Optical sensor arrangement and method of producing an optical sensor arrangement

1. An optical proximity sensor arrangement, comprising a three-dimensional integrated circuit further comprising:

a first layer comprising a light-emitting device, a second layer comprising a light-detector and a driver circuit electrically connected to the light-emitting device and to the light-detector and configured to control the operation of the light-emitting device and the light-detector and wherein the second layer comprises a second light barrier further comprising through silicon vias designed into a substrate, and

a mold layer comprising a first light-barrier between the light-emitting device and the light-detector configured to block light from being transmitted directly from the light-emitting device to the light-detector.

2. The optical sensor arrangement according to claim 1 , wherein the mold layer comprises an optically opaque mold material.

3. The optical sensor arrangement according to claim 1 , wherein the mold layer comprises a wafer-level mold structure.

4. The optical sensor arrangement according to claim 1 , wherein the mold layer is at least partially connected to a main surface of the second layer and comprises a first aperture to which the first layer is attached such that light from the light-emitting device can be emitted through the first aperture.

5. The optical sensor arrangement according to claim 4 , wherein the mold layer comprises a second aperture to which the light-detector is attached such that light can reach the light-detector to be detected.

6. The optical sensor arrangement according to claim 1 , wherein the second layer comprises the substrate into which the light-detector and the driver circuit are integrated.

7. The optical sensor arrangement according to claim 6 , wherein the substrate comprises an active interposer, in particular connected to a redistribution layer or an embedded wafer level ball grid array.

8. The optical sensor arrangement according to claim 1 , wherein the light-emitting device is electrically connected to the second layer by means of a metallization structured topology, a bond wire or a redistribution layer.

9. The optical sensor arrangement according to claim 1 , wherein

the first layer is stacked onto the main surface of the second layer or

the first layer is embedded into a recess formed in the second layer or

the first layer is stacked onto a further main surface of the second layer opposite to the main surface and wherein the first aperture extends through the second layer.

10. The optical sensor arrangement according to claim 1 , wherein the light-detector and/or light-emitting device are covered by an optical element and wherein the optical element is a lens and/or zone plate, in particular a nano-imprinted lens.

11. A method of producing an optical proximity sensor arrangement, comprising the steps of:

integrating a light-emitting device into a first layer,

integrating a light-detector and a driver circuit into a second layer wherein the second layer comprises a second light barrier further comprising through silicon vias designed into a substrate,

electrically connecting the light-emitting device to the driver circuit and to the light-detector,

molding a mold layer comprising a first light-barrier between the light-emitting device and the light-detector configured to block light from being transmitted directly from the light-emitting device to the light-detector and

integrating the first layer, the second layer and the mold layer into a three dimensional integrated circuit.

12. The method according to claim 11 , wherein the molding involves molding at a waver-level, in particular using an optically opaque material.

13. The method according to claim 11 , wherein

the first layer is stacked onto the second layer, in particular stacked by means of die-to-wafer stacking and the first layer is electrically connected to the second layer by means of a metallization structured topology, a bond wire or a redistribution layer, in particular by means of a metallization structured topology with through-silicon-vias, or

the first layer is embedded into a recess formed in the second layer.

14. The method according to claim 11 , further comprising the steps of

connecting the mold layer at least partially to a main surface of the second layer and providing a first aperture in the mold layer to which the first layer is attached such that light from the light-emitting device can be emitted through the first aperture and/or

provide a second aperture to which the light-detector is attached such that light can reach the light-detector to be detected.