Heat dissipation structure, fabricating method, and electronic apparatus
Disclosed is a heat dissipation structure that includes a plurality of linear structures made of carbon, each of the linear structures having at least one of a first end and a second end being bent, and a coating layer formed on a surface of each of the linear structures, the coating layer having a part covering the other one of the first ends and the second ends of the linear structures, a thickness of the part allowing the corresponding linear structures to be plastically deformable.
1. A heat dissipation structure comprising:
a plurality of linear structures made of carbon, each of the linear structures having at least one of a first end and a second end being bent; and
a coating layer formed on a surface of each of the linear structures forming a plurality of coated linear structures, the coating layer having a first part covering the at least one of the first end and the second end, a thickness of the first part allowing the at least one of the first end and the second end of each of the coated linear structures to be elastically deformable, and a second part covering another one of the first end and the second end of each of the linear structures, a thickness of the second part allowing the another one of the first end and the second end of the coated linear structures to be plastically deformable.
2. The heat dissipation structure as claimed in claim 1 , wherein the another one of the first end and the second end of each of the linear structures is bent.
3. The heat dissipation structure as claimed in claim 1 , wherein the thickness of the part of the coating layer covering the another one of the first end and the second end of each of the linear structures is 20 nm or less.
4. The heat dissipation structure as claimed in claim 1 , wherein
the coating layer includes aluminum oxides, titanium oxides, hafnium oxides, iron oxides, indium oxides, lanthanum oxides, molybdenum oxides, niobium oxides, nickel oxides, ruthenium oxides, silicon oxides, vanadium oxides, tungsten oxides, yttrium oxides, or zirconium oxides.
5. The heat dissipation structure as claimed in claim 1 , further comprising a resin layer filling in between the coated linear structures.
6. A method of fabricating a heat dissipation structure, the method comprising:
forming a plurality of linear structures made of carbon on a substrate, each of the linear structures having a first end and a second end;
bending the first end of each of the linear structures; and
forming a coating layer on a surface of each of the linear structures by atomic layer deposition forming a plurality of coated linear structures, the coating layer having a first part covering the first bent end, a thickness of the first part allowing the first end of each of the coated linear structures to be elastically deformable, and a second part covering the second end of each of the linear structures, a thickness of the second part allowing the second end of the coated linear structures to be plastically deformable.
7. The method as claimed in claim 6 , wherein the forming the coating layer includes controlling thickness distribution of the coating layer by controlling a time period from supplying a first raw material gas to supplying a second raw material gas.
8. The method as claimed in claim 6 , further comprising: bending, after the forming the coating layer, the second end of the each of the coated linear structures by applying a load.
9. The method as claimed in claim 6 , wherein the thickness of the second part of the coating layer covering the second end of each of the linear structures is 20 nm or less.
10. The method as claimed in claim 6 , wherein
the coating layer includes aluminum oxides, titanium oxides, hafnium oxides, iron oxides, indium oxides, lanthanum oxides, molybdenum oxides, niobium oxides, nickel oxides, ruthenium oxides, silicon oxides, vanadium oxides, tungsten oxides, yttrium oxides, or zirconium oxides.
11. The method as claimed in claim 6 , further comprising: filling in, after the forming the coating layer, resin between the coated linear structures.
12. An electronic apparatus comprising:
a heat dissipation structure including:
a heat generator;
a heat dissipater;
a plurality of linear structures made of carbon, each of the linear structures having a first end and a second end each being bent; and
a coating layer formed on a surface of each of the linear structures forming a plurality of coated linear structures, the coating layer having a first part covering the at least one of the first end and the second end, a thickness of the first part allowing the at least one of the first end and the second end of each of the coated linear structures to be elastically deformable, and a second part covering another one of the first end and the second end of each of the linear structures, a thickness of the second part allowing the another one of the first end and the second end of the coated linear structures to be plastically deformable, wherein
a lateral surface of the one of the first and the second bent end of each of the coated linear structures is partially in contact with one of the heat generator and the heat dissipater, and
a lateral surface of the another one of the first and the second bent end of the coated linear structures is partially in contact with another one of the heat generator and the heat dissipater.