IP Library Granted Patent US 9,703,199
Granted Patent B2
US 9,703,199 · App. 14/149,026 · Granted Jul 11, 2017

Substrate processing apparatus

Inventors: Toru Asano (Kyoto, JP); Yukio Toriyama (Kyoto, JP); Takashi Taguchi (Kyoto, JP); Tsuyoshi Mitsuhashi (Kyoto, JP)
Assignee: SCREEN Semiconductor Solutions Co., Ltd.
G03F7/30H01L21/67028H01L21/67034H01L21/67051H01L21/67178H01L21/67225
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Quick Facts
Patent No.
US 9,703,199
App. No.
14/149,026
Granted
Jul 11, 2017
Kind
B2
Abstract

A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes forming a photosensitive film on the substrate by said first processing unit before exposure processing by said exposure device and applying washing processing to the substrate by supplying a washing liquid to the substrate in said second processing unit after the formation of said photosensitive film and before the exposure processing. The method also includes applying drying processing to the substrate in said second processing unit after the washing processing by said second processing unit and before the exposure processing and applying development processing to the substrate by said third processing unit after the exposure processing. Applying the drying processing to the substrate includes the step of supplying an inert gas onto the substrate, to which the washing liquid is supplied.

Claims (27)

1. A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device that applies exposure processing to a substrate by a liquid immersion method, and includes first, second and third processing units, the method comprising the steps of:

forming a photosensitive film made of a photosensitive material on an upper surface of the substrate by the first processing unit before the exposure processing by the exposure device;

rotating the substrate about an axis vertical to the substrate while holding the substrate substantially horizontally in the second processing unit after the formation of the photosensitive film by the first processing unit and before the exposure processing by the exposure device;

forming a liquid layer of a rinse liquid on a whole upper surface of the photosensitive film on the rotated substrate, to previously allow part of a component of the photosensitive material within the photosensitive film to be eluted in the liquid layer from within the photosensitive film in the second processing unit such that the component of the photosensitive material within the photosensitive film is not eluted from within the photosensitive film on the substrate during the exposure processing by the exposure device;

removing the liquid layer on the photosensitive film after the part of the component of the photosensitive material is eluted;

transporting the substrate after the removal of the liquid layer to the exposure device to apply the exposure processing to the photosensitive film on the substrate by the exposure device; and

applying development processing to the substrate by the third processing unit after the exposure processing by the exposure device.

2. The substrate processing method according to claim 1 , wherein the step of forming the liquid layer of the rinse liquid includes forming the liquid layer of the rinse liquid having an upper surface that is exposed to atmosphere and in a free state on the upper surface of the photosensitive film on the substrate.

3. The substrate processing method according to claim 1 , further comprising the step of applying thermal processing to the photosensitive film on the substrate after the formation of the photosensitive film by the first processing unit and before the exposure processing by the exposure device, wherein

the step of forming the liquid layer of the rinse liquid includes forming the liquid layer of the rinse liquid on a dried surface of the photosensitive film on the substrate after the thermal processing and before the exposure processing by the exposure device.

4. A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device that applies exposure processing to a substrate by a liquid immersion method, and includes first, second and third processing units, the method comprising the steps of:

forming a photosensitive film made of a photosensitive material on an upper surface of the substrate by the first processing unit before the exposure processing by the exposure device;

rotating the substrate about an axis vertical to the substrate while holding the substrate substantially horizontally in the second processing unit after the formation of the photosensitive film by the first processing unit and before the exposure processing by the exposure device;

supplying a rinse liquid onto the photosensitive film on the rotated substrate such that a liquid layer of the rinse liquid is formed on a whole upper surface of the photosensitive film on the substrate in the second processing unit;

holding the liquid layer on the upper surface of the photosensitive film on the rotated substrate such that part of a component of the photosensitive material within the photosensitive film is eluted in the liquid layer from within the photosensitive film;

removing the liquid layer on the photosensitive film in the second processing unit after the part of the component of the photosensitive material is eluted;

transporting the substrate after the removal of the liquid layer to the exposure device to apply the exposure processing to the photosensitive film on the substrate by the exposure device; and

applying development processing to the substrate by the third processing unit after the exposure processing by the exposure device.

5. A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device that applies exposure processing to a substrate by a liquid immersion method, and includes first, second and third processing units, the method comprising the steps of:

forming a photosensitive film made of a photosensitive material on an upper surface of the substrate by the first processing unit before the exposure processing by the exposure device;

rotating the substrate about an axis vertical to the substrate while holding the substrate substantially horizontally in the second processing unit after the formation of the photosensitive film by the first processing unit and before the exposure processing by the exposure device;

forming a liquid layer of a rinse liquid on a whole upper surface of the photosensitive film on the rotated substrate by supplying the rinse liquid onto the photosensitive film on the substrate such that part of a component of the photosensitive material of the photosensitive film is eluted in the liquid layer in the second processing unit;

stopping the supply of the rinse liquid after the formation of the liquid layer;

removing the liquid layer on the photosensitive film after the stopping of the supply of the rinse liquid;

transporting the substrate after the removal of the liquid layer to the exposure device to apply the exposure processing to the photosensitive film on the substrate by the exposure device; and

applying development processing to the substrate by the third processing unit after the exposure processing by the exposure device, wherein

the step of forming the liquid layer includes previously allowing the part of the component of the photosensitive material within the photosensitive film to be eluted in the liquid layer from within the photosensitive film such that the component of the photosensitive material within the photosensitive film is not eluted from within the photosensitive film on the substrate during the exposure processing by the exposure device.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY'S ADDRESS PREVIOUSLY RECORDED AT REEL: 033831 FRAME: 0817. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Oct 22, 2014
From: SOKUDO CO., LTD.
To: SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 034034/0488 →
CHANGE OF NAME Recorded Sep 26, 2014
From: SOKUDO CO., LTD.
To: SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 033831/0817 →
Priority Claims (3)
JP 2004-353120 · Dec 6, 2004 · national
JP 2005-095783 · Mar 29, 2005 · national
JP 2005-267331 · Sep 14, 2005 · national
Continuity (3)
Division 12698862 · Feb 2, 2010
Division 11295216 · Dec 6, 2005
Related Publication 20140120477A1 · May 1, 2014