Display panel and encapsulation method thereof
Embodiments of the present invention disclose a display panel and an encapsulation method thereof, and relate to the field of display technology. The display panel comprises a first substrate and a second substrate which are disposed in opposition to each other. The first substrate and the second substrate are encapsulated by a sealant. In a non-display area of the display panel, a first adsorption layer is disposed on one of the first substrate and the second substrate, and a second adsorption layer is disposed on the other of the first substrate and the second substrate. The first adsorption layer and the second adsorption layer may be attracted to each other by magnetic force. Embodiments of the present invention can effectively avoid the separation of the first substrate and the second substrate due to the stress released during the process of melting the sealant, thereby improving the problem of poor encapsulation caused thereby.
1. A display panel comprising a first substrate and a second substrate which are disposed in opposition to each other, the first substrate and the second substrate encapsulated by a sealant, wherein in a non-display area of the display panel, a first attraction layer is disposed on one of the first substrate and the second substrate, and a second attraction layer is disposed on the other of the first substrate and the second substrate, and the first attraction layer and the second attraction layer are attracted to each other by magnetic force, the first attraction layer disposed on a side of the first substrate facing the second substrate or disposed on a side of the second substrate facing the first substrate.
2. The display panel according to claim 1 , wherein the first attraction layer is made from ferromagnetic material, and the second attraction layer includes an electromagnet.
3. The display panel according to claim 2 , wherein the first attraction layer includes a portion disposed on an outer side of the sealant and/or a portion disposed on an inner side of the sealant.
4. The display panel according to claim 3 , wherein the first attraction layer is disposed in a vicinity of the sealant.
5. The display panel according to claim 1 , wherein the first attraction layer overlaps at least partly with an orthographic projection of the second attraction layer onto the first substrate or the second substrate.
6. The display panel according to claim 2 , wherein the electromagnet includes a plurality of independently controlled sub-electromagnets which are disposed surrounding a display area of the display panel.
7. The display panel according to claim 6 , wherein a plane in which a pattern formed by connecting magnetic poles of the plurality of sub-electromagnets in a sequential manner lies is parallel to a plane in which the first attraction layer lies.
8. The display panel according to claim 2 , wherein the display panel further comprises an isolation layer disposed between the electromagnet and the one of the first substrate and the second substrate which is provided with the electromagnet, and the isolation layer is made from non-ferromagnetic material.
9. The display panel according to claim 2 , wherein the electromagnet is detachably disposed on the outer side of the first substrate or the second substrate.
10. The display panel according to claim 2 , wherein a thickness of the first attraction layer is smaller than that of the melted sealant.
11. The display panel according to claim 1 , wherein the display panel is a light emitting diode display panel.
12. An encapsulation method of a display panel comprising a first substrate and a second substrate which are disposed in opposition to each other, the encapsulation method comprising:
disposing a solid sealant on at least one of the first substrate and the second substrate;
disposing a first attraction layer on one of the first substrate and the second substrate, the first attraction layer disposed on a side of the first substrate facing the second substrate or disposed on a side of the second substrate facing the first substrate;
disposing a second attraction layer on the other of the first substrate and the second substrate;
aligning the first substrate and the second substrate;
melting the sealant to connect the first substrate and the second substrate, wherein when the sealant is melted, the first attraction layer and the second attraction layer are attracted to each other by magnetic force; and
solidifying the melted sealant.
13. The encapsulation method according to claim 12 , wherein:
the first attraction layer is made from ferromagnetic material, and the second attraction layer includes an electromagnet;
when melting the sealant, power is supplied to the electromagnet such that the second attraction layer generates magnetic force; and
when solidifying the melted sealant, the power supplied to the electromagnet is stopped.
14. The encapsulation method according to claim 13 , wherein:
when melting the sealant, a laser is used to melt the sealant;
the electromagnet includes a plurality of independently controlled sub-electromagnets which are disposed surrounding a display area of the display panel; and
when melting the sealant, power is supplied to the sub-electromagnet corresponding to a region being irradiated by the laser.
15. The encapsulation method according to claim 14 , wherein:
a strength of an electric signal applied to the sub-electromagnet is increased as an intensity of the laser irradiating the region corresponding to the sub-electromagnet is increased; and
the strength of the electric signal applied to the sub-electromagnet is decreased as the intensity of the laser irradiating the region corresponding to the sub-electromagnet is decreased.
16. The encapsulation method according to claim 12 , wherein the display panel is a light emitting diode display panel.