Display module encapsulating structure and preparing method thereof
A display module encapsulating structure and preparation method thereof, which relates to the field of display devices and can be applied to preparing AMOLED and other related display devices as described in the application, mainly use the thin film encapsulation structure to hermetically protect the display module (such as OLED display module), that is sealing the display module by inorganic thin film layer having the characteristics of transparency as well as containing moisture-resistance and oxygen-resistance; buffering the internal and external stresses of the thin film layers and restraining the falling off of the layers caused by the bending stress when preparing flexible devices. Meanwhile, the raised features formed by multilayer stack can effectively inhibit the diffusion effect of inorganic coating and increase the number of side water retaining walls of thin film device, therefore, effectively improve the encapsulating effect.
1. A display module encapsulated structure, comprising:
an array substrate, the surface of which is provided with a display module;
raised structures, disposed on a surface of the array substrate and placed in periphery of the display module;
a first film layer, covering the display module as well as a surface of the array substrate located between the display module and the raised structures to seal the display module;
a second film layer, covering the first film layer as well as parts of surfaces of the raised structures;
a third film layer, covering the second film layer, the raised structures and the parts of the surface of the array substrate;
a fourth film layer, covering parts of a surface of the third film layer; and
a fifth film layer, covering parts of surfaces of the fourth film layer and third film layer to seal the fourth film layer onto the third film layer;
wherein, the raised structures are stack structures with multilayer films; and
the raised structures are made of heterocyclic polymers containing imino group and benzene ring.
2. The display module encapsulating structure of claim 1 , wherein the array substrate is further provided with a thin film transistor display circuit connected to the display module to drive the display module.
3. The display module encapsulating structure of claim 2 , wherein the array substrate is a low temperature polysilicon substrate.
4. The display module encapsulating structure of claim 1 , wherein
the display module has a light emitting surface for light emission and a backlight surface opposite to the light emitting surface; and
the backlight surface of the display module is adhered onto the surface of the array substrate; the first film layer covers the light emitting surface of the display module.
5. The display module encapsulating structure of claim 1 , wherein, the display module is an OLED display module.
6. The display module encapsulating structure of claim 1 , wherein, a thickness of the raised structures is larger than sum of thicknesses of the first film layer and second film layer.
7. The display module encapsulating structure of claim 1 , wherein, the first film layer, the third film layer and the fifth film layer are all made of inorganic materials; and
the second film layer and the fourth film layer are both made of organic materials.
8. The display module encapsulating structure of claim 7 , wherein, the first film layer is made of metal oxide or silicon nitride, which are transparent, moisture-resistant, and oxygen-resistant.
9. The display module encapsulating structure of claim 7 , wherein, the second film layer and the fourth film layer are made of acrylic resin compound having characteristics of buffering and transparency.
10. The display module encapsulating structure of claim 7 , wherein, the third film layer and the fifth film layer are made of silicon nitride.
11. A method for preparing display module encapsulating structure, comprising:
forming an array substrate with a surface provided with a display module after a process for forming array; the array substrate in periphery of the display module being formed with raised structures;
preparing a first film layer to cover the display module as well as a surface of the array substrate located between the display module and the raised structures to seal the display module;
forming a second film layer onto an exposed surface of the first film layer; the second film layer covering parts of surfaces of the raised structures;
preparing a third film layer to cover parts of the second film layer, the raised structures and the array substrate;
preparing a fourth film layer onto the third film layer;
preparing the fifth film layer covering parts of surfaces of the fourth film layer and the third film layer to seal the fourth film layer onto the third film layer;
wherein, the raised structures are made of heterocyclic polymers containing imino group and benzene ring.
12. The method for preparing display module encapsulating structure of claim 11 , further comprising:
preparing on the array substrate a thin film transistor display circuit connecting the display module to drive the display module.
13. The method for preparing display module encapsulating structure of claim 12 , wherein, the array substrate is a low temperature polysilicon substrate.
14. The method for preparing display module encapsulating structure of claim 11 , wherein,
the display module has a light emitting surface for light emission and a backlight surface opposite to the light emitting surface; and
the backlight surface of the display module is adhered onto the surface of the array substrate; the first film layer is formed onto the light emitting surface of the display module.
15. The method for preparing display module encapsulating structure of claim 11 , wherein, the display module is an OLED display module.
16. The method for preparing display module encapsulating structure of claim 11 , wherein, the raised structures are formed by stacking multilayer thin films.
17. The method for preparing display module encapsulating structure of claim 11 , wherein, a thickness of the raised structures is larger than sum of thicknesses of the first film layer and second film layer.
18. The method for preparing display module encapsulating structure of claim 11 , wherein
forming the first film layer, the third film layer and the fifth film layer by inorganic materials; and
forming the second film layer and the fourth film layer by organic materials.
19. The method for preparing display module encapsulating structure of claim 18 , wherein, atomic layer deposition is employed to deposite metal oxide or silicon nitride, both of which are transparent, moisture-resistant, and oxygen-resistant, to prepare the first film layer.
20. The method for preparing display module encapsulating structure of claim 18 , wherein, ink jet printing is employed to spray acrylic resin compound having characteristics of buffering and transparency, to prepare the second film layer and the fourth film layer.
21. The method for preparing display module encapsulating structure of claim 18 , wherein, atomic layer deposition, chemical vapor deposition, or plasma enhanced chemical vapor deposition is employed to deposite silicon nitride to prepare the third film layer and the fifth film layer.