IP Library Granted Patent US 9,786,850
Granted Patent B2
US 9,786,850 · App. 14/018,075 · Granted Oct 10, 2017

Methods and systems for scaffolds comprising nanoelectronic components

Inventors: Charles M. Lieber (Lexington, MA); Bozhi Tian (Chicago, IL); Jia Liu (Somerville, MA)
Assignee: President and Fellows of Harvard College
H01L51/0504A61L27/025A61L27/18A61L27/20A61L27/24A61L27/3633A61L27/38A61L27/3826A61L27/40A61L27/50A61L27/56C12M25/14C12N5/0068G01N27/4145G01N27/4146H01L51/003H01L51/0017H01L51/0021H01L51/0093H01L51/0575A61L2400/08A61L2400/12B82Y15/00C12N2533/00C12N2533/30C12N2533/40C12N2533/54C12N2533/74C12N2533/90
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Quick Facts
Patent No.
US 9,786,850
App. No.
14/018,075
Granted
Oct 10, 2017
Kind
B2
Abstract

The present invention generally relates to nanoscale wires and tissue engineering. Systems and methods are provided in various embodiments for preparing cell scaffolds that can be used for growing cells or tissues, where the cell scaffolds comprise nanoscale wires. In some cases, the nanoscale wires can be connected to electronic circuits extending externally of the cell scaffold. Such cell scaffolds can be used to grow cells or tissues which can be determined and/or controlled at very high resolutions, due to the presence of the nanoscale wires, and such cell scaffolds will find use in a wide variety of novel applications, including applications in tissue engineering, prosthetics, pacemakers, implants, or the like. This approach thus allows for the creation of fundamentally new types of functionalized cells and tissues, due to the high degree of electronic control offered by the nanoscale wires and electronic circuits.

Claims (28)

1. A method, comprising:

forming a polymeric material on at least a portion of a substrate, wherein the substrate comprises a sacrificial material, wherein the polymeric material comprises one or more polymeric layers that surround one or more nanoscale wires, and wherein forming the polymeric material on the substrate comprising the sacrificial material comprises: depositing one or more bedding polymers on at least a portion of the sacrificial material as one or more layers, and depositing one or more nanoscale wires on at least a portion of the uppermost layer of bedding polymer;

forming one or more metal leads on the polymeric material; and

removing at least a portion of the sacrificial material.

2. The method of claim 1 , further comprising depositing the sacrificial material on the substrate to form the substrate comprising a sacrificial material, prior to forming the polymeric material on the substrate.

3. The method of claim 1 , comprising:

depositing a first bedding polymer on at least a portion of the sacrificial material;

depositing a second bedding polymer on at least a portion of the first bedding polymer; and

depositing one or more nanoscale wires on at least a portion of the second bedding polymer.

4. The method of claim 1 , further comprising aligning the deposited nanoscale wires.

5. The method of claim 1 , wherein forming one or more metal leads comprises:

depositing one or more lead polymers on at least some of the one or more the nanoscale wires;

depositing one or more metals on at least a portion of the one or more lead polymers; and

removing a portion of the one or more metals to form the one or more metal leads.

6. The method of claim 5 , wherein depositing one or more metals on at least a portion of the one or more lead polymers comprises:

depositing a first metal on the one or more lead polymers; and

depositing a second metal on at least a portion of the first metal.

7. The method of claim 6 , further comprising depositing a third metal on at least a portion of the second metal.

8. The method of claim 7 , wherein the first metal, the second metal, and the third metal are deposited in a pre-stressed arrangement.

9. The method of claim 1 , further comprising forming the polymeric material and the one or more metal leads into a 3-dimensional structure.

10. The method of claim 9 , comprising rolling the polymeric material and the one or more metal leads into a 3-dimensional structure.

11. The method of claim 9 , comprising folding the polymeric material and the one or more metal leads into a 3-dimensional structure.

12. The method of claim 9 , wherein upon removing at least a portion of the sacrificial material, the polymeric material and the one or more metal leads spontaneously forms a 3-dimensional structure.

13. The method of claim 1 , wherein the polymeric material comprises a biocompatible polymer layer.

14. The method of claim 1 , further comprising depositing an extracellular matrix protein on at least a portion of the polymeric material.

15. The method of claim 1 , further comprising seeding one or more cells onto the polymeric material.

16. The method of claim 1 , further comprising exposing the polymeric material to a cell growth medium.

17. The method of claim 1 , further comprising connecting the one or more metal leads to an external electrical circuit.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2013
From: LIEBER, CHARLES M.; TIAN, BOZHI; LIU, JIA
To: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
Reel/Frame 031342/0720 →
CONFIRMATORY LICENSE Recorded Sep 27, 2013
From: HARVARD UNIVERSITY
To: NATIONAL INSTITUTES OF HEALTH (NIH), U.S. DEPT. OF HEALTH AND HUMAN SERVICES (DHHS), U.S. GOVERNMENT
Reel/Frame 031305/0274 →
Continuity (3)
Provisional Application 61698492 · Sep 7, 2012
Provisional Application 61723213 · Nov 6, 2012
Related Publication 20140073063A1 · Mar 13, 2014