Patent Assignment
Reel/Frame 025077/0427
Security Agreement
Recorded: 2010-10-01
Received: 2010-10-01
Pages: 11
Assignor
ISOLA USA CORP.
Executed: 2010-09-30
Assignee
GOLDMAN SACHS LENDING PARTNERS, LLC
30 HUDSON STREET, 36TH FLOOR, JERSEY CITY, NJ, 07302, UNITED STATES
Covered Properties
(19)
Thermosetting Resin Composition for High Performance Laminates
Application:
12/773,480 →
Flame Retardant Compositions
Application:
12/610,004 →
Prepreg and Laminate of Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Bis-Maleimidetriazine
Application:
12/417,463 →
Reducing Dusting of Epoxy Laminates
Application:
12/398,762 →
Laminate Made from Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Crosslinkers
Application:
12/139,981 →
Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Crosslinking Agent
Application:
11/637,222 →
Laminates for high speed and high frequency printed circuit boards
Application:
11/634,471 →
Flame Retardant Compositions with a Phosphorated Compound
Application:
11/269,132 →
Epoxy Resin, Sma Copolymer and Bis-Maleimidetriazine Resin
Application:
11/185,259 →
Thermosetting Resin Composition for High Performance Laminates
Application:
11/132,846 →
Low expansion dielectric compositions
Application:
10/952,102 →
Flame Retardant Compositions
Application:
10/952,033 →
Laminate Composition for Producing Reduced Curl Flat Thin Core Laminate
Application:
10/858,344 →
Laminate Composition
Application:
10/385,044 →
Laser Cutting of Laminates for Electrical Insulation Testing
Application:
10/316,665 →
Thermosetting Resin Composition for High Performance Laminates
Application:
10/309,720 →
Production of Laminates for Printed Wiring Boards Using Protective Carrier
Application:
10/044,628 →
Manufacture of Prepregs and Laminates with Relatively Low Dielectric Constant for Printed Circuit Boards
Application:
10/035,975 →
Cyanate Ester Based Thermoset Compositions
Application:
09/760,125 →