Semiconductor device with guard ring coupled resonant circuit
A semiconductor device comprises a guarded circuit. The semiconductor device also comprises a guard ring surrounding the guarded circuit. The semiconductor device further comprises a resonant circuit coupled with the guard ring. The resonant circuit comprises an input node coupled with the guard ring. The resonant circuit also comprises an inductor. The resonant circuit further comprises a capacitor coupled with the inductor. The resonant circuit additionally comprises a ground node configured to carry a ground voltage. The inductor and the capacitor are coupled between the input node and the ground node.
1. A semiconductor device, comprising:
a guarded circuit;
a guard ring surrounding the guarded circuit; and
a resonant circuit directly electrically connected with the guard ring, wherein the resonant circuit comprises:
an input node coupled with the guard ring;
an inductor;
a capacitor coupled with the inductor and separate from the guard ring and the inductor; and
a ground node configured to carry a ground voltage,
wherein the inductor and the capacitor are coupled between the input node and the ground node.
2. The semiconductor device of claim 1 , wherein the inductor and the capacitor are coupled in series between the input node and the ground node.
3. The semiconductor device of claim 2 , wherein the resonant circuit is a first resonant circuit, and the semiconductor device further comprises:
a second resonant circuit coupled with the guard ring.
4. The semiconductor device of claim 3 , wherein the first resonant circuit and the second resonant circuit are coupled with the guard ring in parallel.
5. The semiconductor device of claim 3 , wherein the second resonant circuit is coupled with the first resonant circuit at a coupling node between the inductor and the capacitor of the first resonant circuit.
6. The semiconductor device of claim 1 , wherein the inductor is a spiral inductor.
7. The semiconductor device of claim 1 , wherein the inductor is a meander line inductor.
8. The semiconductor device of claim 1 , wherein the inductor is disposed over the guard ring.
9. The semiconductor device of claim 1 , wherein the capacitor is disposed over the guard ring.
10. A semiconductor device, comprising:
a substrate;
a first circuit connected to the substrate;
a second circuit connected to the substrate;
a guard ring surrounding the second circuit, wherein the first circuit is outside the guard ring; and
a resonant circuit directly electrically connected with the guard ring, wherein the resonant circuit comprises:
an input node coupled with the guard ring;
an inductor;
a capacitor coupled with the inductor and separate from the guard ring and the inductor; and
a ground node configured to carry a ground voltage,
wherein the inductor and the capacitor are coupled between the input node and the ground node.
11. The semiconductor device of claim 10 , wherein a first side of the inductor is coupled with the input node, a second side of the inductor is coupled with the capacitor and a side of the capacitor opposite the inductor is coupled with the ground node.
12. The semiconductor device of claim 10 , wherein a first side of the capacitor is coupled with the input node, a second side of the capacitor is coupled with the inductor and a side of the inductor opposite the capacitor is coupled with the ground node.
13. The semiconductor device of claim 10 , wherein the inductor and the capacitor are disposed over the guard ring.
14. The semiconductor device of claim 13 , wherein the inductor is a meander line inductor and the capacitor is a metal-oxide-metal capacitor.
15. The semiconductor device of claim 13 , wherein the resonant circuit is a first resonant circuit, the semiconductor device further comprises a second resonant circuit coupled with first resonant circuit, and the first resonant circuit and the second resonant circuit are arranged as a resonant circuit ladder.
16. The semiconductor device of claim 13 , wherein the resonant circuit is a first resonant circuit, the semiconductor device further comprises a second resonant circuit coupled with the guard ring, and the first resonant circuit and the second resonant circuit are coupled with the guard ring in parallel.
17. The semiconductor device of claim 10 , wherein the inductor is a spiral inductor and the capacitor is a metal-insulator-metal capacitor.
18. The semiconductor device of claim 10 , wherein the capacitor is a metal-oxide-silicon capacitor.
19. The semiconductor device of claim 10 , wherein the second circuit is a voltage control oscillator.
20. A method of forming a semiconductor device, the method comprising:
forming a guard ring around a noise sensitive circuit over a substrate;
directly electrically connecting a resonant circuit with the guard ring, wherein the resonant circuit comprises, in series, an input node coupled with the guard ring, an inductor, a capacitor separate from the guard ring and the inductor, and a ground node configured to carry a ground voltage.