Patent Assignment
Reel/Frame 031752/0404
Security Agreement
Recorded: 2013-12-03
Pages: 11
Assignor
ISOLA USA CORP.
Executed: 2013-11-29
Assignee
JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
520 MADISON AVENUE, NEW YORK, NEW YORK, 10022
Covered Properties
(43)
System of Electronic Laminates with Improved Registration Properties
Patent:
5,464,658 →
Application:
08/246,054 →
Curing Epoxy Resins Using Dicy, Imidazole and Acid
Patent:
5,508,328 →
Application:
08/340,962 →
Method of Manufacturing Laminates and Printed Circuit Boards
Patent:
5,779,870 →
Application:
08/422,510 →
Circuit Board Prepreg with Reduced Dielectric Constant
Patent:
5,670,250 →
Application:
08/442,119 →
Reducing Dusting of Epoxy Laminates
Patent:
7,507,471 →
Application:
08/540,429 →
Solder Mask for Manufacture of Printed Circuit Boards
Patent:
5,626,774 →
Application:
08/570,260 →
Fillers for Improved Epoxy Laminates
Patent:
6,187,852 →
Application:
08/620,525 →
Positive Acting Photodielectric Composition
Patent:
6,168,898 →
Application:
09/024,997 →
Fabrication of High Density Multilayer Interconnect Printed Circuit Boards
Patent:
6,255,039 →
Application:
09/054,264 →
High Density Printed Circuit Substrate and Method of Fabrication
Patent:
6,242,078 →
Application:
09/123,952 →
Methods of Manufacturing Voidless Resin Impregnated Webs
Patent:
6,083,855 →
Application:
09/224,991 →
Epoxy Resins, Styrene-Maleic Anhydride Copolymer and Co-Crosslinking Agent
Compensation Model and Registration Simulation Apparatus and Method for Manufacturing of Printed Circuit Boards
Patent:
6,658,375 →
Application:
09/270,303 →
Parallel Plate Buried Capacitor
Surface Enhanced Metal Press Plates for Use in Manufacture of Laminates and Multilayer Materials and Method of Making Same
Patent:
6,584,820 →
Application:
09/666,431 →
Method of Bulk Fabricating Printed Wiring Board Laminates
Patent:
6,609,294 →
Application:
09/671,386 →
Talc Particles as Fillers for Improved Epoxy Laminates
Cyanate Ester Based Thermoset Compositions
Manufacture of Prepregs and Laminates with Relatively Low Dielectric Constant for Printed Circuit Boards
Production of Laminates for Printed Wiring Boards Using Protective Carrier
Thermosetting Resin Composition for High Performance Laminates
Laser Cutting of Laminates for Electrical Insulation Testing
Laminate Composition
Laminate Composition for Producing Reduced Curl Flat Thin Core Laminate
Flame Retardant Compositions
Thermosetting Resin Composition for High Performance Laminates
Epoxy Resin, Sma Copolymer and Bis-Maleimidetriazine Resin
Flame Retardant Compositions with a Phosphorated Compound
Laminates for high speed and high frequency printed circuit boards
Application:
11/634,471 →
Publication:
US 2007/0178300
Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Crosslinking Agent
Laminate Made from Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Crosslinkers
Reducing Dusting of Epoxy Laminates
Prepreg and Laminate of Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Bis-Maleimidetriazine
Thermosetting Resin Composition for High Performance Laminates
Copolymer of Styrene and Maleic Anhydride Comprising an Epoxy Resin Composition and a Co-Cross-Linking Agent
Ultrathin Laminates
Application:
13/404,867 →
Publication:
US 2012/0219777
Thermosetting Resin Compositions For High Performance Laminates
Application:
13/555,777 →
Publication:
US 2012/0289113
Copolymer of Styrene and Maleic Anhydride Comprising an Epoxy Resin Composition and Co-Cross-Linking Agent
Application:
13/630,558 →
Publication:
US 2013/0230727
Prepregs and Laminates Having Homogeneous Dielectric Properties
Application:
13/803,698 →
Publication:
US 2014/0220844
Synthesized Resins and Varnishes and Prepegs and Laminates Made Therefrom
Application:
13/839,978 →
Publication:
US 2014/0024278
Synthesized Resins and Varnishes and Prepegs and Laminates Made Therefrom
Prepregs and Laminates Having Homogeneous Dielectric Properties
Application:
61/761,669 →
Synthesized Resins and Varnishes, Prepregs and Laminates Made Therefrom
Application:
61/889,837 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Aug 18, 2008
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 021423/0001 →
Assignment of Assignor's Interest
May 23, 2012
From: PETERS, STEVEN
To: ISOLA LAMINATE SYSTEMS CORP.
Reel/Frame 028259/0249 →
Assignment of Assignor's Interest
Oct 16, 2012
From: PETERS, STEVEN
To: ISOLA LAMINATE SYSTEMS
Reel/Frame 029138/0702 →
Release of Security Interest
Dec 3, 2013
From: GOLDMAN SACHS LENDING PARTNERS LLC
To: ISOLA USA CORP.
Reel/Frame 031751/0828 →
Assignment of Security Agreement
May 16, 2017
From: JEFFERIES FINANCE LLC
To: CERBERUS BUSINESS FINANCE, LLC
Reel/Frame 042467/0299 →
Security Interest
Jan 2, 2018
From: ISOLA USA CORP.
To: CERBERUS BUSINESS FINANCE, LLC, AS COLLATERAL AGENT (FIRST LIEN)
Reel/Frame 044519/0030 →