Encapsulation film
Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.
1. An encapsulating film, comprising:
a first layer comprising a resin component having a water vapor transmission rate (WVTR) of 50 g/m 2 ·day or less; and
a second layer comprising a curable resin composition and having a ratio (M 1 /M 2 ) of the tensile modulus (M 1 ) at 25° C. after curing of the first layer to the tensile modulus (M 2 ) at 25° C. after curing of the second layer of 1 ×10 −6 to 0.5,
wherein the second layer is disposed on one or both surfaces of the first layer,
wherein the first layer is a pressure-sensitive adhesive layer; wherein the first layer has a contact angle of 80 to 150 degrees; and
wherein the WVTR is measured in a thickness direction of a layer which is formed from the resin component to have a thickness of 100μm at 100° F. and a relative humidity of 100%.
2. The film according to claim 1 , wherein the tensile modulus at 25° C. after curing of the first layer is 0.001 to 400MPa.
3. The film according to claim 1 , wherein the tensile modulus at 25° C. after curing of the second layer is 400 to 1000 MPa.
4. The film according to claim 1 , wherein the first layer further includes a moisture scavenger.
5. The film according to claim 4 , wherein the first layer includes the moisture scavenger of 5 to 250 parts by weight with respect to 100 parts by weight of the resin component.
6. The film according to claim 1 , wherein the second layer includes the moisture scavenger at less than 5 parts by weight with respect to 100 parts by weight of a total solid content of the second layer.
7. The film according to claim 1 , wherein the second layer is a solid or semi-solid at room temperature.
8. The film according to claim 7 , wherein the second layer is in a non-cured state.
9. The film according to claim 1 , wherein the second layer includes the curable resin composition in a film.
10. An electronic device comprising:
an upper substrate;
a bottom substrate; and
an encapsulating layer which includes the film of claim 1 encapsulating a diode between the upper and bottom substrates.
11. The electronic device according to claim 10 , wherein the diode is formed on a surface of the bottom substrate facing the upper substrate, and the second layer of the film is in contact with the bottom substrate.
12. A method of manufacturing an electronic device, comprising:
laminating the film of claim 1 on a substrate on which a diode is formed such that the second layer of the film is in contact with the diode.