Image sensor and light source driver integrated in a same semiconductor package

1. An apparatus, comprising:

an image sensor and a light source driver circuit integrated in a same semiconductor chip package, said image sensor comprising visible light pixels and depth pixels, said depth pixels to sense light generated with a light source drive signal, said light source drive signal generated with said light source driver circuit, said image sensor comprising a pixel array disposed on a first semiconductor chip, the first semiconductor chip being disposed on a second semiconductor chip, the second semiconductor chip comprising the light source driver circuit, the second semiconductor chip comprising timing and control circuitry to generate respective clock signals for the depth pixels, the timing and control circuitry comprising a delay-locked-loop circuit having a phase comparator to compare respective phases of driving activity of the light source and sensing activity of the depth pixels.

2. The apparatus of claim 1 wherein said second semiconductor chip comprises analog-to-digital conversion circuitry to digitize analog signals generated by said depth pixels.

3. The apparatus of claim 1 wherein said light source driver circuit comprises one or more transistors coupled to an output of said light source driver circuit to drive said light source drive signal where a gate node of said one or more transistors is coupled to said phase comparator.

4. The apparatus of claim 1 wherein said second semiconductor chip further comprises conductive vias within its substrate coupled to conductive balls and/or bumps on a bottom surface of said semiconductor chip package.

5. The apparatus of claim 1 wherein said light source driver circuit comprises an input to receive a signal generated by a photo-detector of a light source that receives said light source drive signal.

6. A method, comprising:

performing the following within a same semiconductor chip package:

generating a drive signal for a light source with light source drive circuitry that is disposed on a second semiconductor chip;

responding to light generated from the drive signal with depth pixels that are components of an image sensor disposed on a first semiconductor chip, the first semiconductor chip being disposed on the second semiconductor chip, the light reflected from an object, the responding to the light to generate analog depth profile information for the object;

digitizing the analog depth profile information;

generating respective clock signals for the depth pixels with timing and control circuitry disposed on the second semiconductor chip;

comparing respective phases of driving activity of the light source and sensing activity of the depth pixels with a phase comparator of a delay-locked-loop circuit of the timing and control circuitry;

responding to visible light with visible light pixels that are disposed on the first semiconductor chip to generate analog visible image signals.

7. The method of claim 6 further comprising generating a clock signal for the drive signal with the timing and control circuitry.

8. The method of claim 7 further comprising sending the digitized analog depth profile information to a host system.

9. The method of claim 6 further comprising performing the following within said semiconductor chip package:

digitizing said analog visible image signals.

10. A computing system, comprising:

one or more general purpose processing cores;

a memory controller coupled to the one or more general purpose processing cores;

system memory coupled to the memory controller;

an image signal processor;

a camera coupled to the image signal processor, the camera comprising:

an image sensor and a light source driver circuit integrated in a same semiconductor chip package, said image sensor comprising visible light pixels and depth pixels, said depth pixels to sense light generated with a light source drive signal, said light source drive signal generated with said light source driver circuit, said image sensor comprising a pixel array disposed on a first semiconductor chip, the first semiconductor chip being disposed on a second semiconductor chip, the second semiconductor chip comprising the light source driver circuit, the second semiconductor chip comprising timing and control circuitry to generate respective clock signals for the depth pixels, the timing and control circuitry comprising a delay-locked-loop circuit having a phase comparator to compare respective phases of driving activity of the light source and sensing activity of the depth pixels.

11. The computing system of claim 10 wherein said computing system is a mobile device.

12. The computing system of claim 10 wherein said second semiconductor chip has analog-to-digital conversion circuitry to digitize analog signals generated by said depth pixels.

13. The computing system of claim 10 wherein said light source driver circuit includes one or more transistors coupled to an output of said light source driver circuit to drive said light source drive signal where a gate node of said one or more transistors is coupled to said phase comparator.

14. The computing system of claim 10 wherein said second semiconductor chip has conductive vias within its substrate coupled to conductive balls and/or bumps on a bottom surface of said semiconductor chip package.