IP Library Assignment 075784/0206
Patent Assignment
Reel/Frame 075784/0206

Release of Security Interest

Recorded: 2026-06-17 Pages: 10
Assignor
CERBERUS BUSINESS FINANCE, LLC
Executed: 2026-06-15
Assignee
ISOLA USA CORP.
6565 WEST FRYE ROAD, CHANDLER, ARIZONA, 85226
Covered Properties (46)
Ultrathin Laminates
Application: 13/404,867 →
Publication: US US20120219777A1
Ultrathin Laminates
Application: 14/196,799 →
Publication: US US20140231007A1
Synthesized Resins and Varnishes and Prepegs and Laminates Made Therefrom
Application: 13/839,978 →
Publication: US US20140024278A1
Varnishes and Prepregs and Laminates Made Therefrom
Application: 14/515,095 →
Publication: US US20150105505A1
Prepregs and Laminates Having Homogeneous Dielectric Properties
Application: 14/512,815 →
Publication: US US20150030822A1
Thin Resin Films And Their Use in Layups
Application: 15/099,715 →
Publication: US US20160234948A1
High Tg Epoxy Formulation with Good Thermal Properties
Application: 15/786,131 →
Publication: US US20180251618A1
Prepregs and Laminates Having a UV Curable Resin Layer
Application: 15/403,253 →
Publication: US US20170127525A1
Ultrathin Laminates
Application: 15/861,346 →
Publication: US US20180354233A1
Prepregs and Laminates Having Homogeneous Dielectric Properties
Application: 16/056,131 →
Publication: US US20190208628A1
High Tg Epoxy Formulation with Good Thermal Properties
Application: 16/515,127 →
Publication: US US20200181342A1
Method of Manufacturing Circuit Boards
Application: 15/761,366 →
Publication: US US20180279481A1
Improved SMA Resin Formulation
Application: 16/320,282 →
Publication: US US20190270873A1
Synthesized Resins and Varnishes and Prepegs and Laminates Made Therefrom
Patent: 8,871,870 →
Application: 13/840,056 →
Publication: US US20140011962A1
Positive Acting Photodielectric Composition
Patent: 6,168,898 →
Application: 09/024,997 →
Fabrication of High Density Multilayer Interconnect Printed Circuit Boards
Patent: 6,255,039 →
Application: 09/054,264 →
Methods of Manufacturing Voidless Resin Impregnated Webs
Patent: 6,083,855 →
Application: 09/224,991 →
System of Electronic Laminates with Improved Registration Properties
Patent: 5,464,658 →
Application: 08/246,054 →
High Density Printed Circuit Substrate and Method of Fabrication
Patent: 6,242,078 →
Application: 09/123,952 →
Halogen Free Flame Retardant Adhesive Resin Coated Composite
Patent: 6,440,567 →
Application: 09/716,067 →
Thermosetting Resin Composition for High Performance Laminates
Patent: 7,090,924 →
Application: 10/309,720 →
Publication: US US20030198823A1
Laminate Composition
Patent: 7,255,927 →
Application: 10/385,044 →
Publication: US US20040146728A1
Compensation Model and Registration Simulation Apparatus and Method for Manufacturing of Printed Circuit Boards
Patent: 6,658,375 →
Application: 09/270,303 →
Laminate Composition for Producing Reduced Curl Flat Thin Core Laminate
Patent: 8,263,225 →
Application: 10/858,344 →
Publication: US US20050266756A1
Thermosetting Resin Composition for High Performance Laminates
Patent: 8,227,084 →
Application: 12/773,480 →
Publication: US US20110111662A1
Epoxy Resin, Sma Copolymer and Bis-Maleimidetriazine Resin
Patent: 7,521,494 →
Application: 11/185,259 →
Publication: US US20050250916A1
Prepreg and Laminate of Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Bis-Maleimidetriazine
Patent: 7,713,621 →
Application: 12/417,463 →
Publication: US US20100009201A1
Thermosetting Resin Composition for High Performance Laminates
Patent: 7,425,371 →
Application: 11/132,846 →
Publication: US US20050215707A1
Parallel Plate Buried Capacitor
Patent: 6,618,238 →
Application: 09/276,370 →
Publication: US US20010014004A1
Method of Bulk Fabricating Printed Wiring Board Laminates
Patent: 6,609,294 →
Application: 09/671,386 →
Surface Enhanced Metal Press Plates for Use in Manufacture of Laminates and Multilayer Materials and Method of Making Same
Patent: 6,584,820 →
Application: 09/666,431 →
Laser Cutting of Laminates for Electrical Insulation Testing
Patent: 6,768,316 →
Application: 10/316,665 →
Publication: US US20040115405A1
Manufacture of Prepregs and Laminates with Relatively Low Dielectric Constant for Printed Circuit Boards
Patent: 6,632,511 →
Application: 10/035,975 →
Publication: US US20030091800A1
Cyanate Ester Based Thermoset Compositions
Patent: 6,403,229 →
Application: 09/760,125 →
Publication: US US20010016616A1
Production of Laminates for Printed Wiring Boards Using Protective Carrier
Patent: 6,955,740 →
Application: 10/044,628 →
Publication: US US20030127187A1
Flame Retardant Compositions
Patent: 7,687,556 →
Application: 10/952,033 →
Publication: US US20060069185A1
Flame Retardant Compositions with a Phosphorated Compound
Patent: 8,129,456 →
Application: 11/269,132 →
Publication: US US20060102882A1
High Tg Epoxy Formulation with Good Thermal Properties
Patent: 9,822,227 →
Application: 14/743,093 →
Publication: US US20160075839A1
Prepregs and Laminates Having a UV Curable Resin Layer
Patent: 9,579,868 →
Application: 14/838,092 →
Publication: US US20160007482A1
Prepregs Including UV Curable Resins Useful for Manufacturing Semi-Flexible PCBs
Patent: 9,764,532 →
Application: 14/838,098 →
Publication: US US20160007442A1
Flame Retardant Compositions with a Phosphorated Compound
Patent: 8,697,864 →
Application: 13/411,823 →
Publication: US US20120277347A1
Prepregs Including UV Curable Resins Useful for Manufacturing Semi-Flexible PCBs
Application: 15/693,001 →
Publication: US US20180200992A1
Dopo-Derived Flame Retardant and Epoxy Resin Composition
Patent: 8,536,256 →
Application: 13/319,486 →
Publication: US US20120055705A1
Process For The Preparation Of Dopo-Derived Compounds And Compositions Thereof
Patent: 9,012,546 →
Application: 13/638,482 →
Publication: US US20130018128A1
Dopo Derivative Flame Retardants
Patent: 9,522,927 →
Application: 14/464,156 →
Publication: US US20140357885A1
Process for the Preparation of Dopo-Derived Compounds and Compositions Thereof
Patent: 9,562,063 →
Application: 15/220,261 →
Publication: US US20160333039A1
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 17, 1998
From: XU, CHENGZENG; HUANG, MING MEI; LEYRER, LAURA M.
To: ALLIEDSIGNAL INC.
Reel/Frame 009044/0432 →
Assignment of Assignor's Interest May 29, 1998
From: XU, CHENGZENG; YARDLEY, JAMES T.; HAAS, DAVID; VALLANCE, MICHAEL
To: ALLIEDSIGNAL INC.
Reel/Frame 009228/0266 →
Assignment of Assignor's Interest Oct 9, 1998
From: POMMER, RICHARD J.; GOTRO, JEFFREY T.; ANDROFF, NANCY M. W.; HEIN, MARC D.
To: ALLIEDSIGNAL INC.
Reel/Frame 009506/0869 →
"Document Previously Recorded at Reel 9747 Frame 0592 Contained Errors in Property Number 09244991. Document Rerecorded to Correct Error to Number 09224991. Feb 8, 1999
From: OLSON, LARRY D.; WOLD, JOHN R.; MILLER, DAVE F.; HEIN, MARC
To: ALLIEDSIGNAL, INC.
Reel/Frame 009991/0953 →
Assignment of Assignor's Interest Dec 2, 1999
From: ALLIEDSIGNAL TECHNOLOGIES INC.
To: ISOLA LAMINATE SYSTEMS CORP.
Reel/Frame 010404/0034 →
Assignment of Assignor's Interest Dec 6, 1999
From: ALLIEDSIGNAL TECHNOLOGIES INC.; ALLIEDSIGNAL INC.
To: ISOLA LAMINATE SYSTEMS CORP.
Reel/Frame 010437/0873 →
Assignment of Assignor's Interest Mar 6, 2000
From: ALLIEDSIGNAL INC.
To: ISOLA LAMINATE SYSTEMS CORP.
Reel/Frame 010653/0705 →
Assignment of Assignor's Interest Apr 2, 2001
From: CHOATE, MARTIN T.; ORMOND, BARBARA; NEHLS, MICHAEL; CZEMY, GEORG
To: ISOLA LARNINATE SYSTEMS CORP.
Reel/Frame 011661/0518 →
Security Agreement Jun 4, 2004
From: ISOLA USA CORP.
To: GENERAL ELECTRIC CAPITAL CORPORATION
Reel/Frame 014709/0082 →
Assignment of Assignor's Interest Jun 29, 2004
From: SHARMA, JYOTI; RAFFERTY, KEVIN; CHOATE, MARTIN
To: ISOLA LAMINATE SYSTEMS CORP.
Reel/Frame 015514/0382 →
Asset Purchase Agreement Jun 28, 2005
From: ISOLA LAMINATE SYSTEMS CORP.
To: ISOLA USA CORP.
Reel/Frame 016195/0165 →
Assignment of Assignor's Interest Jun 28, 2005
From: ISOLA LAMINATE SYSTEMS CORP.
To: ISOLA USA CORP.
Reel/Frame 016194/0945 →
Release of Security Interest May 24, 2006
From: GENERAL ELECTRIC CAPITAL CORPORATION
To: ISOLA USA CORP.
Reel/Frame 017663/0130 →
Security Agreement Aug 3, 2006
From: ISOLA USA CORP.
To: OBSIDIAN, LLC
Reel/Frame 018039/0759 →
Security Agreement Jan 9, 2007
From: ISOLA USA CORP.
To: UBS AG, STAMFORD BRANCH, AS COLLATERAL AGENT
Reel/Frame 018731/0465 →
Security Agreement Jan 9, 2007
From: ISOLA USA CORP.
To: GOLDMAN SACHS CREDIT PARTNERS L.P., AS COLLATERAL AGENT
Reel/Frame 018746/0030 →
Release of Patent Security Interest Jan 16, 2007
From: OBSIDIAN, LLC
To: ISOLA USA CORP.
Reel/Frame 018757/0675 →
Assignment of Patent Security Agreement Recorded at Reel/Frame 18746/0030 and 18746/0040 Apr 17, 2009
From: GOLDMAN SACHS CREDIT PARTNERS L.P.
To: WILMINGTON TRUST FSB, AS COLLATERAL AGENT
Reel/Frame 022562/0670 →
Security Agreement Oct 1, 2010
From: ISOLA USA CORP.
To: GOLDMAN SACHS LENDING PARTNERS, LLC
Reel/Frame 025077/0427 →
Release of Security Interest Oct 1, 2010
From: UBS AG, STAMFORD BRANCH
To: ISOLA USA CORP.
Reel/Frame 025077/0167 →
Release of Security Interest Oct 1, 2010
From: WILMINGTON TRUST FSB
To: ISOLA USA CORP.
Reel/Frame 025077/0145 →
Assignment of Assignor's Interest Mar 26, 2012
From: SCHUMACHER, JOHANN R.; SCHULTZ, STEVEN M.; WILSON, STANLEY E.; AMLA, TARUN
To: ISOLA USA CORP.
Reel/Frame 027928/0538 →
Assignment of Assignor's Interest May 23, 2012
From: PETERS, STEVEN
To: ISOLA LAMINATE SYSTEMS CORP.
Reel/Frame 028259/0249 →
Assignment of Assignor's Interest Oct 16, 2012
From: PETERS, STEVEN
To: ISOLA LAMINATE SYSTEMS
Reel/Frame 029138/0702 →
Assignment of Assignor's Interest Nov 5, 2013
From: HE, GUROEN; AMLA, TARUN; OLSON, LARRY D.; CONN, PEGGY
To: ISOLA USA CORP.
Reel/Frame 031548/0350 →