Method for designing layout of semiconductor device and method for manufacturing semiconductor device using the same
A method of manufacturing a semiconductor device includes providing pre-conductive lines and post-conductive lines for forming a first logic cell and a second logic cell, which are adjacent to each other, and a dummy cell and a third logic cell, which are adjacent to each other. A first conductive line, adjacent to the second logic cell, from among conductive lines of the first logic cell is spaced a first reference distance apart from a second conductive line, adjacent to the first logic cell, from among conductive lines of the second logic cell. A dummy line, which is adjacent to the third logic cell, from among conductive lines of the dummy cell is spaced a second reference distance apart from a third conductive line, which is adjacent to the dummy cell, from among conductive lines of the third logic cell. The second reference distance is greater than the first reference distance.
1. A method of manufacturing a semiconductor device, the method comprising:
providing pre-conductive lines and post-conductive lines for forming a first logic cell, a second logic cell, a dummy cell, and a third logic cell, the first logic cell and the second logic cell being adjacent to each other and the dummy cell and the third logic cell being adjacent to each other,
wherein a first conductive line, which is adjacent to the second logic cell, from among conductive lines of the first logic cell is spaced a first reference distance apart from a second conductive line, which is adjacent to the first logic cell, from among conductive lines of the second logic cell,
wherein a dummy line, which is adjacent to the third logic cell, from among conductive lines of the dummy cell is spaced a second reference distance apart from a third conductive line, which is adjacent to the dummy cell, from among conductive lines of the third logic cell, and
wherein the second reference distance is greater than the first reference distance.
2. The method of claim 1 , wherein the first reference distance and the second reference distance are set based on a resolution of a photolithography process for forming the pre-conductive lines and the post-conductive lines.
3. The method of claim 1 , wherein the first conductive line and the second conductive line are formed by a patterning process using different photomasks, and wherein the dummy line and the third conductive line are formed by a patterning process using a same photomask.
4. The method of claim 3 , wherein a fourth conductive line, which is adjacent to the dummy cell, from among conductive lines of the second logic cell and the third conductive line is formed by a patterning process using different photomasks.
5. The method of claim 1 , wherein at least a portion of the first conductive line, the second conductive line, the third conductive line, and the dummy line is arranged in a first direction perpendicular to a direction in which the first logic cell, the second logic cell, the third logic cell, and the dummy cell are arranged.
6. The method of claim 5 , further comprising:
providing first power lines and second power lines arranged in a second direction perpendicular to the first direction before providing the pre-conductive lines and the post-conductive lines.
7. The method of claim 6 , wherein a ground voltage is provided to one from among the first power lines and the second power lines.
8. The method of claim 1 , wherein the dummy cell is one from among a filler, a filling capacitor, and a spare cell.
9. The method of claim 1 , further comprising:
before forming the pre-conductive lines and the post-conductive lines,
forming an active pattern on a substrate,
forming a gate pattern crossing the active pattern; and
forming a source area and a drain area on the active pattern located at opposite sides of the gate pattern,
wherein at least one of the pre-conductive lines is electrically connected to the gate pattern and at least one of the post-conductive lines is electrically connected to the gate pattern, and
wherein at least another line of the pre-conductive lines is electrically connected to the source area and the drain area and at least another line of the post-conductive lines is electrically connected to the source area and the drain area.
10. A method of manufacturing a semiconductor device, the method comprising:
providing a first conductive line, which is adjacent to a second logic cell, from among conductive lines of a first logic cell, the first conductive line being spaced a first reference distance apart from a second conductive line, which is adjacent to the first logic cell, from among conductive lines of the second logic cell; and
providing a dummy line, which is adjacent to a third logic cell, from among conductive lines of a dummy cell, the dummy line being spaced a second reference distance apart from a third conductive line, which is adjacent to the dummy cell, from among conductive lines of the third logic cell,
wherein the second reference distance is greater than the first reference distance.
11. The method of claim 10 , wherein the first reference distance and the second reference distance are set based on a resolution of a photolithography process for forming pre-conductive lines and post-conductive lines.
12. The method of claim 10 , wherein the first conductive line and the second conductive line are formed by a patterning process using different photomasks, and
wherein the dummy line and the third conductive line are formed by a patterning process using a same photomask.
13. The method of claim 10 , wherein the dummy cell is one from among a filler, a filling capacitor, and a spare cell.