IP Library › Granted Patent US 9,672,984
Granted Patent B2
US 9,672,984 · App. 14/484,614 · Granted Jun 6, 2017

Multilayer ceramic electronic component and manufacturing method thereof

Inventors: Hong Seok Kim (Suwon-Si, KR); Chung Eun Lee (Suwon-Si, KR); Chang Hoon Kim (Suwon-Si, KR); Doo Young Kim (Suwon-Si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/0085H01G4/12H01G4/30
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Quick Facts
Patent No.
US 9,672,984
App. No.
14/484,614
Granted
Jun 6, 2017
Kind
B2
Abstract

There are provided a multilayer ceramic electronic component capable of preventing problems occurring due to a difference in sintering behavior between ceramic layers and internal electrodes and having excellent reliability, and a manufacturing method thereof. The multilayer ceramic electronic component may include a ceramic body including a plurality of ceramic layers; and internal electrodes disposed in the ceramic body. The internal electrodes may contain a conductive ceramic oxide.

Claims (24)

1. A multilayer ceramic electronic component comprising:

a ceramic body including a plurality of ceramic layers; and

internal electrodes disposed inside the ceramic body,

wherein the internal electrodes contain a conductive ceramic oxide, and

the conductive ceramic oxide is a La 1-x (Ca or Sr) x Co 1-y Fe y O 3 based metal oxide (0≦x<1 and 0≦y<1).

2. The multilayer ceramic electronic component of claim 1 , wherein 0.1≦x<0.4 and 0.2≦y<0.8.

3. The multilayer ceramic electronic component of claim 1 , wherein the internal electrodes contain 90 wt % or more of the conductive ceramic oxide.

4. A multilayer ceramic electronic component comprising:

a ceramic body including a plurality of ceramic layers; and

internal electrodes disposed inside the ceramic body,

wherein the internal electrodes contain a conductive ceramic oxide, and

the conductive ceramic oxide contains a silicon carbide (SiC).

5. A method of manufacturing a multilayer ceramic electronic component, the method comprising:

preparing a plurality of ceramic sheets;

forming internal electrode patterns on the ceramic sheets using a conductive ceramic oxide;

stacking the ceramic sheets having the internal electrode patterns to form a ceramic multilayer body; and

sintering the ceramic multilayer body to form a ceramic body,

wherein the conductive ceramic oxide is a La 1-x (Ca or Sr) x Co 1-y Fe y O 3 based metal oxide (0≦x<1 and 0≦y<1).

6. A method of manufacturing a multilayer ceramic electronic component, the method comprising:

preparing a plurality of ceramic sheets;

forming internal electrode patterns on the ceramic sheets using a conductive ceramic oxide;

stacking the ceramic sheets having the internal electrode patterns to form a ceramic multilayer body; and

sintering the ceramic multilayer body to form a ceramic body,

wherein the conductive ceramic oxide contains a silicon carbide (SiC).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2014
From: KIM, HONG SEOK; LEE, CHUNG EUN; KIM, CHANG HOON; KIM, DOO YOUNG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 033729/0051 →
Priority Claims (1)
KR 10-2014-0077870 · Jun 25, 2014 · national
Continuity (1)
Related Publication 20150380160A1 · Dec 31, 2015