Evaporation source
Evaporation source, in particular for use in a sputtering process or in a vacuum arc evaporation process, preferably a cathode vacuum arc evaporation process. The evaporation source includes an inner base body which is arranged in an outer carrier body and which is arranged with respect to the outer carrier body such that a cooling space in flow communication with an inlet and an outlet is formed between the base body and the carrier body. In accordance with the invention, the cooling space includes an inflow space and an outflow space, and the inflow space is in flow communication with the outflow space via an overflow connection for the cooling of the evaporation source such that a cooling fluid can be conveyed from the inlet via the inflow space the overflow connection and the outflow space to the outlet.
1. An evaporation source comprising:
an evaporator axis;
a cylindrical carrier body comprising an inner surface and an axis that is coaxial with the evaporator axis;
a cylindrical base body arranged within the outer carrier body;
the base body comprising an outermost surface and an axis that is coaxial with the evaporator axis;
the outermost surface facing radially outwards toward the inner surface and the inner surface facing radially inward toward the outermost surface;
a cooling fluid space arranged between the outermost surface of the base body and the inner surface of the carrier body;
a partition wall separating the cooling space into an inflow space and an outflow space;
said inflow space having an arc-shaped cross-section; and
said outflow space having an arc-shaped cross-section,
wherein the cooling fluid space is configured to allow fluid to move in one direction within the inflow space and in an opposite direction within the outflow space.
2. The evaporation source of claim 1 , wherein the partition wall comprises two partition walls.
3. The evaporation source of claim 2 , wherein the inflow space and the outflow space have a same arc-shaped cross-section.
4. The evaporation source of claim 1 , wherein the partition wall comprises two oppositely arranged partition walls.
5. The evaporation source of claim 1 , further comprising a main internal space located within the base body sized and configured to receive therein a magnet system.
6. The evaporation source of claim 1 , further comprising a cooling fluid inlet, a cooling fluid outlet and an outflow connection arranged on an opposite end from the cooling fluid inlet and the cooling fluid outlet.
7. The evaporation source of claim 1 , wherein at least the carrier body is rotatable about the evaporator axis.
8. The evaporation source of claim 1 , wherein at least the base body is rotatable about the evaporator axis.
9. The evaporation source of claim 1 , further comprising one of:
a fixing plate adapted to fix the carrier body to the base body; and
a fixing element coupled to a fixing plate.
10. The evaporation source of claim 9 , further comprising one of:
a thermal expansion element coupled to the fixing plate; and
a spring coupled to the fixing plate.
11. The evaporation source of claim 1 , wherein at least one of:
the carrier body comprises a target material; or
a cylindrical target material is arranged on an outer surface of the carrier body.
12. The evaporation source of claim 1 , wherein at least one of:
the inflow space is structured and arranged to generate turbulence in the cooling fluid flowing therein;
the outflow space is structured and arranged to generate turbulence in the cooling fluid flowing therein; or
a turbulence body is arranged within the evaporation source and is adapted to generate turbulence in the cooling fluid.
13. The evaporation source of claim 1 , wherein at least one of:
the inlet is a meandering inlet; or
the outlet is a meandering outlet.
14. The evaporation source of claim 1 , further comprising a magnet system space located within the base body sized and configured to contain therein one of:
a movable carrier system;
a magnet having a predetermined magnetic field strength; or
a magnet having a predetermined magnetic field shape.
15. The evaporation source of claim 1 , wherein the evaporation source is usable in one of:
a sputtering process;
a vacuum arc evaporation process; or
a cathode vacuum arc evaporation process.
16. An evaporation source comprising:
a carrier body comprising a cylindrical inner surface and an axis;
a base body arranged within the outer carrier body comprising a cylindrical outermost surface and an axis that is coaxial with the axis of the carrier body;
the cylindrical outermost surface being spaced from the cylindrical inner surface;
a cooling fluid space arranged between the cylindrical outermost surface of the base body and the cylindrical inner surface of the carrier body;
a magnet receiving space located within the base body; and
partition walls separating the cooling space into an arc-shaped inflow space and an arc-shaped outflow space having a same outer diameter as the arc-shaped inflow space,
wherein a cooling fluid moves within the inflow space and the outflow space in opposite directions without passing through the magnet receiving space.
17. The evaporation source of claim 16 , further comprising a cooling fluid inlet, a cooling fluid outlet and an outflow connection arranged on an opposite end from the cooling fluid inlet and the cooling fluid outlet.
18. An evaporation source comprising:
a cylindrical carrier body comprising a cylindrical inner surface and an axis;
a target material arranged on an outer cylindrical surface of the carrier body;
a cylindrical base body arranged within the outer carrier body;
the cylindrical base body comprising a cylindrical outermost surface and an axis that is coaxial with the axis of the carrier body;
a cylindrical cooling fluid space arranged between the cylindrical outermost surface of the base body and the cylindrical inner surface of the carrier body;
a magnet receiving space located within the base body; and
oppositely arranged partition walls separating the cooling space into an arc-shaped inflow space and an arc-shaped outflow space having a same inside diameter as the arc-shaped inflow space,
wherein a cooling fluid moves within the inflow space along a direction parallel to the axis of the carrier body and within the outflow space parallel to the axis of the carrier body and in an opposite direction.
19. The evaporation source of claim 18 , wherein at least one of:
the carrier body is rotatable; and
the base body is rotatable.
20. The evaporation source of claim 18 , wherein the magnet receiving space is surrounded by a cylindrical wall of the cylindrical base body, wherein the cooling fluid does not flow through the magnet receiving space.
21. The evaporation source of claim 1 , further comprising a cylindrical magnet system receiving space surrounded by the cylindrical base body, wherein the fluid does not flow through the magnet system receiving space.
22. The evaporation source of claim 16 , wherein the magnet receiving space is surrounded by a cylindrical wall of the base body, wherein the fluid does not flow through the magnet receiving space.
23. The evaporation source of claim 1 , wherein at least one of:
the inflow space has a same size and shape as the outflow space; or
the inflow space has a same inside diameter and a same outside diameter as the outflow space.
24. The evaporation source of claim 16 , wherein at least one of:
the inflow space has a same size and shape as the outflow space; or
the inflow space has a same inside diameter as the outflow space.