Method for monitoring focus in EUV lithography
View Patent ↗This invention relates to a method of obtaining optimal focus for exposing a photoresist in an EUV lithography with an EUV mask containing a pattern with an assist feature. The invention also relates to an EUV mask with a special focus test target for monitoring focus in EUV lithography, and a method of fabricating this EUV mask by designing the special focus test target. The EUV mask contains a repeating pattern, wherein the repeating pattern has two different pitches, i.e. a first pitch and a second pitch, and contains an assist feature between main features. Because the two different pitches have different focus offsets, the difference between linewidths of said gratings provides a calibration curve which is a measure of focus. The method for monitoring focus is performing an EUV exposure using a focus position with a pre-determined focus position as calibrated using the linewidth difference between the two gratings. The EUV mask for monitoring focus of present invention is applicable to both test and product masks.
1. A method for monitoring focus in an EUV lithography comprising:
providing a substrate containing a photoresist layer;
exposing, with EUV radiation, and printing the photoresist layer at different focus positions with a mask comprising a repeating pattern of two different pitches which include a first pitch and a second pitch, wherein the repeating pattern of at least one of the two different pitches comprises an assist feature;
determining a first relationship between printed linewidths of the photoresist layer and the different focus positions under the repeating pattern of the first pitch in the mask;
determining a second relationship between printed linewidths of the photoresist layer and the different focus positions under the repeating pattern of the second pitch in the mask;
establishing a calibration curve which comprises printed linewidth differences of the two different pitches at the different focus positions; and
performing EUV exposure on photoresists or other photo sensitive materials using a focus position which is pre-determined as a focus position on the calibration curve.
2. The method of claim 1 , wherein exposing the photoresist layer under the repeating pattern in the mask results in a printed photoresist pattern selected from a group consisting of lines, trenches, holes, studs, and mixtures thereof.
3. The method of claim 2 , wherein the printed photoresist pattern comprises horizontal trenches.
4. The method of claim 2 , wherein the printed photoresist pattern comprises vertical trenches.
5. The method of claim 2 , wherein feature sizes of the repeating pattern on the mask are four times the feature sizes of the printed photoresist pattern on the substrate.
6. The method of claim 2 , wherein the first pitch and the second pitch are selected from a set of pitches inspected to give a largest or sufficient difference at their best focus positions for the printed photoresist pattern.
7. The method of claim 1 , wherein the assist feature has a linewidth in a range from about 20 nm to about 60 nm.
8. The method of claim 1 , wherein the EUV lithography comprises a quasar illumination system.
9. The method of claim 1 , wherein the mask is a product mask for producing products.
10. The method of claim 1 , wherein the photoresist layer has a thickness in a range from about 10 nm to about 40 nm.
11. A method for monitoring focus in an EUV lithography comprising:
providing a substrate containing a photoresist layer;
exposing, with EUV radiation, and printing the photoresist layer at different focus positions with a mask comprising a repeating pattern of two different pitches which include a first pitch and a second pitch, wherein the repeating pattern of at least one of the two different pitches comprises an assist feature;
determining a first relationship between printed linewidths of the photoresist layer and the different focus positions under the repeating pattern of the first pitch in the mask;
determining a second relationship between printed linewidths of the photoresist layer and the different focus positions under the repeating pattern of the second pitch in the mask;
identifying a reference focus position where a printed linewidth of the first pitch is same as a printed linewidth of the second pitch; and
performing EUV exposure on photoresists or other photo sensitive materials using a focus position with a pre-calibrated offset from the identified reference focus position.