so that frequency-adjusted infrared light is provided with an adjusted frequency distribution, wherein a frequency range of the adjusted frequency distribution is narrower than a frequency range of the emitter frequency distribution; and

a lateral air gap located between the lateral emitter structure and the lateral filter structure.

2. The semiconductor device according to claim 1 , wherein the lateral filter structure comprises a structured layer comprising a material having a lower transparency for infrared light emitted by the lateral emitter structure than silicon.

3. The semiconductor device according to claim 1 , wherein the lateral filter structure comprises a structured layer comprising at least one of the metals copper, aluminum, tungsten, titan or titan nitride or one of the semiconductors monocrystalline silicon or poly silicon.

4. The semiconductor device according to claim 1 , wherein the lateral emitter structure comprises a layer comprising at least one of the metals copper, aluminum, tungsten, titan or titan nitride or one of the semiconductors monocrystalline silicon or poly silicon.

5. The semiconductor device according to claim 1 , comprising an emitter control module configured to provide a current led through the lateral emitter structure causing an infrared light emission.

6. The semiconductor device according to claim 5 , comprising a semiconductor substrate, wherein the lateral emitter structure is implemented by a layer of the semiconductor substrate located above a lateral cavity within the semiconductor substrate.

7. The semiconductor device according to claim 1 , comprising a semiconductor substrate, wherein the lateral emitter structure is implemented by a layer above the semiconductor substrate, wherein a lateral cavity is located between the lateral emitter structure and the semiconductor substrate.

8. The semiconductor device according to claim 1 , wherein an edge region of the lateral emitter structure is vertically separated from an edge region of the lateral filter structure by an electrical insulation layer laterally surrounding the lateral air gap.

9. The semiconductor device according to claim 1 , wherein the lateral emitter structure is a membrane or the lateral emitter structure is a lamella with constant or varying lateral width along the lateral air gap.

10. The semiconductor device according to claim 1 , wherein the lateral filter structure comprises a first layer comprising structures with a first periodic geometry and a second layer comprising a second periodic geometry, wherein the first periodic geometry is different from the second periodic geometry.

11. The semiconductor device according to claim 10 , wherein the lateral filter structure comprises a lateral air gap between the first layer and the second layer.

12. The semiconductor device according to claim 1 , wherein the lateral air gap comprises a thickness of a quarter of a wavelength of a portion of the frequency-adjusted infrared light.

13. The semiconductor device according to claim 1 , comprising a pressure sensitive module configured to generate a sensor signal indicating information on an acoustic wave caused by infrared light emitted by the lateral emitter structure interacting with gas.

14. The semiconductor device according to claim 1 , wherein the lateral emitter structure and the lateral filter structure are arranged on the same semiconductor die.

15. A semiconductor device for emitting frequency-adjusted infrared light comprising:

a semiconductor substrate;

a lateral emitter structure configured to emit infrared light,

wherein the lateral emitter structure is configured to be heated by a current flow through the lateral emitter structure,

wherein the lateral emitter structure is structured so that frequency-adjusted infrared light is provided with an adjusted frequency distribution, if the lateral emitter structure is heated; and

a lateral cavity adjacent to a side of the lateral emitter structure facing the semiconductor substrate.

16. The semiconductor device according to claim 15 , wherein the lateral cavity is located between the lateral emitter structure and at least a part of the semiconductor substrate.

17. The semiconductor device according to claim 15 , wherein the lateral emitter structure comprises an emitter layer adjacent to a filter layer, wherein the emitter layer is configured to be heated by a current flow through the emitter layer, wherein the filter layer is configured so that frequency-adjusted infrared light is provided with an adjusted frequency distribution, if the emitter layer is heated.

18. The semiconductor device according to claim 17 , wherein a frequency range of the adjusted frequency distribution is narrower than a frequency range of a frequency distribution of infrared light obtained by an emitter comprising only the emitter layer.

19. The semiconductor device according to claim 17 , wherein the emitter layer and the filter layer comprise the same material.

20. The semiconductor device according to claim 17 , wherein the lateral emitter structure is represented by a layer of the semiconductor substrate located above the lateral cavity within the semiconductor substrate, or wherein the lateral emitter structure is implemented by a layer above the semiconductor substrate, wherein the lateral cavity is located between the lateral emitter stricture and the semiconductor substrate.

21. The semiconductor device according to claim 15 , wherein the lateral emitter structure comprises periodic vertical holes through the lateral emitter structure.