Printed circuit board, method of manufacturing same, and method of mounting the circuit board in a connector socket

1. A printed circuit board, comprising:

a substrate configured to support a plurality of electronic components;

electrical contacts located along a first edge of the substrate;

a retention boss that is located on a first surface of the substrate, the retention boss protruding from the first surface and having a narrow, elongated shape that extends parallel to and adjacent the first edge such that a majority of the first surface of the substrate is not covered by the retention boss, the retention boss including a contact surface that is configured to contact a surface of a connector socket when the first edge of the substrate is inserted into the connector socket; and

a first adhesive layer on the contact surface of the retention boss.

2. The circuit board of claim 1 , further comprising a removable cover layer mounted on the first adhesive layer.

3. The circuit board of claim 1 , wherein the retention boss comprises a first retention boss, and further comprising a second retention boss located on a second surface of the substrate that is opposite the first surface, the second retention boss protruding from the second surface and having a narrow, elongated shape that extends parallel to and adjacent the first edge such that a majority of the second surface of the substrate is not covered by the second retention boss, the second retention boss including a contact surface that is configured to contact a surface of a connector socket when the first edge of the substrate is inserted into the connector socket.

4. The circuit board of claim 3 , further comprising a second adhesive layer on the contact surface of the second retention boss.

5. The circuit board of claim 4 , further comprising first and second removable cover layers mounted on the first and second adhesive layers, respectively.

6. The printed circuit board of claim 1 , wherein the retention boss comprises a moldable resin.

7. The printed circuit board of claim 6 , wherein the moldable resin is electrically insulating.

8. The printed circuit board of claim 1 , wherein the substrate comprises an inline memory module having a plurality of semiconductor memory modules mounted thereon.

9. A method of forming at least one retention boss on at least one surface of a circuit board having electrical contacts located along a first edge of the circuit board, the method comprising:

inserting the circuit board into a mold having a cavity that is configured to form a retention boss on a first surface of the circuit board such that the retention boss protrudes from the first surface and has a narrow, elongated shape that extends parallel to and adjacent the first edge such that a majority of the first surface of the substrate is not covered by the retention boss;

filling the mold cavity with a moldable material;

allowing the moldable material to cure and thereby form a retention boss on the first surface, the retention boss including a contact surface that is configured to contact a surface of a connector socket when the first edge of the circuit board is inserted into the connector socket;

removing the circuit board from the mold; and

applying a first adhesive layer to the contact surface of the retention boss.

10. The method of claim 9 , wherein the filling step comprises filling the mold cavity with a moldable resin material that hardens when it cures.

11. The method of claim 9 , wherein the inserting step comprises inserting the circuit board into a mold having first and second cavities that are configured to form first and second retention bosses, respectively, on first and second opposite surfaces of the circuit board such that the first and second retention bosses protrude from the first and second surfaces and have narrow, elongated shapes that extend parallel to and adjacent the first edge such that the majority of the first and second surfaces are not covered by the first and second retention bosses, respectively, wherein the filling step comprises filling the first and second mold cavities with a moldable material, and wherein the allowing step comprises allowing the moldable material to cure and thereby form first and second retention bosses on the first and second surfaces of the circuit board, respectively, the first and second retention bosses each including a contact surface that is configured to contact a surface of a connector socket when the first edge of the circuit board is inserted into the connector socket.

12. The method of claim 11 , wherein the applying step comprises applying first and second adhesive layers to the contact surfaces of the first and second retention bosses, respectively.