Heat radiation structure of electric device and method for manufacturing the same

1. A heat radiation structure for an electric device comprising:

at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts;

the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and

a low heat resistance element opposed to the electric device,

wherein the low heat resistance element has a heat resistance lower than the insulation material, and

wherein the heat radiation structure further comprises: a circuit board disposed on the at least one multi-layer substrate opposite to the low heat resistance element,

wherein the at least one multi-layer substrate includes a plurality of multi-layer substrates, which are arranged on the circuit board along a direction different from a stacking direction of each of the plurality of multi-layer substrates, and

wherein heat generated at the first electric element in the at least one multi-layer substrate is radiated via the low heat resistance element to an outside of the heat radiation structure,

wherein the base parts includes an insulation base part, which is opposed to the low heat resistance element,

wherein the base parts further includes an adjacent base part, which is adjacent to the insulation base part,

wherein the adjacent base part has a surface, which is opposed to the low heat resistance element, and

wherein the conductor pattern is disposed on the surface of the adjacent base part.

2. The heat radiation structure according to claim 1 , further comprising:

a heat conducting member disposed between the low heat resistance element and a heat radiation body or between the at least one multi-layer substrate or the second electric element and the low heat resistance element,

wherein the heat radiation body is disposed on an opposite side of the electric device.

3. The heat radiation structure according to claim 1 ,

wherein the first electric element is accommodated in an accommodation portion of the at least one multi-layer substrate.

4. The heat radiation structure according to claim 1 ,

wherein the first electric element has a thickness, which is equal to a thickness of each of the plurality of base parts.

5. The heat radiation structure according to claim 1 , wherein:

the at least one of the first electric element includes a plurality of first electric elements; and

the plurality of first electric elements are disposed in a same one of the base parts.

6. The heat radiation structure according to claim 5 , wherein:

the plurality of first electric elements have a same thickness in the stacking direction.

7. The heat radiation structure according to claim 6 , wherein:

the same thickness of the plurality of first electric elements is equal to a thickness of the same one of the base parts in the stacking direction.

8. The heat radiation structure according to claim 1 , wherein:

the at least one of the first electric element is disposed on the adjacent base part opposed to the insulation base part.

9. The heat radiation structure according to claim 8 , wherein:

the insulation base part contacts the adjacent base part via the conductor pattern.