Probe pin and method for producing a probe pin
A probe pin ( 100, 100 ′) for electronic testing of semi-conductor elements is provided. The pin contains an electrically conductive core element ( 200 ) made up of a metallic alloy, and an electrically insulating jacket element ( 300 ) which surrounds the core element ( 200 ) over regions thereof. The core element ( 200 ) contains a distal contact section ( 210 ) for electrical contacting to a semi-conductor element. The metallic alloy of the core element contains at least 67% by weight rhodium, 0.1% by weight to 1% by weight zirconium, up to 1% by weight yttrium, and up to 1% by weight cerium. A method for producing a probe pin is also described.
1. A probe pin for electronic testing of semi-conductor elements, comprising an electrically conductive core element comprising a metallic alloy, and an electrically insulating jacket element, wherein the electrically insulating jacket element surrounds the electrically conductive core element over regions thereof, wherein the electrically conductive core element comprises a distal contact section for electrical contact with a semi-conductor element, and wherein the metallic alloy of the electrically conductive core element comprises at least 67% by weight rhodium; 0.1% by weight to 1% by weight zirconium; up to 1% by weight yttrium; and up to 1% by weight cerium.
2. The probe pin according to claim 1 , wherein the metallic alloy comprises at least 97% by weight rhodium.
3. The probe pin according to claim 1 , wherein the metallic alloy comprises 0.1% by weight to 0.6% by weight zirconium.
4. The probe pin according to claim 1 , wherein the metallic alloy comprises 0.01% by weight to 0.5% by weight yttrium and/or 0.01% by weight to 0.5% by weight cerium.
5. The probe pin according to claim 1 , wherein the metallic alloy comprises a grain refinement and a higher extensibility compared to at least 99.999% pure rhodium.
6. The probe pin according to claim 1 , wherein the hardness of the metallic alloy in hard-drawn condition ranges from 500 Vickers Pyramid Number (HV) to 750 HV and/or the hardness in a heat-treated condition ranges from 400 HV to 650 HV.
7. The probe pin according to claim 1 , wherein the electrically insulating jacket element fully surrounds the electrically conductive core element in a circumferential direction and partly surrounds the electrically conductive core element in a longitudinal direction.
8. The probe pin according to claim 1 , further comprising an electrically conductive layer-like encompassing element fully surrounding the electrically insulating jacket element in a circumferential direction and at least partly in a longitudinal direction, and wherein the electrically conductive layer-like encompassing element counteracts cross-talk between probe pins arranged next to each other.
9. The probe pin according to claim 1 , wherein the distal contact section is conical in shape.
10. The probe pin according to claim 1 , wherein the electrically conductive core element comprises a proximal contact section for electrical contacting with a probe card.
11. A method for producing a probe pin for electronic testing of semi-conductor elements, wherein the probe pin comprises an electrically conductive core element comprising a metallic alloy and an electrically insulating jacket element, wherein the electrically insulating jacket element surrounds the electrically conductive core element over regions thereof and the electrically conductive core element comprises a distal contact section for electrical contacting the probe pin with a semi-conductor element, the method comprising the steps of:
a. providing a cylinder-like pre-mold comprising the metallic alloy forming the electrically conductive core element, wherein the metallic alloy comprises at least 67% by weight rhodium; 0.1% by weight to 1% by weight zirconium; up to 1% by weight yttrium; and up to 1% by weight cerium;
b. drawing the pre-mold into a wire;
c. subdividing the wire into wire-sections to provide the electrically conductive core element of the probe pin;
d. applying the electrically insulating jacket element onto the electrically conductive core element; and
e. providing a cone-like distal contact section of the electrically conductive core element.
12. The method according to claim 11 , further comprising hardening the metallic alloy through a temperature treatment to adjust the hardness.
13. The method according to claim 12 , wherein the temperature treatment is performed at a temperature between 150° C. and 600° C. and for a period of at least 10 minutes.
14. The method according to claim 11 , wherein step e. comprises etching to produce the cone-like distal contact section of the core element.
15. A probe pin for electronic testing of semi-conductor elements manufactured according to claim 11 .