IP Library › Granted Patent US 9,614,271
Granted Patent B2
US 9,614,271 · App. 14/010,790 · Granted Apr 4, 2017

Composite module and electronic apparatus including the same

Inventors: Morihiro Nakano (Nagaokakyo, JP); Yuichi Ito (Nagaokakyo, JP); Taro Hirai (Nagaokakyo, JP); Hidetaka Kuwahara (Nagaokakyo, JP)
Assignee: Murata Manufacturing Co., Ltd.
H01Q1/24H01Q1/52H01Q1/243
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Quick Facts
Patent No.
US 9,614,271
App. No.
14/010,790
Granted
Apr 4, 2017
Kind
B2
Abstract

A wireless communication module includes a circuit board, and an antenna and a connection member mounted on a mounting surface of the circuit board. The antenna is mounted in a region along a first end edge of the circuit board, and the connection member is mounted in a region along a second end edge of the circuit board.

Claims (37)

1. A composite module comprising:

a circuit board;

an antenna and a connection member mounted on a mounting surface of the circuit board;

an electronic component mounted on the circuit board; and

a metal case mounted on the circuit board so as to cover the electronic component; wherein

the antenna is mounted in a region along a first end edge of the circuit board;

the connection member is mounted in a region along a second end edge of the circuit board;

the metal case and the electronic component are positioned between the antenna and the connection member;

the first end edge and the second end edge are opposed to each other when the circuit board is seen in a planar view; wherein

the connection member includes at least a fixing member;

the metal case is mounted in a region on the second end edge side of the circuit board;

the metal case includes a top plate and a side plate arranged at a predetermined position;

the fixing member is arranged near a portion where the side plate is not arranged; and

the fixing member is arranged such that the fixing member is covered with the metal case.

2. The composite module according to claim 1 , wherein a heat dissipation member is arranged between the metal case and the electronic component.

3. The composite module according to claim 1 , wherein the electronic component is one of a wireless communication IC, a balun filter, and a band-pass filter.

4. The composite module according to claim 1 , wherein the circuit board includes a through hole to enable insertion of the fixing member.

5. The composite module according to claim 1 , wherein the electronic component is mounted adjacent to the fixing member.

6. The composite module according to claim 1 , wherein the antenna is a chip antenna including a dielectric material or a pattern antenna including a wiring pattern on the circuit board.

7. The composite module according to claim 1 , wherein

the side plate includes a plurality of side plates arranged at the predetermined position;

in side portions of the metal case, gaps are located at portions where no side plates are provided; and

the fixing member is arranged to block at least one of the gaps.

8. The composite module according to claim 1 , wherein

the side plate includes a plurality of side plates arranged at the predetermined position; and

the metal case is L-shaped or substantially L-shaped.

9. An electronic apparatus comprising:

a mother board; and

the composite module according to claim 1 , on the mother board.

10. The electronic apparatus according to claim 9 , wherein the metal case or the mounting surface is mounted so as to face a principal surface side of the mother board.

11. The electronic apparatus according to claim 10 , wherein a heat dissipation member is arranged between the top plate of the metal case and a principal surface of the mother board.

12. An electronic apparatus comprising:

a mother board; and

the composite module according to claim 1 , the composite module being mounted on the mother board via the fixing member.

13. The electronic apparatus according to claim 12 , wherein the metal case or the mounting surface is mounted so as to face a principal surface side of the mother board.

14. The electronic apparatus according to claim 13 , wherein a heat dissipation member is arranged between the top plate of the metal case and a principal surface of the mother board.

15. The electronic apparatus according to claim 1 , wherein the fixing member is electrically connected to ground.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2013
From: NAKANO, MORIHIRO; ITO, YUICHI; HIRAI, TARO; KUWAHARA, HIDETAKA
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 031099/0987 →
Priority Claims (1)
JP 2012-217180 · Sep 28, 2012 · national
Continuity (1)
Related Publication 20140091983A1 · Apr 3, 2014