Method of manufacturing a transparent substrate

1. A manufacturing method of a transparent substrate, comprising:

forming a resin pattern layer including a plurality of grooves respectively including a side surface and a bottom surface;

forming a conductive layer by depositing a metal on the resin pattern layer, while an average height of the conductive layer is controlled to be 5% to 50% of a maximum depth of each of the grooves and a metal deposition angle is controlled to be within a range of −15° to 15° with respect to a direction of a normal line of the resin pattern layer; and

physically removing the conductive layer from remaining regions of the resin pattern layer, other than portions of the conductive layer present in the grooves, by a method of polishing and removing the conductive layer using a melamine foam or a fabric having a rough surface.

2. The manufacturing method of claim 1 , wherein a maximum width of the groove is 0.1 μm to 3 μm, and

the maximum depth of the groove is 0.2 times to 2 times the maximum width of the groove.

3. The manufacturing method of claim 1 , wherein the side surface of the groove has an angle of inclination ranging from 0° to 15°, with respect to a vertical direction.

4. The manufacturing method of claim 1 , wherein a radius of curvature of an upper edge on the side surface of the groove is equal to or less than 0.3 times the maximum depth of the groove.

5. The manufacturing method of claim 1 , wherein a total area of bottom surfaces of the grooves is 0.1% to 5% of an overall cross-sectional area of the resin pattern layer.

6. The manufacturing method of claim 1 , wherein the forming of the resin pattern layer including the plurality of grooves is performed by an imprinting method, a photolithography method, or an electron beam lithography method.

7. The manufacturing method of claim 1 , wherein the forming of the conductive layer is performed such that a thickness of the conductive layer deposited on the side surface of the groove is 25% or less of the average height of the conductive layer.

8. The manufacturing method of claim 1 , wherein the forming of the conductive layer further includes forming an adhesion controlling layer on the resin pattern layer prior to the deposition of the metal.

9. The manufacturing method of claim 8 , wherein the forming of the adhesion controlling layer is performed by a chemical vapor deposition method or a physical vapor deposition method.

10. The manufacturing method of claim 1 , wherein the forming of the conductive layer further includes forming a blackening layer.

11. The manufacturing method of claim 10 , wherein the forming of the blackening layer is performed by a chemical vapor deposition method or a physical vapor deposition method.

12. The manufacturing method of claim 1 , further comprising:

planarizing the resin pattern layer after the physically removing the conductive layer.

13. The manufacturing method of claim 11 , wherein the forming of the blackening layer is performed such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer.

14. The manufacturing method of claim 1 , wherein the forming of the adhesion controlling layer is performed such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer.

15. A manufacturing method of a transparent substrate, comprising:

forming a resin pattern layer including a plurality of grooves respectively including a side surface and a bottom surface;

forming a conductive layer by:

forming an adhesion controlling layer on the resin pattern layer such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer; and

depositing a metal on the adhesion controlling layer on the resin pattern layer, while an average height of the conductive layer is controlled to be 5% to 50% of a maximum depth of each of the grooves and a metal deposition angle is controlled to be within a range of −15° to 15° with respect to a direction of a normal line of the resin pattern layer; and

physically removing the conductive layer from remaining regions of the resin pattern layer, other than portions of the conductive layer present in the grooves.

16. The manufacturing method of claim 15 , wherein a maximum width of the groove is 0.1 μm to 3 μum, and

the maximum depth of the groove is 0.2 times to 2 times the maximum width of the groove.

17. The manufacturing method of claim 15 , wherein the side surface of the groove has an angle of inclination ranging from 0° to 15°, with respect to a vertical direction.

18. The manufacturing method of claim 15 , wherein a radius of curvature of an upper edge on the side surface of the groove is equal to or less than 0.3 times the maximum depth of the groove.

19. The manufacturing method of claim 15 , wherein a total area of bottom surfaces of the grooves is 0.1% to 5% of an overall cross-sectional area of the resin pattern layer.

20. The manufacturing method of claim 15 , wherein the forming of the resin pattern layer including the plurality of grooves is performed by an imprinting method, a photolithography method, or an electron beam lithography method.

21. The manufacturing method of claim 15 , wherein the forming of the conductive layer is performed such that a thickness of the conductive layer deposited on the side surface of the groove is 25% or less of the average height of the conductive layer.

22. The manufacturing method of claim 15 , wherein the physically removing the conductive layer is performed by a scraping method, a detaching method or a combination thereof.

23. The manufacturing method of claim 15 , wherein the physically removing the conductive layer is performed by a method of polishing and removing the conductive layer, using a melamine foam or a fabric having a rough surface.

24. The manufacturing method of claim 15 , wherein the forming of the conductive layer further includes forming a blackening layer by a chemical vapor deposition method or a physical vapor deposition method.

25. The manufacturing method of claim 24 , wherein the forming of the blackening layer is performed such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer.

26. The manufacturing method of claim 15 , further comprising planarizing the resin pattern layer after physically removing the conductive layer.

27. A manufacturing method of a transparent substrate, comprising:

forming a resin pattern layer including a plurality of grooves respectively including a side surface and a bottom surface;

forming a conductive layer by:

depositing a metal on the resin pattern layer, while an average height of the conductive layer is controlled to be 5% to 50% of a maximum depth of each of the grooves and a metal deposition angle is controlled to be within a range of −15° to 15° with respect to a direction of a normal line of the resin pattern layer; and

forming a blackening layer by a chemical vapor deposition method or a physical vapor deposition method, wherein the forming of the blackening layer is performed such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer; and

physically removing the conductive layer from remaining regions of the resin pattern layer, other than portions of the conductive layer present in the grooves.

28. The manufacturing method of claim 27 , wherein a maximum width of the groove is 0.1 μm to 3 μm, and

the maximum depth of the groove is 0.2 times to 2 times the maximum width of the groove.

29. The manufacturing method of claim 27 , wherein the side surface of the groove has an angle of inclination ranging from 0° to 15°, with respect to a vertical direction.

30. The manufacturing method of claim 27 , wherein a radius of curvature of an upper edge on the side surface of the groove is equal to or less than 0.3 times the maximum depth of the groove.

31. The manufacturing method of claim 27 , wherein a total area of bottom surfaces of the grooves is 0.1% to 5% of an overall cross-sectional area of the resin pattern layer.

32. The manufacturing method of claim 27 , wherein the forming of the resin pattern layer including the plurality of grooves is performed by an imprinting method, a photolithography method, or an electron beam lithography method.

33. The manufacturing method of claim 27 , wherein the forming of the conductive layer is performed such that a thickness of the conductive layer deposited on the side surface of the groove is 25% or less of the average height of the conductive layer.

34. The manufacturing method of claim 27 , wherein the physically removing the conductive layer is performed by a scraping method, a detaching method or a combination thereof.

35. The manufacturing method of claim 27 , wherein the physically removing the conductive layer is performed by a method of polishing and removing the conductive layer, using a melamine foam or a fabric having a rough surface.

36. The manufacturing method of claim 27 , wherein the forming of the conductive layer further includes forming an adhesion controlling layer on the resin pattern layer prior to the deposition of the metal, wherein the forming of the adhesion controlling layer is performed by a chemical vapor deposition method or a physical vapor deposition method.

37. The manufacturing method of claim 27 , wherein the forming of the adhesion controlling layer is performed such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer.

38. The manufacturing method of claim 27 , further comprising planarizing the resin pattern layer after physically removing the conductive layer.