MEMS die and methods with multiple-pressure sealing
The present subject matter relates to systems and methods for sealing one or more MEMS devices within an encapsulated cavity. A first material layer can be positioned on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer. At least the first cavity can be exposed to a first atmosphere and sealed while it is exposed to the first atmosphere while not sealing the second cavity. The second cavity can then be exposed to a second atmosphere that is different than the first atmosphere, and the second cavity can be sealed while it is exposed to the second atmosphere.
1. A micro-electro-mechanical systems (MEMS) die comprising:
a substrate;
a first material layer positioned on the substrate, the first material layer comprising at least one cavity formed therein;
a lid layer positioned on the first material layer, the lid layer comprising first vent holes and second vent holes in communication with the at least one cavity;
a first sealing layer deposited on the lid layer and sealing the first vent holes; and
a second sealing layer deposited on the lid layer and the first sealing layer, the second sealing layer sealing the second vent holes.
2. The micro-electro-mechanical systems (MEMS) die of claim 1 , wherein the lid layer comprises one or more micro-electro-mechanical systems (MEMS) devices positioned on the first material layer.
3. The micro-electro-mechanical systems (MEMS) die of claim 1 , wherein the first vent holes are smaller than the second vent holes.
4. The micro-electro-mechanical systems (MEMS) die of claim 1 , wherein the at least one cavity comprises at least a first cavity and a second cavity, wherein the first cavity is connected to the second cavity within the first material layer.
5. The micro-electro-mechanical systems (MEMS) die of claim 1 , comprising one or more micro-electro-mechanical systems (MEMS) devices positioned within the at least one cavity.
6. A micro-electro-mechanical systems (MEMS) die of claim 1 , comprising:
a substrate;
a first material layer positioned on the substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer;
a lid layer positioned on the first material layer, the lid layer comprising first vent holes in communication with the first cavity and second vent holes in communication with the second cavity;
at least one additional cavity having one or more openings out of the first material layer, wherein the lid layers comprises additional vent holes in communication with the at least one additional cavity;
a first sealing layer deposited on the lid layer and sealing the first vent holes;
a second sealing, layer deposited on the lid layer and the first sealing layer, the second sealing layer sealing the second vent holes; and
at least one additional sealing layer deposited on the lid layer, the first sealing layer, and the second sealing layer, the at least one additional sealing layer sealing the additional vent holes.