IP Library Granted Patent US 9,711,348
Granted Patent B2
US 9,711,348 · App. 14/859,924 · Granted Jul 18, 2017

Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium

Inventors: Atsushi Sano (Toyama, JP); Yoshiro Hirose (Toyama, JP)
Assignee: HITACHI KOKUSAI ELECTRIC INC.
H01L21/022C23C16/30C23C16/45531C23C16/52H01L21/0217H01L21/0228H01L21/02118H01L21/02167H01L21/02211H01L21/02274H01L21/67109H01L21/67115H01L21/67248
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Quick Facts
Patent No.
US 9,711,348
App. No.
14/859,924
Granted
Jul 18, 2017
Kind
B2
Abstract

The present invention increases controllability of a composition ratio of a multi-element film that contains a predetermined element and at least one element selected from the group consisting of boron, oxygen, carbon and nitrogen. There is provided a method of manufacturing a semiconductor device, including: forming a laminated film where a first film and a second film are laminated on a substrate by performing a cycle a predetermined number of times, the cycle including: (a) forming the first film being free of borazine ring structure and including a predetermined element and at least one element selected from the group consisting of oxygen, carbon and nitrogen; and (b) forming the second film having a borazine ring structure and including at least boron and nitrogen.

Claims (18)

1. A method of manufacturing a semiconductor device, comprising: forming a laminated film where a first film and a second film are laminated on a substrate by performing a cycle a predetermined number of times, the cycle comprising:

(a) forming the first film being free of a borazine ring structure and including a predetermined element and at least one element selected from the group consisting of oxygen, carbon and nitrogen; and

(b) forming the second film having the borazine ring structure and including at least boron and nitrogen.

2. The method of claim 1 , wherein (a) comprises: performing a first set a predetermined number of times, the first set comprising: (a-1) supplying a source gas including the predetermined element to the substrate; and (a-2) supplying at least one gas selected from the group consisting of a carbon-containing gas, a nitrogen-containing gas and an oxygen-containing gas to the substrate, and

(b) comprises: performing a second set a predetermined number of times, the second set comprising: (b-1) supplying a borazine-based gas to the substrate; and (b-2) supplying at least one gas selected from the group consisting of the source gas and the nitrogen-containing gas to the substrate.

3. The method of claim 2 , wherein each of the first set and the second set is performed one to fifty times.

4. The method of claim 1 , wherein the second film further comprises at least one element selected from the group consisting of the predetermined element and carbon.

5. The method of claim 1 , wherein the first film is free of boron.

6. The method of claim 1 , wherein the first film comprises at least one film selected from the group consisting of a film containing the predetermined element and oxygen, a film containing the predetermined element and nitrogen, a film containing the predetermined element and carbon, a film containing the predetermined element, oxygen and nitrogen, a film containing the predetermined element, carbon and nitrogen, a film containing the predetermined element, oxygen, carbon and nitrogen, and a film containing the predetermined element, oxygen and carbon.

7. The method of claim 1 , wherein the first film comprises at least one film selected from the group consisting of an oxide film, a nitride film, a carbide film, an oxynitride film, a carbonitride film, an oxycarbonitride film and an oxycarbide film.

8. The method of claim 1 , wherein the second film comprises at least one film selected from the group consisting of a boron nitride film and a boron carbonitride film.

9. The method of claim 1 , wherein a thickness of each of the first film and the second film ranges from 0.1 nm through 5 nm.

10. The method of claim 1 , wherein the laminated film comprises a nano-laminated film where the first film and the second film are alternately laminated at a nano level.

11. The method of claim 1 , wherein (a) is performed first when the cycle is performed the predetermined number of times.

12. The method of claim 1 , wherein (a) is performed last when the cycle is performed the predetermined number of times.

13. A non-transitory computer-readable recording medium storing a program for causing a computer to perform a cycle a predetermined number of times to form a laminated film where a first film and a second film are laminated on a substrate, the cycle including:

(a) forming the first film being free of a borazine ring structure and including a predetermined element and at least one element selected from the group consisting of oxygen, carbon and nitrogen; and

(b) forming the second film having the borazine ring structure and including at least boron and nitrogen.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2015
From: SANO, ATSUSHI; HIROSE, YOSHIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 036612/0953 →
Priority Claims (1)
JP 2014-194226 · Sep 24, 2014 · national
Continuity (1)
Related Publication 20160086791A1 · Mar 24, 2016