Image pickup apparatus and camera module
An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.
1. An image pickup apparatus, comprising:
an optical device having a front side that includes an optical element area and a back side that includes an external connection terminal, wherein the front side is configured to receive light and the back side is opposite to the front side;
a sealing material arranged above the front side of the optical device;
a transparent conductive layer arranged between the front side of the optical device and the sealing material;
a first electrode pad arranged on the front side of the optical device;
a second pad that is different from the first electrode pad and is arranged in a first area on the front side of the optical device, wherein the transparent conductive layer is configured to fill a gap that excludes the first area in which the different pad is provided; and
a penetrating electrode electrically connected to the first electrode pad,
wherein the transparent conductive layer is electrically connected to the first electrode pad, and
wherein the penetrating electrode is connected to the external connection terminal on the back side of the optical device.
2. The image pickup apparatus according to claim 1 ,
wherein the transparent conductive layer is a moth eye structure, and
wherein at least a second area opposed to the optical element area shows optical characteristics with a fine pattern.
3. The image pickup apparatus according to claim 1 , wherein at least a second area opposed to the optical element area comprises a transparent film as a moth eye structure that shows optical characteristics with a fine pattern.
4. The image pickup apparatus according to claim 1 , wherein the transparent conductive layer comprises at least one region that has a cut-out region in a depth direction.
5. The image pickup apparatus according to claim 1 , wherein the sealing material is configured to protect the optical element area of the optical device.
6. The image pickup apparatus according to claim 1 , wherein the second pad is indirectly connected with the transparent conductive layer.
7. The image pickup apparatus according to claim 1 , wherein the first electrode pad is configured to connect with a fixed potential.
8. The image pickup apparatus according to claim 1 , wherein the sealing material is a glass.
9. The image pickup apparatus according to claim 1 , wherein the penetrating electrode is a through silicon via (TSV) connection.
10. The image pickup apparatus according to claim 1 , wherein the transparent conductive layer is in indirect contact with the optical element area.
11. The image pickup apparatus according to claim 10 ,
wherein the sealing material is configured to protect the optical element area of the optical device,
wherein the transparent conductive layer is arranged on a surface of the sealing material, which is opposed to the optical element area.
12. The image pickup apparatus according to claim 10 , wherein the transparent conductive layer is arranged in a region excluding a second area opposed to the optical element area.
13. A camera module, comprising:
at least one lens configured to form a subject image on an optical element area; and
an image pickup apparatus, comprising:
an optical device having a front side that includes the optical element area and a back side that includes an external connection terminal, wherein the front side is configured to receive light and the back side is opposite to the front side;
a sealing material arranged above the front side of the optical device;
a transparent conductive layer arranged between the front side of the optical device and the sealing material;
a first electrode pad arranged on the front side of the optical device;
a second pad that is different from the first electrode pad and is arranged in a first area on the front side of the optical device, wherein the transparent conductive layer is configured to fill a gap that excludes the first area in which the different pad is provided, and
a penetrating electrode electrically connected to the first electrode pad,
wherein the transparent conductive layer is electrically connected to the first electrode pad, and
wherein the penetrating electrode is connected to the external connection terminal on the back side of the optical device.
14. The camera module according to claim 13 ,
wherein the transparent conductive layer is a moth eye structure, and
wherein at least a second area opposed to the optical element area shows optical characteristics with a fine pattern.
15. The camera module according to claim 13 , wherein at least a second area opposed to the optical element area comprises a transparent film as a moth eye structure that shows optical characteristics with a fine pattern.
16. The camera module according to claim 13 , wherein the transparent conductive layer comprises at least one region that has a cut-out region in a depth direction.
17. The camera module according to claim 13 , wherein the sealing material is configured to protect the optical element area of the optical device.
18. The camera module according to claim 13 , wherein the transparent conductive layer is in indirect contact with the optical element area.
19. The camera module according to claim 18 ,
wherein the sealing material is configured to protect the optical element area of the optical device,
wherein the transparent conductive layer is arranged on a surface of the sealing material, which is opposed to the optical element area.
20. The camera module according to claim 18 , wherein the transparent conductive layer is provided in a region excluding a second area opposed to the optical element area.