Printed circuit board assemblies and a wellbore system
Printed circuit board assemblies having capabilities for operating under high ampacity conditions are sometimes difficult to fabricate and lack sufficient mechanical robustness for extreme operating environments. Accordingly, printed circuit board assemblies comprise: a non-conductive substrate having a plurality of planar conductive pathways disposed thereon; an electronic component that is in electrical communication with one or more of the planar conductive pathways and is configured to supply an electrical current thereto; a superficial metallic conductor overlaying one or more of the planar conductive pathways, at least in part, the superficial metallic conductor having an electrical connection to the electronic component and also being in electrical communication with the planar conductive pathways; and a conductive element in electrical communication with the superficial metallic conductor, the conductive element being configured to withdraw electrical current from the printed circuit board assembly.
1. A printed circuit board assembly comprising:
a non-conductive substrate having a plurality of planar conductive pathways disposed thereon;
an electronic component that is in electrical communication with one or more of the planar conductive pathways and is configured to supply an electrical current thereto;
a superficial metallic conductor overlaying one or more of the planar conductive pathways, at least in part, the superficial metallic conductor being electrically connected to the electronic component via one or more leads attached to the superficial metallic conductor and the electronic component; and
wherein the superficial metallic conductor is also in electrical communication with the planar conductive pathways;
a current-withdrawing conductive element in electrical communication with the superficial metallic conductor, and
wherein the current-withdrawing conductive element comprises a bus bar elevated above a surface of the non-conductive substrate by an electrically conductive standoff that establishes electrical communication between the superficial metallic conductor and the bus bar.
2. The printed circuit board assembly of claim 1 , wherein the superficial metallic conductor is laminated onto an underlying planar conductive pathway.
3. The printed circuit board assembly of claim 1 , wherein the superficial metallic conductor comprises a metal sheet.
4. The printed circuit board assembly of claim 1 , wherein the electrically conductive standoff is mechanically coupled to the superficial metallic conductor and the bus bar.
5. The printed circuit board assembly of claim 1 , wherein the electronic component is disposed on the non-conductive substrate.
6. The printed circuit board assembly of claim 2 , wherein the superficial metallic conductor matches the underlying planar conductive pathway in shape.
7. The printed circuit board assembly of claim 2 , wherein the superficial metallic conductor is soldered or brazed to the underlying planar conductive pathway.
8. The printed circuit board assembly of claim 3 , wherein the metal sheet comprises a copper sheet.
9. The printed circuit board assembly of claim 3 , wherein the metal sheet comprises a base metal and is surface-plated with a second metal.
10. A wellbore system comprising:
a downhole tool; and
a printed circuit board assembly in electrical communication with the downhole tool, the printed circuit board assembly comprising:
a non-conductive substrate having a plurality of planar conductive pathways disposed thereon;
an electronic component that is in electrical communication with one or more of the planar conductive pathways and is configured to supply an electrical current thereto;
a superficial metallic conductor overlaying one or more of the planar conductive pathways, at least in part, the superficial metallic conductor being electrically connected to the electronic component via one or more leads attached to the superficial metallic conductor and the electronic component: and
wherein the superficial metallic conductor is also in electrical communication with the planar conductive pathways;
a current-withdrawing conductive element in electrical communication with the superficial metallic conductor, and
wherein the current-withdrawing conductive element comprises a bus bar elevated above a surface of the non-conductive substrate by an electrically conductive standoff that establishes electrical communication between the superficial metallic conductor and the bus bar.
11. The wellbore system of claim 10 , wherein the downhole tool comprises a logging while drilling tool, a measurement while drilling tool, a rotary steerable drilling tool, or a sensor.
12. The wellbore system of claim 10 , wherein the superficial metallic conductor is laminated onto an underlying planar conductive pathway.
13. The wellbore system of claim 10 , wherein the superficial metallic conductor comprises a metal sheet.
14. The wellbore system of claim 10 , wherein the electrically conductive standoff is mechanically coupled to the superficial metallic conductor and the bus bar.
15. The wellbore system of claim 10 , wherein the electronic component is disposed on the non-conductive substrate.
16. The wellbore system of claim 10 , wherein the bus bar and the one or more planar conductive pathways are located on the same side of the non-conductive substrate.
17. The wellbore system of claim 12 , wherein the superficial metallic conductor matches the underlying planar conductive pathway in shape.
18. The wellbore system of claim 12 , wherein the superficial metallic conductor is soldered or brazed to the underlying planar conductive pathway.
19. The wellbore system of claim 13 , wherein the metal sheet comprises a copper sheet.