Integrated circuits using guard rings for ESD systems, and methods for forming the integrated circuits
An integrated circuit includes at least one transistor over a substrate, and a first guard ring disposed around the at least one transistor. The integrated circuit further includes a second guard ring disposed around the first guard ring. The integrated circuit further includes a first doped region disposed adjacent to the first guard ring, the first doped region having a first dopant type. The integrated circuit further includes a second doped region disposed adjacent to the second guard ring, the second doped region having a second dopant type.
1. An integrated circuit comprising:
at least one transistor over a substrate, wherein the at least one transistor comprises a drain;
a first guard ring disposed around the at least one transistor;
a second guard ring disposed around the first guard ring;
a first doped region disposed adjacent to the first guard ring, the first doped region having a first dopant type; and
a second doped region disposed adjacent to the second guard ring, the second doped region having a second dopant type, wherein the drain is electrically connected to the second doped region.
2. The integrated circuit of claim 1 , wherein the at least one transistor is a plurality of transistors, the plurality of transistors having a shared drain.
3. The integrated circuit of claim 1 , wherein the first guard ring comprises a first well region, wherein the first well region is disposed between a source and the drain of the at least one transistor.
4. The integrated circuit of claim 1 , wherein the at least one transistor comprises a source and the source is electrically connected to the first doped region.
5. The integrated circuit of claim 4 , wherein an isolation region is positioned between the source and the first doped region.
6. The integrated circuit of claim 1 , wherein the at least one transistor comprises:
a source; and
a doped body between the source and the first guard ring.
7. The integrated circuit of claim 6 , wherein the doped body is in contact with the second guard ring.
8. The integrated circuit of claim 6 , wherein the doped body is separated from the second guard ring.
9. The integrated circuit of claim 1 , wherein the first guard ring has a same dopant type as the second guard ring.
10. An integrated circuit comprising:
at least one transistor over a substrate;
a first guard ring disposed around the at least one transistor, the first guard ring comprising a first well region in the substrate, the first well region having a first dopant type;
a second guard ring surrounding the first guard ring, the second guard ring comprising a second well region in the substrate, the second well region having a second dopant type; and
a first doped region in the first well region, the first doped region having the second dopant type, wherein the first doped region, the first well region and the second well region are configured to form a transistor.
11. The integrated circuit of claim 10 , further comprising a third guard ring surrounding the second guard ring, the third guard ring comprising a third well region in the substrate, the third well region having the first dopant type.
12. The integrated circuit of claim 11 , further comprising a third doped region in the third well region, wherein the third doped region, the third well region and the second well region are configured to form a second transistor.
13. The integrated circuit of claim 10 , wherein the at least one transistor comprises a source electrically connected to the first doped region.
14. The integrated circuit of claim 10 , further comprising a second doped region in the second well region, wherein the at least one transistor comprises a drain electrically connected to the second doped region.
15. An integrated circuit comprising:
a transistor over a substrate, wherein the transistor comprises a source;
a first guard ring around the at least one transistor;
a doped body between the first guard ring and the source;
a second guard ring around the first guard ring;
a first doped region adjacent to the first guard ring, the first doped region having a first dopant type;
a second doped region adjacent to the second guard ring, the second doped region having a second dopant type; and
an isolation feature between the first doped region and the second doped region.
16. The integrated circuit of claim 15 , wherein the doped body is between the first guard ring and the first doped region.
17. The integrated circuit of claim 15 , wherein the first guard ring directly contacts the first doped region.
18. The integrated circuit of claim 15 , wherein the doped body contacts the second guard ring.
19. The integrated circuit of claim 15 , wherein the source is electrically connected to the first doped region.
20. The integrated circuit of claim 15 , wherein the doped body is separated from the second guard ring.