Semiconductor device and display device including the same
A change in electrical characteristics in a semiconductor device including an oxide semiconductor film is inhibited, and the reliability is improved. The semiconductor device includes a gate electrode, a first insulating film over the gate electrode, an oxide semiconductor film over the first insulating film, a source electrode electrically connected to the oxide semiconductor film, a drain electrode electrically connected to the oxide semiconductor film, a second insulating film over the oxide semiconductor film, the source electrode, and the drain electrode, a first metal oxide film over the second insulating film, and a second metal oxide film over the first metal oxide film. The first metal oxide film contains at least one metal element that is the same as a metal element contained in the oxide semiconductor film. The second metal oxide film includes a region where the second metal oxide film and the first metal oxide film are mixed.
1. A manufacturing method of a semiconductor device comprising the steps of:
forming a gate electrode;
forming a first insulating film over the gate electrode;
forming an oxide semiconductor film over the first insulating film;
forming a second insulating film over the oxide semiconductor film;
forming a first metal oxide film over the second insulating film;
adding oxygen to the second insulating film through the first metal oxide film; and
forming a second metal oxide film over the first metal oxide film,
wherein the oxide semiconductor film includes indium,
wherein the second insulating film includes silicon,
wherein the first metal oxide film is a conductive film containing indium,
wherein the second metal oxide film is an insulating film containing aluminum, and
wherein the second metal oxide film includes a region where the second metal oxide film and the first metal oxide film are mixed.
2. The manufacturing method of a semiconductor device according to claim 1 ,
wherein the second metal oxide film is formed by a sputtering method, and
wherein the region is formed in the step of forming the second metal oxide film.
3. The manufacturing method of a semiconductor device according to claim 1 further comprising steps of:
forming a source electrode electrically connected to the oxide semiconductor film; and
forming a drain electrode electrically connected to the oxide semiconductor film.
4. The manufacturing method of a semiconductor device according to claim 3 , wherein each of the source electrode and the drain electrode is over the second metal oxide film.
5. The manufacturing method of a semiconductor device according to claim 1 further comprising a step of forming a conductive film over the second metal oxide film.
6. The manufacturing method of a semiconductor device according to claim 1 ,
wherein the oxide semiconductor film comprises In, Zn, and M and
wherein M is Ti, Ga, Y, Zr, La, Ce, Nd, Sn, or Hf.
7. The manufacturing method of a semiconductor device according to claim 1 ,
wherein the oxide semiconductor film includes a crystal part, and
wherein the crystal part has c-axis alignment.
8. The manufacturing method of a semiconductor device according to claim 1 , wherein oxygen molecules of more than or equal to 8.0×10 14 /cm 2 are detected from the second insulating film by thermal desorption spectroscopy after the step of adding the oxygen to the second insulating film.
9. A manufacturing method of a semiconductor device comprising the steps of:
forming a gate electrode;
forming a first insulating film over the gate electrode;
forming an oxide semiconductor film over the first insulating film;
forming a second insulating film over the oxide semiconductor film;
forming a first metal oxide film over the second insulating film;
adding oxygen to the second insulating film through the first metal oxide film;
forming a second metal oxide film over the first metal oxide film; and
heating the first metal oxide film and the second metal oxide film,
wherein the oxide semiconductor film includes indium,
wherein the second insulating film includes silicon,
wherein the first metal oxide film is a conductive film containing indium,
wherein the second metal oxide film is an insulating film containing aluminum,
wherein the second metal oxide film includes a region where the second metal oxide film and the first metal oxide film are mixed, and
wherein the region is formed in the step of heating the first metal oxide film and the second metal oxide film.
10. The manufacturing method of a semiconductor device according to claim 9 further comprising steps of:
forming a source electrode electrically connected to the oxide semiconductor film; and
forming a drain electrode electrically connected to the oxide semiconductor film.
11. The manufacturing method of a semiconductor device according to claim 10 , wherein each of the source electrode and the drain electrode is over the second metal oxide film.
12. The manufacturing method of a semiconductor device according to claim 9 further comprising a step of forming a conductive film over the second metal oxide film.
13. The manufacturing method of a semiconductor device according to claim 9 ,
wherein the oxide semiconductor film comprises In, Zn, and M and
wherein M is Ti, Ga, Y, Zr, La, Ce, Nd, Sn, or Hf.
14. The manufacturing method of a semiconductor device according to claim 9 ,
wherein the oxide semiconductor film includes a crystal part, and
wherein the crystal part has c-axis alignment.
15. The manufacturing method of a semiconductor device according to claim 9 , wherein oxygen molecules of more than or equal to 8.0×10 14 /cm 2 are detected from the second insulating film by thermal desorption spectroscopy after the step of adding the oxygen to the second insulating film.