High Tg epoxy formulation with good thermal properties
Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
1. A prepreg comprising a b-staged varnish composition including:
30-60 parts by weight of a multi-functional epoxy wherein the multi-functional resin is not an eight-functional bisphenol-A novolac epoxy resin;
80-150 parts by weight of an eight-functional bisphenol-A novolac epoxy resin;
30-60 parts by weight of a bifunctional epoxy resin;
20-50 parts by weight of a hardener selected from 4,4′diaminodiphenylsulfone, 3,3′-diaminodiphenylsulfone and mixtures thereof; and
10-70 parts by weight of a flame retardant wherein the prepreg is capable of being c-staged to a composite having a DMA Tg in excess of 280° C. and a T288 time in excess of 20 minutes.
2. The prepreg of claim 1 wherein the multifunctional epoxy resin and the eight functional bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1.8 to about 1:2.0.
3. The prepreg of claim 1 wherein the hardener is 4,4′-diaminophenylsulfone.
4. The prepreg of claim 1 wherein the at least one flame retardant is decabromodiphenylethane.
5. A printed circuit board including at least one layer that is a c-staged prepreg of claim 1 .
6. A prepreg comprising a b-staged varnish composition including:
30-60 parts by weight of a multi-functional epoxy resin wherein the multi-functional resin is not an eight-functional bisphenol-A novolac epoxy resin;
80-150 parts by weight of an eight-functional bisphenol-A novolac epoxy resin;
30-60 parts by weight of a bifunctional epoxy resin;
20-50 parts by weight of a hardener selected from 4,4′-diaminodiphenylsulfone, 3,3′-diaminodiphenylsulfone and mixtures thereof;
10-70 parts by weight of a flame retardant;
0-50 parts of a filler;
0-5 parts of a rubber; and
0-5 parts of a Lewis acid wherein the prepreg is capable of being c-staged to a composite having a DMA Tg in excess of 280° C. and a T288 time in excess of 20 minutes.