IP Library › Granted Patent US 9,627,731
Granted Patent B2
US 9,627,731 · App. 14/725,237 · Granted Apr 18, 2017

Resonance device and filter including the same

Inventors: Hak Rae Cho (Bucheon-si, KR); Soo Duk Seo (Incheon, KR); Jeong Pyo Kim (Seoul, KR)
Assignee: INNERTRON, INC.
H01P1/20345H01P1/20336H01P3/082H02N1/006H03H7/0115H03H9/24H03H9/46H03H2001/0085
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Quick Facts
Patent No.
US 9,627,731
App. No.
14/725,237
Granted
Apr 18, 2017
Kind
B2
Abstract

A resonance device and a filter including the same are provided. The resonance device includes a case having a first ground surface and a second ground surface which are facing each other, and a first conductive layer located in the case, and the first conductive layer includes a main part grounded via the first ground surface, and a protruding part which has a width different from that of the main part and is located to be spaced apart from the second ground surface.

Claims (17)

1. A resonance device, comprising:

a case having a first ground surface and a second ground surface which are facing each other; and

a first conductive layer located in the case;

a first stacked layer which is grounded via the second ground surface, is spaced apart from the first conductive layer, and is disposed above the first conductive layer;

a second stacked layer which is grounded via the second ground surface, is spaced apart from the first conductive layer, and is disposed below the first conductive layer; and

a second conductive layer which is grounded via the first ground surface, has the same structure as the first conductive layer, and is disposed between the first conductive layer and the second stacked layer,

wherein the first conductive layer includes:

a main part grounded via the first ground surface,

a protruding part which has a width different from that of the main part and is located to be spaced apart from the second ground surface; and

wherein the protruding part of the first conductive layer and a protruding part of the second conductive layer are connected by a via.

2. The resonance device of claim 1 , wherein characteristics of the resonance device are determined according to the width and a protruding length of the protruding part of the first conductive layer, and a distance between the protruding part and the second ground surface.

3. A band pass filter including the resonance device of claim 1 .

4. The resonance device of claim 1 , wherein the first stacked layer is spaced apart from each of the main part and the protruding part of the first conductive layer in a first direction, and the first stacked layer has an overlapping area with the main part and the protruding part of the first conductive layer in the first direction.

5. The resonance device of claim 1 , further comprising:

a third stacked layer which is not grounded via the second ground surface, is disposed above the first stacked layer, and is connected to the protruding part of the first conductive layer by a first via; and

a fourth stacked layer which is not grounded via the second ground surface, is disposed below the second stacked layer, and is connected to the protruding part of the first conductive layer by a second via.

6. The resonance device of claim 1 , wherein the second stacked layer is spaced apart from each of the main part and the protruding part of the first conductive layer in a second direction, and the second stacked layer has an overlapping area with the main part and the protruding part of the first conductive layer in the second direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2015
From: CHO, HAK RAE; SEO, SOO DUK; KIM, JEONG PYO
To: INNERTRON, INC.
Reel/Frame 035794/0067 →
Priority Claims (1)
KR 10-2015-0067935 · May 15, 2015 · national
Continuity (1)
Related Publication 20160336917A1 · Nov 17, 2016