Push plate, mounting assembly, circuit board, and method of assembling thereof for ball grid array packages
A push plate that includes springs in the form of cantilever flexures and an inspection window is disclosed. The push plate provides a known, uniform, down force and minimal torque to a package to be tested. The cantilevers have a known, calculable down force producing stiffness. The window provides for viewing of the package during testing.
1. A push plate for securing a package to a package holder test pad or printed circuit board, comprising:
a window portion comprising an opening through the push plate configured to provide access to the package when the push plate is attached to the package holder test pad or printed circuit board;
a frame portion surrounding the window portion; and
springs attaching the frame portion to the window portion; wherein the springs are configured to flex to allow the window portion to flex within the frame portion to control the amount of torque applied to the package
wherein the frame portion comprises openings capable of receiving a force adjustable fixture for securing the push plate to the package holder test pad or printed circuit board; and wherein the frame portion is configured to apply a downward force upon the package in a direction towards the package holder test pad or printed circuit board when the push plate is attached to the package holder test pad or printed circuit board.
2. The push plate of claim 1 , further comprising:
a top surface and a bottom surface, the bottom surface comprising a recessed portion and a frame portion to securely position the package to be tested against the push plate.
3. The push plate of claim 1 , wherein the springs are defined by slots formed in the push plate.
4. The push plate of claim 1 , wherein the push plate includes four springs symmetrically surrounding the window portion.
5. The push plate of claim 1 , wherein the springs are cantilever flexures.
6. A push plate assembly for securing a package to a package holder test pad or printed circuit board, comprising:
a push plate comprising:
a window portion comprising an opening through the push plate;
a frame portion surrounding the window portion; and
springs attaching the frame portion to the window portion; wherein the springs are configured to flex to allow the window portion to flex within the frame portion to control the amount of torque applied to the package and
a ball grid array package holder;
wherein the opening is configured to provide access to the package when the push plate is attached to the ball grid array package holder;
and wherein the frame portion is configured to apply a downward force upon the package in a direction towards the package holder test pad or printed circuit board when the push plate is attached to the package holder test pad or printed circuit board.
7. The push plate assembly of claim 5 , wherein the push plate further comprises:
a top surface and a bottom surface, the bottom surface comprising a recessed portion to securely position the package to be tested against the push plate.
8. The push plate assembly of claim 5 , wherein the springs are defined by slots formed in the push plate.
9. The push plate assembly of claim 5 , wherein the push plate includes four springs symmetrically surrounding the window portion.
10. The push plate assembly of claim 5 , wherein the springs are cantilever flexures.
11. A method of visually inspecting a multi-chip module, comprising:
disposing a ball grid array package between a push plate and a pin array electrically connected to a printed circuit board; and
visually inspecting the ball grid array package through a window in the push plate while attached to the printed circuit board;
wherein the push plate comprises
a window portion comprising an opening through the push plate configured to provide access to the package when the push plate is attached to the package holder test pad or printed circuit board;
a frame portion surrounding the window portion; and
springs attaching the frame portion to the window portion;
wherein the springs are configured to flex to allow the window portion to flex within the frame portion to control the amount of torque applied to the ball grid array package;
and wherein the frame portion is configured to apply a downward force upon the package in a direction towards the package holder test pad or printed circuit board when the push plate is attached to the package holder test pad or printed circuit board.
12. The method of claim 11 , further comprising disposing the ball grid array package holder between the push plate and the printed circuit board.
13. The method of claim 11 , further comprising disposing the ball grid array package holder between the ball grid package and the pin array.
14. The method of claim 11 , wherein the printed circuit board comprises a test pad.
15. The method of claim 11 , wherein the push plate comprises cantilevered flexures that flex when the push plate is attached to the printed circuit board or the ball grid array package holder.