Semiconductor device
A semiconductor device includes a package, an input terminal fixed to the package, an input pre-matched substrate provided in the package, a semiconductor element provided in the package and formed on a substrate different from the input pre-matched substrate, a matching circuit including a circuit element formed on the input pre-matched substrate, a first wire for connecting the input terminal and the circuit element, and a second wire for connecting the circuit element and the semiconductor element, a first MIM capacitor formed as part of the circuit element, and a first stabilization circuit formed as part of the circuit element to reduce oscillation, wherein a lower electrode of the first MIM capacitor is connected to the package through a via provided in the input pre-matched substrate.
1. A semiconductor device comprising:
a package;
an input terminal fixed to the package;
an input pre-matched substrate provided in the package;
a semiconductor element provided in the package and formed on a substrate different from the input pre-matched substrate;
a matching circuit comprising a circuit element formed on the input pre-matched substrate, a first wire for connecting the input terminal and the circuit element, and a second wire for connecting the circuit element and the semiconductor element;
a first MIM capacitor formed as part of the circuit element, the first MIM capacitor comprising a lower electrode and an upper electrode, the lower electrode having a first side formed on a surface of the input pre-matched substrate and a second side opposite the first side and facing in a direction of the upper electrode; and
a first stabilization circuit formed as part of the circuit element to reduce oscillation,
wherein the lower electrode of the first MIM capacitor is connected to the package through a via provided in the input pre-matched substrate and extending from the surface of the input pre-matched substrate in a direction opposite the direction of the upper electrode.
2. The semiconductor device according to claim 1 wherein the first stabilization circuit comprises:
a second MIM capacitor formed on the input pre-matched substrate to share an upper electrode with the first MIM capacitor; and
a first resistor formed on the input pre-matched substrate and connected in parallel to the second MIM capacitor.
3. The semiconductor device according to claim 1 , further comprising:
a harmonic circuit comprising a capacitor formed on the input pre-matched substrate, the harmonic circuit being a matching circuit for harmonics,
wherein the harmonic circuit connects an input of the semiconductor element and the via.
4. A semiconductor device comprising:
a package;
an input terminal fixed to the package;
an input pre-matched substrate provided in the package;
a semiconductor element provided in the package and formed on a substrate different from the input pre-matched substrate;
a matching circuit comprising a circuit element formed on the input pre-matched substrate, a first wire for connecting the input terminal and the circuit element, and a second wire for connecting the circuit element and the semiconductor element;
a first MIM capacitor formed as part of the circuit element;
a first stabilization circuit formed as part of the circuit element to reduce oscillation,
wherein a lower electrode of the first MIM capacitor is connected to the package through a via provided in the input pre-matched substrate, and
wherein the first stabilization circuit comprises:
a second MIM capacitor formed on the input pre-matched substrate to share an upper electrode with the first MIM capacitor; and
a first resistor formed on the input pre-matched substrate and connected in parallel to the second MIM capacitor; and the semiconductor device further comprising:
a first pad formed on the input pre-matched substrate, the first pad having the first wire connected thereto; and
a second stabilization circuit connecting the first pad and the package,
wherein the second stabilization circuit comprises:
a second resistor formed on the input pre-matched substrate;
an external capacitor provided in the package; and
a connecting inductor.
5. The semiconductor device according to claim 4 , wherein effective frequencies of the first stabilization circuit and those of the second stabilization circuit are different from each other.
6. The semiconductor device according to claim 4 , wherein the external capacitor is formed on the input pre-matched substrate.
7. The semiconductor device according to claim 4 , further comprising:
the plurality of first MIM capacitors;
the plurality of first stabilization circuits; and
third resistors for connecting the plurality of first stabilization circuits.
8. The semiconductor device according to claim 4 , further comprising:
the plurality of first MIM capacitors;
the plurality of first stabilization circuits;
the plurality of first pads; and
a plurality of first patterns formed on the input pre-matched substrate to connect the first pads and the second resistor,
wherein lengths of the plurality of first patterns are equal.
9. The semiconductor device according to claim 8 , further comprising: a fourth resistor for connecting the plurality of first pads.
10. The semiconductor device according to claim 4 , wherein the second stabilization circuit is connected to the package through the via.
11. The semiconductor device according to claim 10 , further comprising:
the plurality of first MIM capacitors;
the plurality of first stabilization circuits;
the plurality of first pads; and
the plurality of second stabilization circuits.
12. A semiconductor device comprising:
a package;
an input terminal fixed to the package;
an input pre-matched substrate provided in the package;
a semiconductor element provided in the package and formed on a substrate different from the input pre-matched substrate;
a matching circuit comprising a circuit element formed on the input pre-matched substrate, a first wire for connecting the input terminal and the circuit element, and a second wire for connecting the circuit element and the semiconductor element;
a first MIM capacitor formed as part of the circuit element;
a first stabilization circuit formed as part of the circuit element to reduce oscillation;
wherein a lower electrode of the first MIM capacitor is connected to the package through a via provided in the input pre-matched substrate; and the semiconductor device further comprising:
an output pre-matched substrate provided in the package;
an output terminal fixed to the package;
an output wire for connecting an output of the semiconductor element and the output terminal;
an output-side circuit element formed on the output pre-matched substrate; and
a third wire for connecting an output of the semiconductor element and the output-side circuit element,
wherein the output-side circuit element is connected to the package through an output-side via formed in the output pre-matched substrate.