Electronic component
An electronic component includes at least a contact member having, on a surface of a contact portion adapted to come into contact with another contact member, at least an undercoat plating layer and a main plating layer formed on the undercoat plating layer. A coating containing a fluorine-based oil is provided on the main plating layer, and the coating has a dry coating weight per unit area on the main plating layer of greater than or equal to 0.011 mg/cm 2 .
1. An electronic component comprising:
at least a contact member having, on a surface of a contact portion adapted to come into contact with another contact member, at least an undercoat plating layer and a gold-containing main plating layer formed on the undercoat plating layer,
wherein
the contact portion further has a coating containing a fluorine-based oil on the main plating layer, and
a lower limit value of a dry coating weight per unit area of the coating, determined in relation to the thickness of the main plating layer, is:
0.011 mg/cm 2 when a thickness of the main plating layer is greater than or equal to 0.4 μm,
0.04 mg/cm 2 when a thickness of the main plating layer is greater than or equal to 0.2 μm and less than 0.4 μm,
0.07 mg/cm 2 when a thickness of the main plating layer is greater than or equal to 0.1 μm and less than 0.2 μm, and
0.25 mg/cm 2 when a thickness of the main plating layer is less than 0.1 μm.
2. The electronic component according to claim 1 , wherein the undercoat plating layer is one of a Ni plating layer, a Ni—P plating layer, a Pd—Ni plating layer, and a composite plating layer of a Ni plating layer and a Pd—Ni plating layer.
3. The electronic component according to claim 1 , wherein the fluorine-based oil is a perfluoropolyether oil (PFPE oil).
4. The electronic component according to claim 2 , wherein the fluorine-based oil is a perfluoropolyether oil (PFPE oil).