Patent Assignment
Reel/Frame 031751/0828
Release of Security Interest
Recorded: 2013-12-03
Pages: 8
Assignor
GOLDMAN SACHS LENDING PARTNERS LLC
Executed: 2013-11-29
Assignee
ISOLA USA CORP.
3100 WEST RAY ROAD, SUITE 301, CHANDLER, ARIZONA, 85226
Covered Properties
(49)
Thermoplastic Film, Reinforced Hollow Glass Microsphere Reinforced Laminates for Thin Low Dielectric Constant Substrates
Patent:
5,098,781 →
Application:
07/635,087 →
High Performance Curable Ppo/Monomeric Epoxy Compositions with Tin Metal Salt Compatibilizing Agent
Patent:
5,262,491 →
Application:
07/677,229 →
System and Method for Manufacturing Copper Clad Glass Epoxy Laminates
Patent:
5,160,567 →
Application:
07/685,337 →
System of Electronic Laminates with Improved Registration Properties
Patent:
5,350,621 →
Application:
07/982,797 →
Polyimide Resin Laminates
Patent:
5,334,696 →
Application:
07/993,147 →
Multiple Layer Printed Circuit Boards and Method of Manufacture
Patent:
5,362,534 →
Application:
08/110,437 →
Copper Foil Laminate for Protecting Multilayer Articles
Patent:
5,512,381 →
Application:
08/126,478 →
Copper-Clad Laminate and Printed Wiring Board
Patent:
5,437,914 →
Application:
08/143,849 →
Substituted Cyanoguanidines as Curing Agents for Epoxy Resins
Patent:
5,387,656 →
Application:
08/153,401 →
Process for Measurement of the Degree of Cure and Percent Resin of Glass-Fiber-Reinforced Epoxy Resin Prepreg
Patent:
5,457,319 →
Application:
08/239,072 →
System of Electronic Laminates with Improved Registration Properties
Patent:
5,464,658 →
Application:
08/246,054 →
Method of Making a Circuit Board or Layer Thereof Including Semi-Curing a Second Adhesive Coated on a Cured First Adhesive
Patent:
5,557,843 →
Application:
08/297,792 →
Curing Epoxy Resins Using Dicy, Imidazole and Acid
Patent:
5,508,328 →
Application:
08/340,962 →
Method of Manufacturing Laminates and Printed Circuit Boards
Patent:
5,779,870 →
Application:
08/422,510 →
Circuit Board Prepreg with Reduced Dielectric Constant
Patent:
5,670,250 →
Application:
08/442,119 →
Copper-Clad Laminate and Printed Wiring Board
Patent:
5,545,466 →
Application:
08/500,540 →
Reducing Dusting of Epoxy Laminates
Patent:
7,507,471 →
Application:
08/540,429 →
Roller Position Controller for a Continuous Belt Press
Patent:
5,626,804 →
Application:
08/562,312 →
Solder Mask for Manufacture of Printed Circuit Boards
Patent:
5,626,774 →
Application:
08/570,260 →
Fillers for Improved Epoxy Laminates
Patent:
6,187,852 →
Application:
08/620,525 →
Positive Acting Photodielectric Composition
Patent:
6,168,898 →
Application:
09/024,997 →
Fabrication of High Density Multilayer Interconnect Printed Circuit Boards
Patent:
6,255,039 →
Application:
09/054,264 →
High Density Printed Circuit Substrate and Method of Fabrication
Patent:
6,242,078 →
Application:
09/123,952 →
Methods of Manufacturing Voidless Resin Impregnated Webs
Patent:
6,083,855 →
Application:
09/224,991 →
Epoxy Resins, Styrene-Maleic Anhydride Copolymer and Co-Crosslinking Agent
Compensation Model and Registration Simulation Apparatus and Method for Manufacturing of Printed Circuit Boards
Patent:
6,658,375 →
Application:
09/270,303 →
Parallel Plate Buried Capacitor
Surface Enhanced Metal Press Plates for Use in Manufacture of Laminates and Multilayer Materials and Method of Making Same
Patent:
6,584,820 →
Application:
09/666,431 →
Method of Bulk Fabricating Printed Wiring Board Laminates
Patent:
6,609,294 →
Application:
09/671,386 →
Talc Particles as Fillers for Improved Epoxy Laminates
Cyanate Ester Based Thermoset Compositions
Manufacture of Prepregs and Laminates with Relatively Low Dielectric Constant for Printed Circuit Boards
Production of Laminates for Printed Wiring Boards Using Protective Carrier
Thermosetting Resin Composition for High Performance Laminates
Laser Cutting of Laminates for Electrical Insulation Testing
Laminate Composition
Laminate Composition for Producing Reduced Curl Flat Thin Core Laminate
Flame Retardant Compositions
Low expansion dielectric compositions
Application:
10/952,102 →
Publication:
US 2006/0074151
Thermosetting Resin Composition for High Performance Laminates
Epoxy Resin, Sma Copolymer and Bis-Maleimidetriazine Resin
Flame Retardant Compositions with a Phosphorated Compound
Laminates for high speed and high frequency printed circuit boards
Application:
11/634,471 →
Publication:
US 2007/0178300
Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Crosslinking Agent
Laminate Made from Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Crosslinkers
Reducing Dusting of Epoxy Laminates
Prepreg and Laminate of Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Bis-Maleimidetriazine
Flame Retardant Compositions
Application:
12/610,004 →
Publication:
US 2010/0108364
Thermosetting Resin Composition for High Performance Laminates
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Dec 3, 2013
From: ISOLA USA CORP.
To: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 031752/0404 →
Assignment of Security Agreement
May 16, 2017
From: JEFFERIES FINANCE LLC
To: CERBERUS BUSINESS FINANCE, LLC
Reel/Frame 042467/0299 →
Security Interest
Jan 2, 2018
From: ISOLA USA CORP.
To: CERBERUS BUSINESS FINANCE, LLC, AS COLLATERAL AGENT (FIRST LIEN)
Reel/Frame 044519/0030 →