Wireless control system, touch-sensitive module and manufacturing method of same

1. A touch-sensitive module, comprising:

a first sensor pad;

a second sensor pad disposed beside the first sensor pad;

a wrapper covering the first sensor pad and the second sensor pad and filling a space between the first sensor pad and the second sensor pad; and

a plurality of leads each of which is electrically connected to one of the first sensor pad and the second sensor pad, and protrudes from the wrapper to transmit electrical signals generated by the first sensor pad or the second sensor pad.

2. The touch-sensitive module according to claim 1 wherein the wrapper is made of an insulating material.

3. The touch-sensitive module according to claim 1 , further comprising a processing chip disposed on the first sensor pad, disposed in a hallow portion of the first sensor pad or disposed between the first sensor pad and the second sensor pad, the processing chip being electrically connected to the leads.

4. The touch-sensitive module according to claim 1 , further comprising:

a circuit chip disposed between the first sensor pad and the second sensor pad or disposed on one of the first sensor pad and the second sensor pad wherein the circuit chip, the first sensor pad and the second sensor pad are disposed on different planes with different heights; and

a plurality of wires each of which is electrically connected to the circuit chip and one of the first sensor pad and the second sensor pad.

5. The touch-sensitive module according to claim 4 , wherein the circuit chip is a light-emitting diode chip providing various illuminating effects according to touch actions on the touch-sensitive module.

6. The touch-sensitive module according to claim 1 wherein the first sensor pad and the second sensor pad are made of a flexible material.

7. A wireless control system, comprising:

a touch-sensitive module comprising:

a plurality of sensor pads;

a wrapper covering the sensor pads and receiving a touch action; and

a processing chip electrically connected to the sensor pads, the processing chip generating an internal control signal in response to changes of physical properties of the sensor pads resulting from a touch action near the wrapper in a first instance, the processing chip driving the sensor pads to change the physical properties of the sensor pads in response to an external control signal in a second instance; and

a controlled device comprising a sensing module, the sensing module detecting the changes of the physical properties of the sensor pads behind the wrapper and generating a sensing signal wherein the controlled device is controlled in response to the sensing signal.

8. The wireless control system according to claim 7 wherein the controlled device achieves authentication of the touch-sensitive module according to the sensing signal.

9. The wireless control system according to claim 7 , wherein the physical property is capacitance.

10. A method for manufacturing a touch-sensitive module, comprising steps of:

forming a first sensor pad, a second sensor pad and a lead frame, the lead frame comprising a main frame and a plurality of frame branches, each of the frame branches having a first end and a second end wherein the first end is connected to one of the first sensor pad and the second sensor pad, and the second end is connected to the main frame;

forming a wrapper covering the first sensor pad and the second sensor pad; and

removing the main frame to form the touch-sensitive module wherein leads connected to the first sensor pad and the second sensor pad are formed from the frame branches, the leads protruding from the wrapper.

11. The method according to claim 10 , wherein the first sensor pad, the second pad and the lead frame are integrally formed by a metal stamping process, the wrapper is formed by injection molding, and the main frame is remove by a cutting process.

12. A touch-sensitive module, comprising:

a first sensor pad;

a second sensor pad disposed beside the first sensor pad;

a first circuit chip disposed between the first sensor pad and the second sensor pad or disposed on one of the first sensor pad and the second sensor pad;

a second circuit chip disposed between the first sensor pad and the second sensor pad or disposed on one of the first sensor pad and the second sensor pad; and

a wrapper covering the first sensor pad, the second sensor pad, the first circuit chip and the second circuit chip,

the first circuit chip and the second circuit chip being switched on if the sensor pads detect a touch operation on the touch-sensitive module.

13. The touch-sensitive module according to claim 12 , wherein the first circuit chip and the second circuit chip are a light-emitting diode chip and an image sensor chip, respectively, to sense a fingerprint during the touch operation.