Prepreg and laminate of epoxy resin, styrene-maleic anhydride copolymer and bis-maleimidetriazine

1. A prepreg comprising:

a substrate impregnated with a thermosetting resin the thermosetting resin including:

(1) at least one epoxy resin;

(2) at least one styrene-maleic anhydride copolymer;

(3) from about 15 to about 50 wt % of at least one bis-maleimidetriazine resin; and

(4) decabromodiphenylethane.

2. The prepreg of claim 1 wherein thermosetting resin composition of claim 1 including an accelerator.

3. The prepreg of claim 2 wherein the accelerator is an imidazole.

4. The prepreg of claim 1 wherein the thermosetting resin includes a filler.

5. The prepreg of claim 4 wherein the filler is selected from the group consisting of teflon, talc, quartz, ceramics, particulate metal oxides, silica, titanium dioxide, alumina, ceria, clay, boron nitride, wollastonite, and mixtures thereof.

6. The prepreg of claim 1 wherein the thermosetting resin includes:

an epoxy resin comprising 15-23 weight percent of a bisphenol-A epoxy resin, 13-26 weight percent of brominated bisphenol A diglycidyl ether, and 11-19 weight percent of tetrabromobisphenol A;

15-23 weight percent of an styrene-maelic anhydride copolymer;

2-4 weight percent of methacrylate butadiene core shell particles;

0.2-0.5 weight percent of an accelerator;

25-40 weight percent of a bismaleimidetriazine resin; and

0-10 weight percent of a filler.

7. The prepreg of claim 1 wherein the substrate is a woven glass material.

8. The prepreg of claim 1 wherein the thermosetting resin composition is at least partially cured.

9. A laminate including one or more pregregs of claim 1 and one or more sheets of conducting foil.

10. The laminate of claim 9 including at least one prepreg positioned between sheets of conducting foil.

11. The laminate of claim 9 including at least one sheet of conducting foil positioned between prepreg sheets.