Compact structure of power-supply apparatus capable of minimizing electromagnetic noise
A power-supply apparatus is provided which includes a transformer, a primary semiconductor unit, a secondary semiconductor unit, and a secondary electronic device. Each of the primary semiconductor unit and the secondary semiconductor units has a plurality of semiconductor devices installed therein. The transformer, the primary semiconductor unit, the secondary semiconductor unit, and the secondary electronic device are electrically joined through connecting conductors. The transformer is laid on the primary semiconductor unit to make a first stack. Similarly, the secondary electronic device is laid on the secondary semiconductor unit. This permits the power-supply apparatus to be reduced in overall size thereof and minimizes adverse effects of electromagnetic noise to ensure the high efficiency in power supply operation.
1. A power-supply apparatus comprising:
a transformer equipped with a primary coil and a secondary coil;
a primary semiconductor unit in which semiconductor devices are installed, the primary semiconductor unit being joined to the primary coil of the transformer;
a secondary semiconductor unit in which semiconductor devices are installed, the secondary semiconductor unit being joined to the secondary coil of the transformer;
a secondary electronic device which makes up a secondary circuit along with the secondary semiconductor unit;
a plurality of connecting conductors which electrically connect among the transformer, the primary semiconductor unit, the secondary semiconductor unit, and the secondary electronic device;
a first stack made up of one of the transformer and the secondary electronic device and made up of the primary semiconductor unit; and
a second stack made up of the other of the transformer and the secondary electronic device and made up of the secondary semiconductor unit;
wherein the first stack and the second stack are configured to shield electromagnetic noise emitted from at least one of the primary semiconductor unit or the secondary semiconductor unit.
2. A power-supply apparatus as set forth in claim 1 , wherein at least one of the connecting conductors is disposed between the first stack and the second stack.
3. A power-supply apparatus as set forth in claim 1 , wherein the first stack is formed by the primary semiconductor unit and the transformer overlapping each other, and wherein a primary connecting conductor that is one of said connecting conductors connects between the primary semiconductor unit and the transformer and is arranged between the first stack and the second stack.
4. A power-supply apparatus as set forth in claim 1 , wherein the second stack is formed by the secondary semiconductor unit and the secondary electronic device overlapping each other, the secondary semiconductor unit constituting a rectifier circuit, wherein the secondary electronic device is a choke coil, and wherein a secondary connecting conductor that is one of said connecting conductors connects between the secondary semiconductor unit and the secondary electronic device and is arranged on a surface of the second stack which is farther away from the first stack.
5. A power-supply apparatus as set forth in claim 1 , wherein the connecting conductors are all disposed between the first stack and the second stack.