Semiconductor device, or crystal
There is provided a semiconductor device including corundum crystal films of good quality. There is provided a semiconductor device including a base substrate, a semiconductor layer, and an insulating film each having a corundum crystal structure. Materials having a corundum crystal structure include many types of oxide films capable of functioning as an insulating film. Since all the base substrate, the semiconductor layer, and the insulating film have a corundum crystal structure, it is possible to achieve a semiconductor layer and an insulating film of good quality on the base substrate.
1. A semiconductor device or a crystal comprising:
a base substrate;
a semiconductor layer; and
an insulating film, wherein:
the semiconductor layer and the insulating film are disposed on the base substrate in this order or in an order reverse to this order, and
all the base substrate, the semiconductor layer, and the insulating film have a corundum crystal structure.
2. The semiconductor device or the crystal of claim 1 , wherein all the base substrate, the semiconductor layer, and the insulating film are formed from one of sapphire, gallium oxide, indium oxide, chrome oxide, ferric oxide, titanium oxide, vanadium oxide, and cobalt oxide, or a mixed crystal of two or more thereof.
3. The semiconductor device or the crystal of claim 1 ,
wherein all the base substrate, the semiconductor layer, and the insulating film are formed from the same semiconductor material or composition, or semiconductor materials or compositions having lattice constants which differ from each other by 15% or less.
4. The semiconductor device or the crystal of claim 3 , wherein all the base substrate, the semiconductor layer, and the insulating film are formed from α-phase aluminum gallium oxide represented by Al X Ga Y O 3 where 0≦X≦2, 0≦Y≦2, and X+Y=1.5 to 2.5.
5. The semiconductor device or the crystal of claim 1 , wherein
at least one of the base substrate, the semiconductor layer, and the insulating film has a different composition.
6. The semiconductor device or the crystal of claim 1 , wherein
the base substrate and the insulating film are formed from one of sapphire, gallium oxide, indium oxide, chrome oxide, ferric oxide, titanium oxide, vanadium oxide, and cobalt oxide, or a mixed crystal of two or more thereof, and
the semiconductor layer is formed from α-In X1 Al Y1 Ga Z1 O 3 where 0≦X1≦2, 0≦Y1≦2, 0≦Z1≦2, and X1+Y1+Z1=1.5 to 2.5.
7. The semiconductor device or the crystal of claim 6 , wherein 0.1≦X1 or 0.1≦Z1.
8. The semiconductor device or the crystal of claim 6 , wherein 0.1≦X1 and 0.1≦Z1.
9. The semiconductor device or the crystal of claim 6 , wherein
the base substrate is formed from α-sapphire, and
the insulating film is formed from α-Al Y2 Ga Z2 O 3 where 0≦Y2≦2, 0≦Z2≦2, and Y2+Z2=1.5 to 2.5.
10. The semiconductor device or the crystal of claim 9 , wherein 0.1≦X2 and 0.1≦Y2.
11. The semiconductor device or the crystal of claim 1 , wherein
a crystalline stress relaxation layer having a corundum crystal structure is disposed between the base substrate and the semiconductor layer.
12. The semiconductor device or the crystal of claim 11 , wherein
the base substrate is formed from α-sapphire,
the crystalline stress relaxation layer comprises one or more layers and is formed from α-Al X1 Ga Y1 O 3 where 0≦X1≦2, 0≦Y1≦2, and X1+Y1=1.5 to 2.5 and where the amount of Al is gradually reduced from the base substrate toward the semiconductor layer,
the semiconductor layer is formed from α-In X2 Al Y2 Ga Z2 O 3 where 0≦X2≦2, 0≦Y2≦2, 0≦Z2≦2, and X2+Y2+Z2=1.5 to 2.5, and the insulating film is formed from α-Al X3 Ga Y3 O 3 where 0≦X3≦2, 0≦Y3≦2, and X3+Y3=1.5 to 2.5.
13. The semiconductor device or the crystal of claim 1 , wherein
a cap layer comprising at least one of elements included in the semiconductor layer and the insulating film is disposed between the semiconductor layer and the insulating film.
14. The semiconductor device or the crystal of claim 13 , wherein
the base substrate is formed from α-sapphire,
the semiconductor layer is formed from impurity-doped α-In X2 Al Y2 Ga Z2 O 3 where 0≦X2≦2, 0≦Y2≦2, 0≦Z2≦2, and X2+Y2+Z2=1.5 to 2.5,
the cap layer is formed from α-Al X3 Ga Y3 O 3 where 0≦X3≦2, 0≦Y3≦2, and X3+Y3=1.5 to 2.5 and where the amount of Al is gradually increased from the semiconductor layer toward the insulating film, and
the insulating film is formed from α-Al X4 Ga Y4 O 3 where 0≦X4≦2, 0≦Y4≦2, and X4+Y4=1.5 to 2.5.
15. The semiconductor device or the crystal of claim 14 , wherein
a crystalline stress relaxation layer having a corundum crystal structure is disposed between the base substrate and the semiconductor layer, and
the crystalline stress relaxation layer comprises one or more layers and is formed from α-Al X1 Ga Y1 O 3 where 0≦X1≦2, 0≦Y1≦2, and X1+Y1=1.5 to 2.5 and where the amount of Al is gradually reduced from the base substrate toward the semiconductor layer.
16. The semiconductor device or the crystal of claim 1 , wherein
a structural phase transition prevention layer comprising at least one of elements included in the semiconductor layer and the insulating film is disposed between the semiconductor layer and the insulating film.
17. The semiconductor device or the crystal of claim 16 , wherein
the semiconductor layer is formed from impurity-doped α-In X1 Al Y1 Ga Z1 O 3 where 0≦X1≦2, 0≦Y1≦2, 0≦Z1≦2, and X1+Y1+Z1=1.5 to 2.5,
the structural phase transition prevention layer is formed from α-Al X2 Ga Y2 O 3 where 0≦X2≦2, 0≦Y2≦2, and X2+Y2=1.5 to 2.5 and where the amount of Al is gradually increased from the semiconductor layer toward the insulating film, and
the insulating film is formed from α-Al X3 Ga Y3 O 3 where 0≦X3≦2, 0≦Y3≦2, and X3+Y3=1.5 to 2.5.
18. A semiconductor device or a crystal comprising:
a support substrate;
a semiconductor layer; and
an insulating film, wherein:
the semiconductor layer and the insulating film are disposed on the support substrate in this order or in a order reverse to this order,
the support substrate has or does not have a corundum crystal structure,
both the semiconductor layer and the insulating film have a corundum crystal structure, and
a joining layer joining the support substrate and a corundum crystal is disposed between the support substrate and the semiconductor layer.
19. The semiconductor device or the crystal of claim 18 , wherein
the support substrate is formed from one of a SiC substrate, a Si substrate, a metal substrate, a ceramic substrate, and a glass substrate.
20. The semiconductor device or the crystal of claim 18 , wherein
the joining layer is formed from a silicon oxide film.