IP Library Granted Patent US 9,801,280
Granted Patent B2
US 9,801,280 · App. 14/940,624 · Granted Oct 24, 2017

Electronic device and circuit module thereof

Inventors: Han-Hung Cheng (Zhubei, TW); Chi-Fen Kuo (Zhubei, TW)
Assignee: Alson Technology Limited
H05K1/18G06F1/185G09F13/04G09F23/00H05K2201/10106H05K2201/10121
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Quick Facts
Patent No.
US 9,801,280
App. No.
14/940,624
Granted
Oct 24, 2017
Kind
B2
Abstract

A circuit module includes a main body and a PCI-E insert row, the main body has a substrate portion and a light-emitting portion, the substrate portion includes a board and a first coating layer, the board has a light-transmittable portion and a first face, the first coating layer is coated on the first face, the first coating layer has an emergent light-transmittable portion corresponding to the light-transmittable portion. The PCI-E insert row is disposed on the substrate portion. The electronic device includes the circuit module mentioned above and further includes a shell portion. The shell portion is covered on two opposite lateral faces of the circuit module and at least shields the light-emitting portion, and the shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion.

Claims (13)

1. A circuit module, including:

a main body, having a substrate portion and a light-emitting portion, the substrate portion including a board and a first coating layer, the board having a light-transmittable portion and a first face, the first coating layer being coated on the first face, the first coating layer being formed with an emergent light-transmittable portion corresponding to the light-transmittable portion, light from the light-emitting portion being projectable through the light-transmittable portion and projectable via the emergent light-transmittable portion to an exterior of the circuit module;

a Peripheral Component Interconnect Express (PCI Express, PCI-E) insert row, disposed on the substrate portion.

2. The circuit module of claim 1 , wherein the board further has a second face, the substrate portion further includes a second coating layer coated on the second face, the second coating layer is formed with an incident light-transmittable portion corresponding to the light-transmittable portion, the light from the light-emitting portion is projectable through the incident light-transmittable portion to the light-transmittable portion, the light-emitting portion is disposed on the substrate portion, and the light-emitting portion is arranged neighboring to the incident light-transmittable portion.

3. The circuit module of claim 2 , wherein the light-emitting portion includes a plurality of light-emitting diodes which are disposed on the substrate portion along a contour of the incident light-transmittable portion.

4. The circuit module of claim 1 , wherein the emergent light-transmittable portion is a light-transmittable pattern portion, and the emergent light-transmittable portion is a hollow-out structure or a layer made of a light-transmittable material.

5. The circuit module of claim 1 , wherein the substrate portion is further provided with an electronic unit, the electronic unit is electrically connected with the PCI-E insert row, and the electronic unit is either a graphic processing module or a display processing module.

6. An electronic device, including the circuit module of claim 1 , further including:

a shell portion, covered on two opposite lateral faces of the circuit module and at least shielding the light-emitting portion, the shell portion further having a second light-transmittable portion corresponding to the emergent light-transmittable portion, and light projected from the emergent light-transmittable portion being projectable through the second light-transmittable portion to an exterior of the electronic device.

7. The electronic device of claim 6 , wherein a reflection structure is disposed on the shell portion and corresponds to the light-emitting portion, and the reflection structure reflects a part of the light from the light-emitting portion to the light-transmittable portion.

8. The electronic device of claim 7 , wherein the reflection structure is a height-differentiated structure.

9. The electronic device of claim 6 , wherein the second light-transmittable portion is a hollow-out structure or a layer made of a light-transmittable material.

10. The electronic device of claim 6 , wherein the shell portion is a heat-dissipating shell portion.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2017
From: AVEXIR TECHNOLOGIES CORPORATION
To: ALSON TECHNOLOGY LIMITED
Reel/Frame 042041/0849 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2016
From: CHENG, HAN-HUNG; KUO, CHI-FEN
To: AVEXIR TECHNOLOGIES CORPORATION
Reel/Frame 037531/0969 →
Continuity (1)
Related Publication 20170142832A1 · May 18, 2017