Process for production of thermoplastic cured epoxy resin with transparency to visible light, and thermoplastic epoxy resin composition

1. A thermoplastic epoxy resin composition comprising (A) an epoxy compound having two epoxy groups in one molecule, (B) a compound having two phenolic hydroxyl groups in one molecule, and at least one compound selected from the group consisting of dihexylamine, diheptylamine, di(2-ethylhexyl)amine, N-ethylhexylamine, trihexylamine, dioctylamine, N,N-dimethyl-n-octylamine, and N,N-dimethyldecylamine as (C) a curing accelerator,

wherein the epoxy compound (A) and the compound (B) are capable of being polymerized in a straight chain form by a polyaddition reaction, and

wherein the curing accelerator (C) further contains at least one compound selected from the group consisting of tri(t-butanol)amine, tri(2-pentanol)amine, tri(3-methyl-2-butanol)amine, tri(2-methyl-2-butanol)amine, and N,N-dibutylethanolamine.

2. The thermoplastic epoxy resin composition according to claim 1 , wherein the curing accelerator (C) is contained in an amount of 0.01 to 10 parts by weight relative to 100 parts by weight of the epoxy compound (A).

3. The thermoplastic epoxy resin composition according to claim 1 , wherein the compounded amount of the epoxy compound (A) and the compound (B) is 0.9 to 1.1 mol of the compound (B) relative to 1 mole of the epoxy compound (A).

4. A thermoplastic cured epoxy resin with transparency to visible light produced by curing the thermoplastic epoxy resin composition according to claim 1 .