IP Library › Granted Patent US 9,741,534
Granted Patent B2
US 9,741,534 · App. 15/003,311 · Granted Aug 22, 2017

Monitoring device, ion implantation device, and monitoring method

Inventor: Makoto Ishida (Kanagawa, JP)
Assignee: LAPIS SEMICONDUCTOR CO., LTD.
H01J37/304H01J37/244H01J37/3171G01R19/0061H01J2237/24495H01J2237/30472H01J2237/31703
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Quick Facts
Patent No.
US 9,741,534
App. No.
15/003,311
Granted
Aug 22, 2017
Kind
B2
Abstract

A monitoring device includes a filtering section that extracts and outputs at least one of a high frequency component or a low frequency component of a beam current received from a detection output section of an ion implantation device; and a computation section that computes at least one of a value corresponding to a content ratio of the high frequency component in the beam current, or a value corresponding to a content ratio of the low frequency component in the beam current.

Claims (20)

1. A monitoring device comprising:

a filtering section that extracts and outputs at least one of a high frequency component or a low frequency component of a beam current received from a detection output section of an ion implantation device; and

a computation section that determines at least one of a value corresponding to a content ratio of the high frequency component in the beam current, or a value corresponding to a content ratio of the low frequency component in the beam current.

2. The monitoring device of claim 1 , wherein:

the filtering section outputs the high frequency component and the low frequency component as an analog signal;

the monitoring device further comprises an A/D converter that converts the analog signal into a digital signal; and

the computation section determines the value using the digital signal, and causes the determined value to be displayed on a display section.

3. The monitoring device of claim 1 , further comprising a control section that controls the ion implantation device such that the ion beam is suppressed in cases in which the value determined by the computation section has exceeded a threshold value.

4. An ion implantation system comprising:

the monitoring device and the ion implantation device of claim 1 ,

wherein the ion implantation device comprises

an irradiation generation section that generates and irradiates the ion beam; and

the detection output section, which detects the beam current due to the ion beam irradiated by the irradiation generation section and outputs the beam current to the monitoring device.

5. The ion implantation system of claim 4 , configured to perform batch processing.

6. The monitoring device of claim 1 , wherein the filtering section outputs the high frequency component and the low frequency component as an analog signal.

7. The monitoring device of claim 1 , further comprising an A/D converter that converts the high frequency component and the low frequency component into a digital signal.

8. The monitoring device of claim 1 , wherein the computation section determines the value based on a digital representation of the high frequency component and the low frequency component, and causes the determined value to be displayed on a display.

9. A monitoring method comprising:

extracting and outputting at least one of a high frequency component or a low frequency component of a beam current received from a detection output section of an ion implantation device; and

determining at least one of a value corresponding to a content ratio of the high frequency component in the beam current, or a value corresponding to a content ratio of the low frequency component in the beam current.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2016
From: ISHIDA, MAKOTO
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 037577/0300 →
Priority Claims (1)
JP 2015-013460 · Jan 27, 2015 · national
Continuity (1)
Related Publication 20160217973A1 · Jul 28, 2016