IP Library Granted Patent US 9,799,798
Granted Patent B1
US 9,799,798 · App. 15/379,786 · Granted Oct 24, 2017

Thermal emitter comprising near-zero permittivity materials

Inventors: Ting S. Luk (Albuquerque, NM); Salvatore Campione (Albuquerque, NM); Michael B. Sinclair (Albuquerque, NM)
Assignee: National Technology & Engineering Solutions of Sandia, LLC
H01L33/06H01L33/0025H01L33/30
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Quick Facts
Patent No.
US 9,799,798
App. No.
15/379,786
Granted
Oct 24, 2017
Kind
B1
Abstract

A novel thermal source comprising a semiconductor hyperbolic metamaterial provides control of the emission spectrum and the angular emission pattern. These properties arise because of epsilon-near-zero conditions in the semiconductor hyperbolic metamaterial. In particular, the thermal emission is dominated by the epsilon-near-zero effect in the doped quantum wells composing the semiconductor hyperbolic metamaterial. Furthermore, different properties are observed for s and p polarizations, following the characteristics of the strong anisotropy of hyperbolic metamaterials.

Claims (9)

1. A thermal emitter, comprising:

a semiconductor hyperbolic metamaterial comprising periodic alternating layers of a doped semiconductor material and an undoped semiconductor material forming a plurality of quantum wells, wherein the period is subwavelength to emitted infrared light and wherein the wavelength of emitted infrared light occurs near the epsilon-near-zero condition of the doped semiconductor material layers.

2. The thermal emitter of claim 1 , wherein the wavelength of the emitted infrared is between 2.5 and 25 microns.

3. The thermal emitter of claim 1 , wherein the periodicity is lees than, one-tenth the wavelength of the emitted infrared light.

4. The thermal emitter of claim 1 , wherein the dopant density of the doped semiconductor material is sufficient to achieve an epsilon-near-zero condition at a desired wavelength of the emitted infrared light.

5. The thermal emitter of claim 4 , wherein the dopant density of the doped semiconductor material is greater than 2×10 19 cm −3 .

6. The thermal emitter of claim 1 , wherein the doped semiconductor material comprises InGaAs and the undoped semiconductor material comprises InAlAs.

7. The thermal emitter of claim 1 , wherein the doped semiconductor material comprises GaAs and the undoped semiconductor material comprises AlGaAs.

8. The thermal emitter of claim 1 , wherein the doped semiconductor material comprises InAs and the undoped semiconductor material comprises GaSb.

Assignments (3)
CHANGE OF NAME Recorded Aug 31, 2017
From: SANDIA CORPORATION
To: NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC
Reel/Frame 043743/0039 →
CONFIRMATORY LICENSE Recorded Feb 7, 2017
From: SANDIA CORPORATION
To: U.S. DEPARTMENT OF ENERGY
Reel/Frame 041191/0384 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2017
From: LUK, TING S.; CAMPIONE, SALVATORE; SINCLAIR, MICHAEL B.
To: SANDIA CORPORATION
Reel/Frame 041065/0196 →