Multilayer styrenic resin sheet
Disclosed are a multilayer styrenic resin sheet including 10 to 50 laminated layers which are each made of a styrenic resin composition that includes 29 to 65 mass % of a styrene/conjugated diene copolymer (A), 51 to 15 mass % of a polystyrene resin (B) and 20 to 9 mass % of an impact-resistant polystyrene resin (C) and which each have an average thickness of 2 to 50 μm; and a packaging material (such as carrier tape or tray) for electronic components which is formed from the multilayer styrenic resin sheet. The melt tension of the styrenic resin composition at 220° C. is preferably 10 to 30 mN, and the content of the conjugated diene is preferably 10 to 25 mass % relative to 100 mass % of the copolymer (A).
1. A multilayer styrenic resin sheet comprising
10 to 50 stacked layers, each and every layer having an average thickness of 4 to 40 μm and being formed from a styrenic resin composition comprising 35 to 58 mass % of a styrene-conjugated diene block copolymer (A), 33 to 45 mass % of a polystyrene resin (B) and 9 to 20 mass % of a high impact polystyrene resin (C), wherein
a peak molecular weight of the styrene blocks of component (A) as measured by GPC is in the range of 30,000 to 120,000, and a half-width of a molecular weight distribution curve of the styrene blocks is in the range of 0.8 to 1.25,
a proportion of conjugated diene blocks in 100 mass % of component (A) is 10 to 25 mass %, and
each and every layer of the multilayer styrenic resin sheet is formed from substantially the same styrenic resin composition.
2. The multilayer styrenic resin sheet recited in claim 1 , wherein the styrenic resin composition has a melt tension of 10 to 30 mN at 220° C.
3. The multilayer styrenic resin sheet recited in claim 1 , wherein an average particle size of graft rubber in component (C) is 2.0 to 3.0 μm, and a rubber content of graft rubber in the sheet is 0.75 to 1.90 mass %.
4. An electronic component package formed from the multilayer styrenic resin sheet recited in claim 1 .
5. The electronic component package recited in claim 4 , which is a carrier tape.
6. The electronic component package recited in claim 4 , which is a tray.
7. The multilayer styrenic resin sheet recited in claim 1 , wherein the styrene-conjugated diene block copolymer (A) is a resin composed of plural blocks with three or more styrene blocks and two or more butadiene blocks.
8. The multilayer styrenic resin sheet recited in claim 1 , wherein the styrene-conjugated diene block copolymer (A) has a tapered block structure, wherein a composition ratio of styrene and butadiene varies continuously between blocks.