IP Library Granted Patent US 9,617,828
Granted Patent B2
US 9,617,828 · App. 14/473,321 · Granted Apr 11, 2017

Thermal component temperature management system and method

Inventors: Joe Marzouk (Conroe, TX); Michael Fripp (Carrollton, TX); Adan Hernandez Herrera (Houston, TX)
Assignee: Halliburton Energy Services, Inc.
E21B36/001E21B36/00E21B47/011
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,617,828
App. No.
14/473,321
Granted
Apr 11, 2017
Kind
B2
Abstract

A downhole tool includes a temperature sensitive component. The temperature of the temperature sensitive component is at least partially controlled by a temperature management system thermally coupled to the temperature sensitive component. The temperature management system may include a cooling mixture chamber thermally coupled to the temperature sensitive component, wherein first and second components of a cooling mixture cause an endothermic reaction when mixed together within the cooling mixture chamber.

Claims (45)

1. A downhole tool, comprising:

a body;

a temperature sensitive component housed within the body;

a cooling mixture chamber thermally coupled to the temperature sensitive component;

a first cooling component chamber fluidically coupled to the cooling mixture chamber and containing a first component of a cooling mixture; and

a second cooling component chamber fluidically coupled to the cooling mixture chamber and containing a second component of the cooling mixture;

wherein, when the first and second components of the cooling mixture are mixed together within the cooling mixture chamber to form the cooling mixture, the cooling mixture causes an endothermic reaction to reduce the temperature of the temperature sensitive component.

2. A downhole tool, comprising:

a body;

a temperature sensitive component housed within the body;

a cooling mixture chamber thermally coupled to the temperature sensitive component;

a first cooling component chamber fluidically coupled to the cooling mixture chamber and containing a first component of a cooling mixture; and

a second cooling component chamber fluidically coupled to the cooling mixture chamber and containing a second component of the cooling mixture;

wherein the first and second components of the cooling mixture cause an endothermic reaction when mixed together within the cooling mixture chamber; and

wherein the cooling mixture chamber is formed within a cold plate to which the temperature sensitive component is thermally coupled.

3. The downhole tool of claim 2 , wherein the cooling mixture chamber comprises a purge that removes the mixture of the first and second components of the cooling mixture from the cooling mixture chamber.

4. The downhole tool of claim 2 , wherein the first and second components of the cooling mixture are introduced into the cooling mixture chamber by at least one of a piston and an auger.

5. The downhole tool of claim 2 , wherein the cooling mixture is non-aqueous.

6. A downhole tool, comprising:

a body;

a temperature sensitive component housed within the body;

a cooling mixture chamber thermally coupled to the temperature sensitive component;

a first cooling component chamber fluidically coupled to the cooling mixture chamber and containing a first component of a cooling mixture; and

a second cooling component chamber fluidically coupled to the cooling mixture chamber and containing a second component of the cooling mixture;

wherein the first and second components of the cooling mixture cause an endothermic reaction when mixed together within the cooling mixture chamber; and

wherein the cooling mixture chamber comprises a purge that removes the mixture of the first and second components of the cooling mixture from the cooling mixture chamber.

7. The downhole tool of claim 6 , wherein the first and second components of the cooling mixture are introduced into the cooling mixture chamber by at least one of a piston and an auger.

8. The downhole tool of claim 6 , wherein the cooling mixture is non-aqueous.

9. A downhole tool, comprising:

a body;

a temperature sensitive component housed within the body;

a cooling mixture chamber thermally coupled to the temperature sensitive component;

a first cooling component chamber fluidically coupled to the cooling mixture chamber and containing a first component of a cooling mixture; and

a second cooling component chamber fluidically coupled to the cooling mixture chamber and containing a second component of the cooling mixture;

wherein the first and second components of the cooling mixture cause an endothermic reaction when mixed together within the cooling mixture chamber; and

wherein the first and second components of the cooling mixture are introduced into the cooling mixture chamber by at least one of a piston and an auger.

10. The downhole tool of claim 9 , wherein the cooling mixture is non-aqueous.

11. A downhole tool, comprising:

a body;

a temperature sensitive component housed within the body;

a cooling mixture chamber thermally coupled to the temperature sensitive component;

a first cooling component chamber fluidically coupled to the cooling mixture chamber and containing a first component of a cooling mixture; and

a second cooling component chamber fluidically coupled to the cooling mixture chamber and containing a second component of the cooling mixture;

wherein the first and second components of the cooling mixture cause an endothermic reaction when mixed together within the cooling mixture chamber; and

wherein the cooling mixture is non-aqueous.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2016
From: MARZOUK, JOE; FRIPP, MICHAEL; HERRERA, ADAN HERNANDEZ
To: HALLIBURTON ENERGY SERVICES, INC.
Reel/Frame 040744/0748 →
Continuity (3)
Division 13266669
Provisional Application 61172995 · Apr 27, 2009
Related Publication 20140367167A1 · Dec 18, 2014