IP Library Granted Patent US 9,576,939
Granted Patent B2
US 9,576,939 · App. 12/295,438 · Granted Feb 21, 2017

Light emitting device and lighting system having the same

Inventors: Gundula Roth (Levenhagen, DE); Walter Tews (Greifswald, DE); Chung-Hoon Lee (Ansan, KR)
Assignee: Seoul Semiconductor Co., Ltd.
H01L25/0753C09K11/7734C09K11/7735C09K11/7738H05B33/0821H05B33/0842H05B33/0857H05B33/14H05B37/0281F21K9/00H01L33/50H01L2924/0002Y02B20/181Y02B20/42
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Quick Facts
Patent No.
US 9,576,939
App. No.
12/295,438
Granted
Feb 21, 2017
Kind
B2
Abstract

The present invention provides a light emitting device comprising a first light emitting portion that emits white light at a color temperature of 6000K or more and a second light emitting portion that emits white light at a color temperature of 3000K or less, which include light emitting diode chips and phosphors and are independently driven. The present invention has an advantage in that a light emitting device can be diversely applied in a desired atmosphere and use by realizing white light with different light spectrums and color temperatures. Particularly, the present invention has the effect on health by adjusting the wavelength of light or the color temperature according to the circadian rhythm of humans.

Claims (30)

1. A light emitting device comprising:

a first light emitting portion for emitting daylight with a high color temperature of 6000K or more; and

a second light emitting portion for emitting warm white light at a color temperature of 3000K or less, and

a molding portion encapsulating the first light emitting portion and the second light emitting portion in common,

wherein each of the first and second light emitting portions comprises a light emitting diode chip and a phosphor,

wherein the first and second light emitting portions are disposed in one package, the one package comprising a housing, lead frames protruding from sides of the housing, and a heat sink passing through the housing, the heat sink comprising protruding portions on its upper surface,

wherein the protruding portions each comprise a top surface extending substantially parallel to the upper surface of the heat sink, the top surfaces of the protruding portions being raised above the upper surface of the heat sink in a direction extending away from a bottom surface of the light emitting device,

wherein the light emitting diode chips of the first and second light emitting portions are driven independently, the light emitting diode chips are disposed on the top surfaces of the protruding portions of the heat sink, respectively, and the light emitting diode chips are encapsulated by a compound comprising the phosphor and a resin, the compound being disposed only on the top surfaces of the protruding portions,

wherein the molding portion covers side surfaces of the protruding portions, the side surfaces of the protruding portions respectively connecting the top surfaces thereof and the upper surface of the heat sink, and

wherein the phosphor is expressed by Chemical Formula 3 as follows:

a (M I O). b (M II O). c (Al 2 O 3 ). d (M III 2 O 3 ). e (M IV O 2 ). f (M V x O y )  <Chemical Formula 3>

wherein the M I includes Cu, or Pb and Cu, the M II includes at least one selected from a group consisting of Be, Mg, Ca, Sr, Ba, Zn, Cd and Mn, the M III includes at least one selected from a group consisting of B, Ga and In, the M IV includes at least one selected from a group consisting of Si, Ge, Ti, Zr and Hf, the M V includes at least one selected from a group consisting of Bi, Sn, Sb, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, 0<a≦1, 0≦b≦2, 0<c≦8, 0≦d≦1, 0≦e≦1, 0<f≦2, 1≦x≦2 and 1≦y≦5.

2. A light emitting device comprising:

a first light emitting portion for emitting daylight with a high color temperature of 6000K or more;

a second light emitting portion for emitting warm white light at a color temperature of 3000K or less, and

a molding portion encapsulating the first light emitting portion and the second light emitting portion in common,

wherein each of the first and second light emitting portions comprises a light emitting diode chip and a phosphor,

wherein the first and second light emitting portions are disposed in one package, the one package comprising a housing, lead frames protruding from sides of the housing, and a heat sink passing through the housing, the heat sink comprising protruding portions on its upper surface,

wherein the protruding portions each comprise a top surface extending substantially parallel to the upper surface of the heat sink, the top surfaces of the protruding portions being raised above the upper surface of the heat sink in a direction extending away from a bottom surface of the light emitting device,

wherein the light emitting diode chips of the first and second light emitting portions are driven independently, the light emitting diode chips are disposed on the top surfaces of the protruding portions of the heat sink, respectively, and the light emitting diode chips are encapsulated by a compound comprising the phosphor and a resin, the compound being disposed only on the top surfaces of the protruding portions,

wherein the molding portion covers side surfaces of the protruding portions, the side surfaces of the protruding portions respectively connecting the top surfaces thereof and the upper surface of the heat sink, and

wherein the phosphor is expressed by Chemical Formula 4 as follows:

a (M I O). b (M II O). c (M III X). d (M III 2 O). e (M IV 2 O 3 ). f (M V o O p ). g (SiO 2 ). h (M VI x O y )  <Chemical Formula 4>

wherein the M I includes Cu, or Pb and Cu, the M II includes at least one selected from a group consisting of Be, Mg, Ca, Sr, Ba, Zn, Cd and Mn, the M III includes at least one selected from a group consisting of Li, Na, K, Rb, Cs, Au and Ag, the M IV includes at least one selected from a group consisting of Al, Ga, In and B, the M V includes at least one selected from a group consisting of Ge, V, Nb, Ta, W, Mo, Ti, Zr, Hf and P, M VI includes at least one selected from a group consisting of Bi, Sn, Sb, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, the X includes at least one selected from a group consisting of F, Cl, Br and I, 0<a≦2, 0<b≦8, 0≦c≦4, 0≦d≦2, 0≦e≦2, 0≦f≦2, 0≦g≦10, 0<h≦5, 1≦o≦2, 1≦p≦5, 1≦x≦2 and 1≦y≦5.

3. The light emitting device claimed in claim 1 , further comprising a controller for controlling voltage applied to at least any one of the first light emitting portion and the second light emitting portion.

4. The light emitting device claimed in claim 3 , wherein the controller controls the voltage input from the outside with respect to time and applies the voltage to at least any one of the first light emitting portion and the second light emitting portion.

5. The light emitting device claimed in claim 4 , wherein the controller increases and decreases voltage with a 24 hour cycle and applies the voltage to at least any one of the first light emitting portion and the second light emitting portion.

6. The light emitting device claimed in claim 2 , further comprising a controller for controlling voltage applied to at least any one of the first light emitting portion and the second light emitting portion.

7. The light emitting device claimed in claim 6 , wherein the controller controls the voltage input from the outside with respect to time and applies the voltage to at least any one of the first light emitting portion and the second light emitting portion.

8. The light emitting device claimed in claim 7 , wherein the controller increases and decreases voltage with a 24 hour cycle and applies the voltage to at least any one of the first light emitting portion and the second light emitting portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 21, 2009
From: ROTH, GUNDULA; TEWS, WALTER; LEE, CHUNG HOON
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 022128/0962 →
Priority Claims (1)
KR 10-2006-0029517 · Mar 31, 2006 · national
Continuity (1)
Related Publication 20090303694A1 · Dec 10, 2009