Electronic device module and manufacturing method thereof
An electronic device module includes a first substrate having at least one or more electronic devices mounted on one surface thereof, a second substrate bonded to one surface of the first substrate and including at least one device accommodating part having a space in which the electronic device is accommodated, and a shielding member disposed in the device accommodating part and accommodating at least one or more electronic devices therein.
1. An electronic device module comprising:
a first substrate having an electronic device mounted on one surface thereof;
a second substrate bonded to the one surface of the first substrate and including a device accommodating part having a through-hole shape and accommodating the electronic device;
an inner molded portion formed in the device accommodating part and sealing the electronic device;
a shielding member disposed along an outer surface of the inner molded portion in the device accommodating part and accommodating the electronic device therein;
an outer molded portion burying the shielding member therein and formed in the device accommodating part; and
external connection terminals disposed on the second substrate and used to connect the second substrate and a main board.
2. The electronic device module of claim 1 , wherein the shielding member is electrically connected to a ground pad formed on the one surface of the first substrate.
3. The electronic device module of claim 1 , further comprising an electronic device mounted on an other surface of the first substrate and a molded portion formed on the other surface of the first substrate and burying the electronic device mounted on the other surface of the first substrate therein.
4. The electronic device module of claim 3 , further comprising an upper shielding member disposed along an outer surface of the molded portion.
5. The electronic device module of claim 4 , wherein the upper shielding member extends from a top portion of the first substrate to a top surface of the molded portion, protrudes from the top surface of the molded portion, and extends beyond a width of the first substrate and the second substrate, and wherein the first substrate is disposed between the upper shielding member and the shielding member.
6. The electronic device module of claim 1 , wherein the electronic device comprises an active device and a passive device mounted on an upper surface of the first substrate, and only an active device mounted on a lower surface of the first substrate.
7. The electronic device module of claim 1 , wherein the shielding member is formed as a U-shaped vessel spanning a width less than that of the first substrate.
8. An electronic device module comprising:
a first substrate having electronic devices mounted on both surfaces thereof;
a second substrate bonded to one surface of the first substrate and including a device accommodating part having a through-hole shape and accommodating one of the electronic devices; an inner molded portion formed in the device accommodating part and sealing the electronic device;
a shielding member disposed along an outer surface of the inner molded portion in the device accommodating part, and shielding electromagnetic waves from being introduced into the electronic device disposed in the device accommodating part and/or shielding the electromagnetic waves from being leaked from the electronic device; an outer molded portion burying the shielding therein and formed in the device accommodating part; and
external connection terminals disclosed on the second substrate and used to connect the second substrate and a main board.
9. A manufacturing method of an electronic device module, comprising:
preparing a first substrate;
mounting one electronic device and a second substrate on one surface of the first substrate; and
forming a shielding member over the electronic device,
wherein in the mounting of the electronic device and the second substrate, the electronic device is mounted in a device accommodating part which is formed in the second substrate and has a through-hole shape, wherein the forming of the shielding member includes;
forming an inner molded portion sealing the electronic device disposed in the device accommodating part,
forming the shielding member along an outer surface of the inner molded portion, and
forming an outer molded portion to bury the shielding member therein and formed in the device accommodating part,
wherein the second substrate includes external connecting terminals used to connect the second substrate and a main board.