IP Library Granted Patent US 9,604,391
Granted Patent B2
US 9,604,391 · App. 14/111,374 · Granted Mar 28, 2017

Laminate, production method for same, and method of creating device structure using laminate

Inventors: Masahiro Tamada (Otsu, JP); Toshiyuki Tsuchiya (Otsu, JP); Tetsuo Okuyama (Otsu, JP); Kazuyuki Ouya (Otsu, JP); Satoshi Maeda (Otsu, JP)
Assignee: Toyobo Co., Ltd.
B29C33/3842B29C39/02B32B38/10B81C1/0038H01L21/02118H01L21/02282H01L31/0392H01L31/03923H01L31/03925B32B38/0008B32B2379/08H01L27/1218Y02E10/50
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Quick Facts
Patent No.
US 9,604,391
App. No.
14/111,374
Granted
Mar 28, 2017
Kind
B2
Abstract

The invention provides a laminate of an inorganic layer, a resin layer, and a coupling agent treatment layer interposed therebetween, which different delamination strengths between the inorganic layer and the resin layer to form a prescribed pattern. The invention also provides a production method comprising (1) treating an inorganic layer with a coupling agent; (2) performing a patterning process to form strong adhesion sections and easily separated sections; and (3) forming a resin layer by drying and heat-treating a coated solution layer obtained by coating a resin solution or a resin precursor solution onto the surface of the inorganic layer that was treated with a coupling agent and then patterned.

Claims (24)

1. A method for producing a laminate composed of at least an inorganic layer and a resin layer, the method comprising the following steps (1) to (3):

(1) subjecting at least one surface of the inorganic layer to a coupling agent treatment;

(2) carrying out a patterning treatment for forming good adhesion parts and easily peeling parts with different adhesion peel strength between the inorganic layer and the resin layer, wherein a surface roughness value of the good adhesion parts and a surface roughness value of the easily peeling parts are substantially the same in at least one surface of the inorganic layer subjected to the coupling agent treatment in the step (1); and

(3) forming the resin layer by applying a resin solution or a resin precursor solution to the coupling agent-treated surface of the inorganic layer subjected to the patterning treatment in the step (2) and drying and heating the obtained application solution layer.

2. The method for producing a laminate according to claim 1 , wherein the patterning treatment is earned out by subjecting a part of the coupling agent-treated layer to inactivation treatment to form a prescribed pattern.

3. The method for producing a laminate according to claim 2 , wherein the inactivation treatment is at least one kind treatment selected from the group consisting of blast treatment, vacuum plasma treatment, atmospheric pressure plasma treatment, corona treatment, active radiation irradiation treatment, active gas treatment, and chemical solution treatment performed by covering or shielding a prescribed portion.

4. The method for producing a laminate according to claim 3 , wherein the active radiation treatment is UV irradiation treatment.

5. The method for producing a laminate according to claim 1 , wherein the resin layer contains a polyimide obtained by reaction of aromatic diamines and aromatic tetracarboxylic acids.

6. The method for producing a laminate according to claim 1 , wherein the resin layer contains a polyimide obtained by reaction of aromatic diamines and aromatic tetracarboxylic acids; 70 mol % or more of the aromatic diamines are aromatic diamines selected from at least one kind of an aromatic diamine having a benzoxazole structure, an aromatic diamine having a diaminodiphenyl ether structure, and an aromatic diamine having a phenylenediamine structure; and 70 mol % or more of the aromatic tetracarboxylic acids are aromatic tetracarboxylic acids selected from at least one kind of pyromellitic acid dianhydride and biphenyltetracarboxylic acid dianhydride.

7. A method for producing a structure having a device formed on the resin layer, the method comprising:

preparing a laminate having an inorganic layer and a resin layer by the method set forth in claim 1 ;

forming a device on the resin layer of the laminate;

making a cut in the resin layer at an easily peeling part of the laminate; and

peeling the resin layer from the inorganic layer.

8. A method for producing a structure having a device formed on the resin layer, the method comprising:

preparing a laminate having an inorganic layer and a resin layer by the method set forth in claim 3 ;

forming a device on the resin layer of the laminate;

making a cut in the resin layer at an easily peeling part of the laminate; and

peeling the resin layer from the inorganic layer.

9. A method for producing a structure having a device formed on the resin layer, the method comprising:

preparing a laminate having an inorganic layer and a resin layer by the method set forth in claim 6 ;

forming a device on the resin layer of the laminate;

making a cut in the resin layer at an easily peeling part of the laminate; and

peeling the resin layer from the inorganic layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2013
From: TAMADA, MASAHIRO; TSUCHIYA, TOSHIYUKI; OKUYAMA, TETSUO; OUYA, KAZUYUKI; MAEDA, SATOSHI
To: TOYOBO CO., LTD.
Reel/Frame 031391/0456 →
Priority Claims (5)
JP 2011-091041 · Apr 15, 2011 · national
JP 2011-120413 · May 30, 2011 · national
JP 2011-164326 · Jul 27, 2011 · national
JP 2012-042961 · Feb 29, 2012 · national
JP 2012-065306 · Mar 22, 2012 · national
Continuity (1)
Related Publication 20140042662A1 · Feb 13, 2014