Wiring board with built-in electronic component
A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.
1. A wiring board with a built-in electronic component, comprising:
a core substrate;
an electronic component positioned in the core substrate and having a plurality of surface electrodes;
a first upper-layer structure formed on a first surface of the core substrate and comprising an upper wiring layer and an upper insulation layer;
a second upper-layer structure formed on a second surface of the core substrate on an opposite side with respect to the first surface of core substrate and comprising an upper wiring layer and an upper insulation layer;
a plurality of stacked via conductors formed in the core substrate and the first upper-layer structure such that the plurality of stacked via conductors is connected to one of the surface electrodes of the electronic component; and
a through-stacked via structure comprising a plurality of via conductors such that the via conductors are formed in and stacked through the core substrate, the first upper-layer structure and the second upper-layer structure,
wherein the core substrate has a component-accommodating layer, a first connection layer positioned on a first surface of the component-accommodating layer, and a second connection layer positioned on a second surface on an opposite side with respect to the first surface of the component-accommodating layer, the component-accommodating layer includes a plurality of inner wiring layers and a plurality of inner insulation layers and has a cavity accommodating the electronic component, the first connection layer includes an inner wiring layer and an inner insulation layer, the second connection layer includes a plurality of inner wiring layers and a plurality of inner insulation layers such that the second connection layer includes a greater number of inner wiring layers and a greater number of inner insulation layers than the first connection layer, and the plurality of stacked via conductors is formed through the first connection layer of the core substrate and the first upper-layer structure.
2. A wiring board with a built-in electronic component according to claim 1 , wherein the first upper-layer structure has an IC mounting portion formed on a surface of the first upper-layer structure.
3. A wiring board with a built-in electronic component according to claim 1 , further comprising:
a plurality of second stacked via conductors formed through the second connection layer of the core substrate and the second upper-layer structure such that the plurality of second stacked via conductors is connected to the one of the surface electrodes of the electronic component on the second surface of the component-accommodating layer.
4. A wiring board with a built-in electronic component according to claim 2 , further comprising:
a plurality of second stacked via conductors formed through the second connection layer of the core substrate and the second upper-layer structure such that the plurality of second stacked via conductors is connected to the one of the surface electrodes of the electronic component on the second surface of the component-accommodating layer.
5. A wiring board with a built-in electronic component according to claim 1 further comprising:
a via conductor formed in the component-accommodating layer such that the via conductor is connected to the one of the surface electrodes of the electronic component on the second surface of the component-accommodating layer; and
a plurality of second stacked via conductors formed through the second connection layer of the core substrate and the second upper-layer structure,
wherein the first connection layer includes a plurality of inner wiring layers and a plurality of inner insulation layers, the plurality of stacked via conductors has a stacked structure formed through the inner insulation layers of the first connection layer such that the plurality of stacked via conductors and the one of the surface electrodes of the electronic component form a first surface electrode via structure, and the plurality of second stacked via conductors has a stacked structure such that the stacked via structure of the second stacked via conductors is shifted from the via conductor in the component-accommodating layer and forms a second surface electrode via structure with the via conductor in the component-accommodating layer.
6. A wiring board with a built-in electronic component according to claim 2 , further comprising:
a via conductor formed in the component-accommodating layer such that the via conductor is connected to the one of the surface electrodes of the electronic component on the second surface of the component-accommodating layer; and
a plurality of second stacked via conductors formed through the second connection layer of the core substrate and the second upper-layer structure,
wherein the first connection layer includes a plurality of inner wiring layers and a plurality of inner insulation layers, the plurality of stacked via conductors has a stacked structure formed through the inner insulation layers of the first connection layer such that the plurality of stacked via conductors and the one of the surface electrodes of the electronic component form a first surface electrode via structure, and the plurality of second stacked via conductors has a stacked structure such that the stacked via structure of the second stacked via conductors is shifted from the via conductor in the component-accommodating layer and forms a second surface electrode via structure with the via conductor in the component-accommodating layer.
7. A wiring board with a built-in electronic component according to claim 1 , wherein each of the stacked via conductors is a filled via conductor comprising plating filled in a via hole.
8. A wiring board with a built-in electronic component according to claim 2 , wherein each of the stacked via conductors is a filled via conductor comprising plating filled in a via hole.
9. A wiring board with a built-in electronic component according to claim 3 , wherein each of the stacked via conductors is a filled via conductor comprising plating filled in a via hole, and each of the second stacked via conductors is a filled via conductor comprising plating filled in a via hole.
10. A wiring board with a built-in electronic component according to claim 4 , wherein each of the stacked via conductors is a filled via conductor comprising plating filled in a via hole, and each of the second stacked via conductors is a filled via conductor comprising plating filled in a via hole.
11. A wiring board with a built-in electronic component according to claim 5 , wherein each of the stacked via conductors is a filled via conductor comprising plating filled in a via hole, each of the second stacked via conductors is a filled via conductor comprising plating filled in a via hole, and the via conductor in the component-accommodating layer is a filled via conductor comprising plating filled in a via hole.
12. A wiring board with a built-in electronic component according to claim 6 , wherein each of the stacked via conductors is a filled via conductor comprising plating filled in a via hole, each of the second stacked via conductors is a filled via conductor comprising plating filled in a via hole, and the via conductor in the component-accommodating layer is a filled via conductor comprising plating filled in a via hole.
13. A wiring board with a built-in electronic component according to claim 1 , wherein the inner insulation layers in the core substrate comprise at least nine inner insulation layers, and the core substrate forms a thickness which is at least 70% of a total thickness of the wiring board.
14. A wiring board with a built-in electronic component according to claim 2 , wherein the inner insulation layers in the core substrate comprise at least nine inner insulation layers, and the core substrate forms a thickness which is at least 70% of a total thickness of the wiring board.
15. A wiring board with a built-in electronic component according to claim 3 , wherein the inner insulation layers in the core substrate comprise at least nine inner insulation layers, and the core substrate forms a thickness which is at least 70% of a total thickness of the wiring board.
16. A wiring board with a built-in electronic component according to claim 5 , wherein the inner insulation layers in the core substrate comprise at least nine inner insulation layers, and the core substrate forms a thickness which is at least 70% of a total thickness of the wiring board.
17. A wiring board with a built-in electronic component according to claim 7 , wherein the inner insulation layers in the core substrate comprise at least nine inner insulation layers, and the core substrate forms a thickness which is at least 70% of a total thickness of the wiring board.
18. A wiring board with a built-in electronic component according to claim 1 , wherein the plurality of stacked via conductors has a stacked structure, and each of the stacked via conductors is a filled via conductor comprising plating filled in a via hole.
19. A wiring board with a built-in electronic component according to claim 7 , further comprising:
a plurality of second stacked via conductors formed through the second connection layer of the core substrate and the second upper-layer structure such that the plurality of second stacked via conductors is connected to one of the surface electrodes of the electronic component on the second surface of the component-accommodating layer.
20. A wiring board with a built-in electronic component according to claim 19 , wherein each of the stacked via conductors is a filled via conductor comprising plating filled in a via hole, and each of the second stacked via conductors is a filled via conductor comprising plating filled in a via hole.